Asia Pacific SiP Technology Market to Grow at a CAGR of 7.0% to reach US$ 9,881.8 Million from 2020 to 2027

The APAC SiP technology market is expected to grow from US$ 6,843.3 million in 2019 to US$ 9,881.8 million by 2027; it is estimated to grow at a CAGR of 7.0% from 2020 to 2027.

Australia, China, India, Japan, and South Korea are major economies in APAC. Growing need of smartphone and PC is going to enhance the performance and this is the major factor driving the APAC SiP technology market. The system in package technology has huge opportunity in the smartphone and PC market to offers advanced processors, transmitters and other components. Technology is improving the device performance as well as offering better space utilization solution. Few market players are developing the processors and other components using the system in packaging technology, while for others its great opportunity to innovate new solution for smartphone and PC processors. For instance, March, 2019, Asus, one of the leading smartphone brands in APAC market introduced new ZenFone Max Shot and ZenFone Max Plus M2 smartphones equipped with Qualcomm's new Snapdragon SiP1 chip. Similarly, in December, 2019, Qualcomm developed new arm-based processors for notebooks using the SE Technology’s system-in-package (SiP) services. Such development in the SiP offering in smartphone and PC applications clearly shows the potential opportunity for the market. Rising consumption of smartphones is major supporting factor for the SiP technology market for which market players needs to provide more focus. As according to the Ericsson, there are almost 4 billion mobile connections in APAC for year 2016, which are expected rise to 4.6 billion by 2021. Such increasing demand in APAC region only shows the potential for SiP technology in Smartphone industry.

The COVID-19 outbreak was first reported in China. China, India, South Korea, Japan, and other countries are increasingly moving toward the new networking solution such as 5G, 4G, and VoLTE. China and India are the biggest manufacturing hubs in the region and have increasing focus toward the industrialization. Lockdown, imposed due to COVID-19 outbreak, is hindering the market growth as businesses are remaining close. Manufacturing industry is also hampered, but soon its growth is expected to get recovered by enhancing the production capabilities in second half of the year 2021. The demand for many advanced electronics products such as smartwatch, smart wearable, and healthcare machines is rising at the significant rate. Companies in Asia are also restructuring their capabilities by adopting various strategies such as automation, partnership, and acquisition. For instance, Universal Scientific Industrial (Shanghai) Co., Ltd. acquired the Asteelflash Group to utilize their production facilities for increasing production of SiP modules and other electronics devices.

APAC SiP Technology Market Segmentation  

APAC SiP Technology Market – By Packaging Technology

• 2D IC
• 2.5D IC
• 3D IC

APAC SiP Technology Market – By Packaging Type

• Flip-Chip/Wire-Bond SiP
• Fan-Out SiP
• Embedded SiP

APAC SiP Technology Market – By Interconnection Technique

• Small Outline
• Flat Packages
• Pin Grid Arrays
• Surface Mount
• Others

APAC SiP Technology Market – By End-User Industry

• Automotive
• Aerospace and Defense
• Consumer Electronics
• Telecommunication
• Others

APAC SiP Technology Market, by Country

• Australia
• China
• India
• Japan
• South Korea
• Rest of APAC

APAC SiP Technology Market - Companies Mentioned

• Amkor Technology, Inc.
• ASE Technology Holding Co., Ltd.
• ChipMOS TECHNOLOGIES INC.
• JCET Group Co., Ltd.
• Qualcomm Technologies, Inc.
• Renesas Electronics Corporation
• Samsung
• Taiwan Semiconductor Manufacturing Company, Limited
• Texas Instruments Incorporated

Asia Pacific SiP Technology Report Scope