The 3D stacking market size is expected to reach US$ 5.94 billion by 2031 from US$ 1.81 billion in 2023. The market is estimated to record a CAGR of 16.0% from 2023 to 2031. The adoption of fast processors for gaming purposes is likely to remain a key market trend.
Shorter interconnects within a 3D stacked configuration result in reduced power consumption and improved signal integrity, making it an attractive solution for energy-efficient and high-performance applications. The growing adoption of 3D stacking technology is a key factor contributing to the 3D stacking market growth. This technology allows for the stacking of dies on a substrate, creating chips in packages that are smaller and more energy-efficient. Additionally, 3D stacking technology facilitates the development of innovative, feature-rich products, particularly in the consumer electronics sector. The ability to stack memory and logic components vertically allows for the creation of more powerful and compact devices—which align with the market demand for sleek, high-performance gadgets.
3D stacking technology represents a transformative advancement in the field of semiconductor packaging, offering a paradigm shift in the way electronic components are integrated and interconnected. This cutting-edge technology involves vertically stacking multiple integrated circuit (IC) layers, typically using through-silicon vias (TSVs) to establish connections between the stacked layers. 3D stacking technology holds the potential to revolutionize product design and performance across various industries to achieve superior functionality in a more compact form factor. Furthermore, this technology empowers businesses to stay at the forefront of technological innovation, fostering a competitive position in the rapidly evolving landscape of electronic devices and semiconductor solutions. 3D stacking technology enables the efficient integration of disparate components, such as memory, logic, and sensors, into a single package, leading to enhanced performance and reduced footprint. This technology helps in providing streamlined manufacturing processes, optimized supply chain management, and cost savings.
The proliferating demand for sleek, feature-rich, and power-efficient gadgets such as smartphones, tablets, smartwatches, and portable devices has led to immense pressure on manufacturers to deliver compact, high-performance solutions. For instance, according to Omdia data published in February 2024, the preliminary shipment of smartphones was 328 million units in the fourth quarter of 2023. This represents 8.6% gain over 4Q22, establishing 4Q23 as the first quarter to show major growth since 2Q21. Consumers across the globe are highly adopting smartphones for shopping, communication, entertainment, and other purposes. These devices use 3D stacked die packaging, which is revolutionizing their designs and functionality. 3D stacked die packaging is capable of significantly reducing form factors without compromising performance. By vertically stacking multiple layers of integrated circuits, this technology allows for the smooth integration of diverse components within a compact space. This consolidation not only streamlines the design and assembly processes but also enables manufacturers to create thin, more aesthetically appealing devices that align with the evolving preferences of consumers.
High-bandwidth memory (HBM), which reaches extremely high density by stacking numerous dynamic random access memory (DRAMs) vertically, is distinguished by rapid data processing and low power consumption. It is essential in high-performance computing (HPC), such as generative AI, which requires processing enormous amounts of data at significantly fast speeds. Samsung Electronics 12-layer stacked HBM uses next-generation 3D stacking packaging technique to boost performance and yield. With a processing speed of 6.4Gbps and a bandwidth of 819 GB/s, HBM3 is 1.8 times faster than the previous-generation DRAM while using 10% less power. The demand for HBM in high-performance computing applications encourages market players to increase their production. For instance, in March 2024, SK HYNIX INC started volume production of HBM3E1, the newest AI memory product with ultra-high performance. HBM3E is designed for an AI system that processes a huge amount of data quickly. The high-bandwidth memory is used by various industries, including telecommunication, automotive, healthcare, and manufacturing, for high-speed data processing.
Key segments that contributed to the derivation of the 3D stacking market analysis are technology, device type, and end user.
The regional trends and factors influencing the 3D Stacking Market throughout the forecast period have been thoroughly explained by the analysts at Insight Partners. This section also discusses 3D Stacking Market segments and geography across North America, Europe, Asia Pacific, Middle East and Africa, and South and Central America.
Report Attribute | Details |
---|---|
Market size in 2023 | US$ 1.81 Million |
Market Size by 2031 | US$ 5.94 Million |
Global CAGR (2023 - 2031) | 16.0% |
Historical Data | 2021-2022 |
Forecast period | 2024-2031 |
Segments Covered |
By Interconnecting Technology
|
Regions and Countries Covered | North America
|
Market leaders and key company profiles |
The 3D Stacking Market market is growing rapidly, driven by increasing end-user demand due to factors such as evolving consumer preferences, technological advancements, and greater awareness of the product's benefits. As demand rises, businesses are expanding their offerings, innovating to meet consumer needs, and capitalizing on emerging trends, which further fuels market growth.
Market players density refers to the distribution of firms or companies operating within a particular market or industry. It indicates how many competitors (market players) are present in a given market space relative to its size or total market value.
Major Companies operating in the 3D Stacking Market are:
Disclaimer: The companies listed above are not ranked in any particular order.
The 3D stacking market is evaluated by gathering qualitative and quantitative data post primary and secondary research, which includes important corporate publications, association data, and databases. A few of the developments in the 3D stacking market are listed below:
The "3D Stacking Market Size and Forecast (2021–2031)" provides a detailed analysis of the market covering the areas mentioned below:
The List of Companies - 3D Stacking Market
The key players holding majority shares in the global 3D stacking market are Taiwan Semiconductor Manufacturing Company Limited, Intel Corp, Advanced Micro Devices, Broadcom Inc., NXP Semiconductors, ASE Technology, Texas Instruments Incorporated, MediaTek Inc., Amkor Technology, and Samsung Semiconductor, Inc.
Asia Pacific dominated the 3D stacking market in 2023.
The rising demand for consumer electronic is the major factors that propel the global 3D stacking market.
The global 3D stacking market is estimated to register a CAGR of 16.0% during the forecast period 2023–2031.
The global 3D stacking market is expected to reach US$ 5.94 billion by 2031.
Adotion of fast processors for gaming purposes to play a significant role in the global 3D stacking market in the coming years.