Increasing Demand from Automotive and Telecommunication Industries Escalates Redistribution Layer Material Market Growth
According to our new research study on “Redistribution Layer Material Market Forecast to 2030 – COVID-19 Impact and Global Analysis – by Type and Application,” the redistribution layer material market size is expected to grow from US$ 192.39 million in 2022 to US$ 460.15 million by 2030; it is estimated to record a CAGR of 11.5% from 2022 to 2030. The report highlights key factors driving the redistribution layer material market growth and prominent players along with their developments in the market.
The advanced packaging process starts at the die level, where the objective is always to lessen the die sizes without compromising the input-output (I/O) density. Several other budding packaging technologies play a key role in the heterogeneous integration of devices. Wafer-level fan-out packaging (WLFO) is one of the key packaging technologies that has emerged as a comprehensive packaging process. The WLFO process earlier had only single-die designs, i.e., a single redistribution layer (RDL) on one side of a reconstituted wafer.
Global Redistribution Layer Material Market Breakdown – by Region
Redistribution Layer Material Market Size and Forecasts (2020 - 2030), Global and Regional Share, Trends, and Growth Opportunity Analysis Report Coverage: By Type [Polyimide (PI), Polybenzoxazole (PBO), Benzocylobutene (BCB), and Others] and Application {Fan-Out Wafer Level Packaging (FOWLP) and 2.5D/3D IC Packaging [High Bandwidth Memory (HBM), Multi-Chip Integration, Package on Package (FOPOP), and Others]}
Redistribution Layer Material Market Size, Growth & Analysis 2030
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The redistribution layer acts as a crucial step in the advanced wafer packaging. RDL serves as a rerouting of the I/O layout and allows a higher I/O number. A high I/O density usually creates better electrical performance, as more outputs result in faster electrical signals between the die and minimize the risk posed by electrical shorts. Besides, a higher I/O density enables the package to achieve better performance simultaneously. Moreover, the Asia's strategic location as a global manufacturing hub, coupled with competitive production costs, has attracted multinational corporations looking to optimize their supply chains. This has created a robust ecosystem for the redistribution layer material market, with various suppliers and manufacturers establishing a presence in the region.
SK Hynix Inc, Samsung Electronics Co Ltd, Infineon Technologies AG, Dupont De Nemours Inc, Fujifilm Holdings Corp, Amkor Technology Inc, ASE Technology Holding Co Ltd., NXP Semiconductors NV, JCET Group Co Ltd, and Shin-Etsu Chemical Co Ltd are among the key players operating in the global redistribution layer material market. Market players focus on providing high-quality products to fulfill customer demand. They also adopt strategies such as investments in research and development activities and launches of new products.
Impact of COVID-19 Pandemic on Redistribution Layer Material Market
The COVID-19 pandemic adversely affected economies and industries in various countries due to lockdowns, travel restrictions, and business shutdowns. The chemicals industry was severely affected by disruptions in supply chains and shutdowns of production plants in the initial phases of the pandemic. The crisis caused disruptions in the global supply chain due to factory shutdowns, transportation restrictions, and labor shortages. These upheavals hindered the availability of chemicals and packaging components, leading to potential supply chain delays and increased operating costs for redistribution layer material manufacturers. The COVID-19 pandemic has led to an increased demand for certain products, such as pharmaceuticals, healthcare supplies, and essential consumer goods.
The report includes the segmentation of the global redistribution layer material market as follows:
The global redistribution layer material market is divided on the basis of type and application. Based on type, the redistribution layer material market is segmented into polyimide (PI), polybenzoxazole (PBO), benzocylobutene (BCB), and others. Based on application, the redistribution layer material market is bifurcated into fan-out wafer level packaging (FOWLP) and 2.5D/3D IC packaging [high bandwidth memory (HBM), multi-chip integration, package on package (FOPOP), and others]. By geography, the global redistribution layer material market is broadly segmented into North America, Europe, Asia Pacific, the Middle East & Africa, and South & Central America. The North America redistribution layer material market is further segmented into the US, Canada, and Mexico. The market in Europe is subsegmented into Germany, France, the UK, Italy, Russia, and the Rest of Europe. The Asia Pacific redistribution layer material market is further segmented into China, India, Japan, Australia, South Korea, and the Rest of Asia Pacific. The Middle East & Africa market is further segmented into South Africa, Saudi Arabia, the UAE, and the Rest of Middle East & Africa. The South & Central America redistribution layer material market is further segmented into Brazil, Argentina, and the Rest of South & Central America.
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