The semiconductor industry is evolving with innovations in product offerings to support digitalization. The rising demand for IoT-based electronic devices to enhance connectivity is further propelling the market growth. The advent of smart solutions such as smart homes, factories, and cities has created a lucrative opportunity for the market players to develop new electronic devices, having IoT compatibility. The rising trend of miniaturization of electronics to optimize space and design is fulfilled with embedded die packaging technology. Companies prefer embedded die packaging technology for new electronic devices to enhance the performance with compactness. Advanced packaging technologies have the capacity to resolve the micro-chip performance requirements. The embedded die packaging technology offers a solution over technical challenges such as thermal management, power consumption, and product dimension. The embedded die packaging technology is gaining significant adoption from North America, Europe, and Asia. In contrast, remaining countries from the Middle East & Africa and South America region might turn into potential markets for embedded die packaging technology during the forecast period.
ASE GROUP; GENERAL ELECTRIC COMPANY; FUJIKURA LTD.; AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT; AND MICROSEMI CORPORATION – PROMINENT MARKET PARTICIPANTS IN EMBEDDED DIE PACKAGING TECHNOLOGY MARKET
ASE Group; General Electric Company; Fujikura Ltd.; AT & S Austria Technologie & Systemtechnik Aktiengesellschaft; and Microsemi Corporation are the five key market players operating in the embedded die packaging technology market ecosystem. Due to fragmented and evolving nature of embedded die packaging technology market ecosystem; presence of a large number of local and regional players; and involvement of players that belong to various stages of the ecosystem such as outsourced assembly and test companies (OSATs) and Integrated Device Manufacturers (IDMs), it is difficult to shortlist the top 5 players in the global market and hence, we have listed down above mentioned five players by considering following parameters: overall revenue, brand image & industry expertise, current advanced packaging and embedded die packaging portfolio and related products, research and development capabilities, patents, new product launches, partnerships, mergers & acquisitions and other market related activities.
There are various other notable players in the global embedded die packaging technology market ecosystem such as Infineon Technologies AG; Taiwan Semiconductor Manufacturing Company, Limited; Shinko Electric Industries Co., Ltd.; Schweizer Electronic AG; and Amkor Technology, Inc. which are profiled in this report. In addition to the ten players profiled in the report, there are several other global, regional, and local players operating in the global embedded die packaging technology ecosystem/value chain which were studied during the course of the study to get a holistic view of the entire market.
Most of the market initiatives were observed in North American and APAC region, which have a high potential of market-related products, solutions, and services. Few of the important market initiatives from the industry are mentioned below:
|
Year |
Development |
Region |
|
2020 |
Schweizer Electronic AG started new high-tech printed circuit board plant in Jiangsu, China. |
APAC |
|
2017 |
Amkor Technology, Inc acquired NANIUM S.A., a provider of wafer-level fan-out (WLFO) semiconductor packaging solutions. |
North America |
