Asia Pacific Solder Materials Market Forecast to 2030 - COVID-19 Impact and Regional Analysis by Product (Wire, Paste, Bar, Flux, and Others), and Process (Screen-printing, Robotic, Laser, Wave/Reflow

The APAC solder materials market is expected to grow from US$ 685.79 Mn in 2019 to US$ 1073.52 Mn by 2030; it is estimated to grow at a CAGR of 4.2% from 2020 to 2030.

China. India, Australia, Japan, and South Korea are major economies in APAC. The availability of various solder products as well as its different uses is driving the APAC solder materials market. There are various types of products available for solder to use in different end-use industries, such as electrical & electronics, construction, bio-medical, and many others. These products include solder wire, solder ball, solder bar, solder paste, flux, and others. Solder wire is comprised of different types of alloys, or of pure tin. Each metal mainly requires a certain type of solder wire to create strong bonds, since the combinations of metals that comprise solder wire melt at different temperatures. The most common metals utilized in solder wire are Lead (Pb) as well as Tin (Sn). For electrical & electronics work, solder wire is available in the market with a range of thicknesses for hand-solder and with cores containing flux. Solder paste or solder cream is basically a materials used in the manufacturing of printed circuit boards for connecting surface mount components to pads on the board. The paste first adheres components in place by being sticky, it is further heated (with the rest of the board) and melting the paste & then form a mechanical bond along with an electrical connection. Solder bar is basically made up solely from high purity metal, which produces a low proportion of dross, and its suitable for dip and wave solder. The quality meets JIS-Z-3282. Solder bar is available with the specification in A grade, S grade, Anti-oxide bar, silver added bar, pure tin bar, and other lead-free solder bars. In an industrial context, the solder bar is hugely utilized in the electronic and electrical industry, which may be of the metal itself or alloy of metals at very low temperatures. Based on usage and percentage of components, there are two types of solder bar called lead-free solder bar and leaded solder bar. Sometimes these bars are called a soft solder bar and hard solder bar. In metallurgy, a flux is known as a chemical cleaning agent, purifying agent, and flowing agent. As for cleaning agents, fluxes mainly facilitate solder, welding, and brazing, by removing oxidation from the different metals to be joined. In an integrated circuit packaging, a solder ball, also called a solder bump, provides the contact between a chip package and a printed circuit board, along with between stacked packages in multichip modules. The chip-scale package, ball grid array, and flip-chip packages generally use solder balls. A solder preform is basically a solid, flat, and manufactured-shape of solder that can be utilized for a wide variety of assembly applications. Solder preforms mostly come in a wide variety of alloys. Solder preforms are widely used in industries ranging from stand-alone industrial applications, PCB Assembly, and high-end power semiconductor packages. As the COVID 19 pandemic continues to grow, it has hampered the solder materials market in APAC. The major countries in the APAC region are under lockdown. In many countries of APAC, where the newest strain of the coronavirus (COVID-19) has made an impact, isolation and social distancing measures have been put in place. The lesser production of goods and commodities is hampering the growth solder materials market as the demand for these solution has weekend over the past couple of months.

With the new features and technologies, vendors can attract new customers and expand their footprints in emerging markets. This factor is likely to drive the APAC solder materials market. The Asia Pacific solder materials market is expected to grow at a good CAGR during the forecast period.

APAC Solder Materials Market Revenue and Forecast to 2030 (US$ Mn)

APAC solder materials market Segmentation

APAC solder materials market, by Product

• Wire
• Paste
• Bar
• Flux
• Others

APAC solder materials market, by Process

• Screen-Printing
• Robotic
• Laser
• Wave/Reflow

APAC solder materials market – By Country

• Australia
• China
• India
• Japan
• South Korea
• Rest of APAC

Asia Pacific Solder Materials Report Scope

The List of Companies - Asia Pacific Solder Materials Market

1. Fusion Incorporated
2. Indium Corporation
3. Kester
4. KOKI Company Ltd
5. Lucas-Milhaupt, Inc.
6. Qualitek International, Inc.
7. Senju Metal Industry Co., Ltd
8. Stannol GmbH & Co. KG
9. Tamura Corporation
10. Nihon Genma

• Save and reduce time carrying out entry-level research by identifying the growth, size, leading players and segments in the APAC solder materials market.

• Highlights key business priorities in order to assist companies to realign their business strategies.

• The key findings and recommendations highlight crucial progressive industry trends in the APAC solder materials market, thereby allowing players across the value chain to develop effective long-term strategies.

• Develop/modify business expansion plans by using substantial growth offering developed and emerging markets.

• Scrutinize in-depth APAC market trends and outlook coupled with the factors driving the solder material market, as well as those hindering it.

• Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to client products, segmentation, pricing and distribution.