Power Module Packaging Market Size and Forecasts (2021 - 2031), Global and Regional Share, Trends, and Growth Opportunity Analysis Report Coverage: by Type (GaN Module, SiC Module, FET Module, IGBT Module, Thyristors); Industry Vertical (Information Technology, Consumer, Automatic, Industrial); Application (Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV), Motors, Rail Tractions, Wind Turbines, Photovoltaic Equipment) , and Geography (North America, Europe, Asia Pacific, and South and Central America)

MARKET INTRODUCTION

The power module packaging offers electrical, thermal management, interconnections, and mechanical support for the semiconductor devices. Additionally, it provides protection for the power module. The power modules packaging is done by different methodologies such as precision metal stamping, specialty plating, complex molding, and custom assembly. Moreover, power module packaging is not only beneficial to microelectronics, but to higher power modules as well.

MARKET DYNAMICS

The reduction in wastage of energy, usage of efficiently distributed cooling schemes, reduction in footprint, and consequential increase in power density are some of the major factors driving the growth of the power module packaging market. Moreover, the increasing technological advancement in the electronics industry is anticipated to create new opportunities for the power module packaging market.

MARKET SCOPE

The "Global Power Module Packaging Market Analysis to 2031" is a specialized and in-depth study of the Power module packaging market with a special focus on the global market trend analysis. The report aims to provide an overview of Power module packaging market with detailed market segmentation by type, industrial vertical, application. The global Power module packaging market is expected to witness high growth during the forecast period. The report provides key statistics on the market status of the leading Power module packaging market players and offers key trends and opportunities in the Power module packaging market.

MARKET SEGMENTATION

The global Power module packaging market is segmented on the basis of type, industrial vertical, application. On the basis of type, the market is segmented as GaN module, SiC module, FET module, IGBT module, thyristors. On the basis of industrial vertical, the market is segmented as IT, consumer, automatic, industrial. On the basis of application, the market is segmented as electric vehicles (EV)/hybrid electric vehicles (HEV), motors, rail tractions, wind turbines, photovoltaic equipment.

REGIONAL FRAMEWORK

The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides overview and forecast of the global Power module packaging market based on various segments. It also provides market size and forecast estimates from year 2021 to 2031 with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South America. The Power module packaging market by each region is later sub-segmented by respective countries and segments. The report covers analysis and forecast of 18 countries globally along with current trend and opportunities prevailing in the region.

The report analyzes factors affecting Power module packaging market from both demand and supply side and further evaluates market dynamics effecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, MEA and South America after evaluating political, economic, social and technological factors effecting the Power module packaging market in these regions.

MARKET PLAYERS

The reports cover key developments in the Power module packaging market as organic and inorganic growth strategies. Various companies are focusing on organic growth strategies such as product launches, product approvals and others such as patents and events. Inorganic growth strategies activities witnessed in the market were acquisitions, and partnership & collaborations. These activities have paved way for expansion of business and customer base of market players. The market players from Power module packaging market are anticipated to lucrative growth opportunities in the future with the rising demand for Power module packaging market. Below mentioned is the list of few companies engaged in the Power module packaging market.

The report also includes the profiles of key Power module packaging market companies along with their SWOT analysis and market strategies. In addition, the report focuses on leading industry players with information such as company profiles, components and services offered, financial information of last 3 years, key development in past five years.

•  ACI Technologies, Inc.
  
•  Danfoss
  
•  Fuji Electric Co., Ltd.
  
•  Infineon Technologies AG
  
•  Maxim Integrated
  
•  Microsemi
  
•  Mitsubishi Electric Corporation
  
•  SEMIKRON
  
•  Texas Instruments Incorporated
  
  

The Insight Partner's dedicated research and analysis team consist of experienced professionals with advanced statistical expertise and offer various customization options in the existing study.

Power Module Packaging Report Scope

The List of Companies

1. ACI Technologies, Inc.
2. Danfoss
3. Fuji Electric Co., Ltd.
4. Infineon Technologies AG
5. Maxim Integrated
6. Microsemi
7. Mitsubishi Electric Corporation
8. SEMIKRON
9. Texas Instruments Incorporated