Substrate-Like PCB Market
Electronics and Semiconductor

With CAGR of 17.8% , Substrate-Like PCB Market is projected to reach US$ 4,718.6 million by 2028.

Substrate-like PCBs (SLPs) are seen as the next step in the evolution of high-end high-density interconnector PCBs. The existing HDI PCB technology will be replaced by substrate-like PCB technology. It’s still a stiff PCB, but the manufacturing process is more closely aligned with semiconductor requirements. The Substrate-like PCB currently requires 30/30UM line width/line spacing, however, the production technique, raw materials, and design plan have yet to be defined.

AT&S, Unimicron, Compeq, Meiko and Zhen Ding Prominent Market Participants In Substrate-Like PCB Market

 The substrate-like PCB market is growing because of the increasing acceptance of substrate-like PCB in OEMs, smart consumer electronics, and wearable devices. The market for substrate-like PCBs is also growing due to the demand for downsizing and effective connectivity solutions. The current market is primarily reliant on the rise of high-end smartphones. According to industry analysts, there is a growing emphasis on shrinking electronic packaging to minimize power consumption and improve functionality. All of the miniaturized components must be organized in a small space, which is impossible to do on traditional printed circuit boards (PCBs). This constraint is driving the demand for substrate-like PCBs.

AT&S, Unimicron, Compeq, Meiko and Zhen Ding are some of the key market players operating in the global substrate-like PCB market. The listing of key players is derived by considering multiple factors such as overall revenue, current substrate-like PCB product portfolio, geographical reach, new product launches, market initiatives, investment in technology up-gradation, partnerships, and other market-related activities. In addition to these players, there are several other important players operating in the substrate-like PCB ecosystems which were studies analyzed during the course of this market research study, such as DAEDUCK ELECTRONICS Co., Ltd.; IBIDEN; KINSUS INTERCONNECT TECHNOLOGY CORP; Korea Circuit; SAMSUNG ELECTRO-MECHANICS; TTM Technologies Inc.;

Most of the market initiatives were observed in APAC region, which have a high potential of market-related products, solutions, and services. Few of the important market initiatives from the industry are mentioned below:

Year Development Region
2021  

Samsung Electro Mechanic Co. Ltd. announced that it would invest a total of US$ 850 million in the Vietnamese production plant by 2023 to build production facilities and infrastructure for semiconductor package substrates. (FCBGA). This is expected to enable the company to meet the rising demand for semiconductor substrates and lead the market in near future.
APAC
2020  

AT&S announced detailed project information on the company’s plan to invest in a state-of-the-art factory for IC substrates at the Kulim Hi-Tech Park, Kedah, Malaysia. This development is expected to strengthen the company’s position in the South East Asian market as a manufacturing hub in APAC.
APAC

 

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