Embedded Subscriber Identity Module Market Size and Forecasts (2021 - 2031), Global and Regional Share, Trends, and Growth Opportunity Analysis

Coverage: Embedded Subscriber Identity Module Market covers analysis By Type (E-SIM Card, Chip); Application (Automotive, Consumer Electronics, Manufacturing, Telecommunication, Transportation and Logistics, Others) , and Geography (North America, Europe, Asia Pacific, and South and Central America)

  • Report Code : TIPRE00020756
  • Category : Electronics and Semiconductor
  • Status : Upcoming
  • No. of Pages : 150
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MARKET INTRODUCTION



eSIM helps its user to enable remote SIM provisioning of any mobile device. This specification is used in various applications such as of consumer electronics, home IoT applications, industrial (IIoT) applications like smart metering or in logistics. In the automotive industry, eSIMs helps to transform in-car experience and security for connected services. eSIM means SIM chips embedded in device instead of having a SIM card.

MARKET DYNAMICS



Increase in adoption of IoT technology, connected devices, rise in privacy and security concerns and growth in adoption of smart wearable devices are the significant factors that affect the growth of e-SIM market.

MARKET SCOPE



The "Embedded subscribe identity module Market Analysis to 2031" is a specialized and in-depth study of the food and beverage industry with a particular focus on the global market trend analysis. The report aims to provide an overview of the Embedded subscribe identity module market with detailed market segmentation by form and distribution channel. The Embedded subscribe identity module market is expected to witness high growth during the forecast period. The report provides key statistics on the market status of the leading Embedded subscribe identity module market players and offers key trends and opportunities in the market.

MARKET SEGMENTATION



The Embedded subscribe identity module market is segmented into type and application. By type, the Embedded subscribe identity module market is classified into e-sim card and chip. By application, the Embedded subscribe identity module market is classified into automotive, consumer electronics, manufacturing, telecommunication, transportation & logistics and others.

REGIONAL FRAMEWORK



The report provides a detailed overview of the industry, including both qualitative and quantitative information. It provides an overview and forecast of the Embedded subscribe identity module market based on various segments. It also provides market size and forecast estimates from the year 2021 to 2031 concerning five major regions, namely; North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA), and South America. The Embedded subscribe identity module market by each region is later sub-segmented by respective countries and segments. The report covers the analysis and forecast of 18 countries globally, along with the current trend and opportunities prevailing in the region.

The report analyzes factors affecting the Embedded subscribe identity module market from both demand and supply side. Further, it evaluates market dynamics affecting the market during the forecast period, i.e., drivers, restraints, opportunities, and future trends. The report also provides exhaustive PEST analysis for all five regions, namely; North America, Europe, APAC, MEA, and South America, after evaluating political, economic, social, and technological factors affecting the Embedded subscribe identity module market in these regions.

MARKET PLAYERS



The report covers vital developments in the Embedded subscribe identity module market as organic and inorganic growth strategies. Various companies are focusing on organic growth strategies such as product launches, product approvals, and others, such as patents and events. Inorganic growth strategies activities witnessed in the market were acquisitions and partnerships & collaborations. These activities have paved the way for the expansion of business and customer base of market players. The market payers from the Embedded subscribe identity module market are anticipated to lucrative growth opportunities in the future with the rising demand for Embedded subscribe identity module in the global market. Below mentioned is the list of few companies engaged in the Embedded subscribe identity module market.

The report also includes the profiles of key companies along with their SWOT analysis and market strategies in the Embedded subscribe identity module market. Besides, the report focuses on leading industry players with information such as company profiles, components, and services offered, financial information of the last three years, the critical development in the past five years.

  •  Deutsche Telekom AG
  •  Giesecke and Devrient GmbH
  •  IDEMIA
  •  Infineon Technologies AG
  •  NXP Semiconductors
  •  NTT DOCOMO
  •  Sierra Wireless
  •  STMicroelectronics
  •  Thales Group
  •  Vodafone Idea Limited

The Insight Partner's dedicated research and analysis team consists of experienced professionals with advanced statistical expertise and offers various customization options in the current study.

Embedded Subscriber Identity Module Report Scope

Report Attribute Details
Market size in 2023 US$ XX Million
Market Size by 2031 US$ XX Million
Global CAGR (2023 - 2031) XX%
Historical Data 2021-2022
Forecast period 2024-2031
Segments Covered By Type
  • E-SIM Card
  • Chip
By Application
  • Automotive
  • Consumer Electronics
  • Manufacturing
  • Telecommunication
  • Transportation and Logistics
Regions and Countries Covered North America
  • US
  • Canada
  • Mexico
Europe
  • UK
  • Germany
  • France
  • Russia
  • Italy
  • Rest of Europe
Asia-Pacific
  • China
  • India
  • Japan
  • Australia
  • Rest of Asia-Pacific
South and Central America
  • Brazil
  • Argentina
  • Rest of South and Central America
Middle East and Africa
  • South Africa
  • Saudi Arabia
  • UAE
  • Rest of Middle East and Africa
Market leaders and key company profiles
  • Deutsche Telekom AG
  • Giesecke and Devrient GmbH
  • IDEMIA
  • Infineon Technologies AG
  • NXP Semiconductors
  • NTT DOCOMO
  • Sierra Wireless
  • STMicroelectronics
  • Thales Group
    • Historical Analysis (2 Years), Base Year, Forecast (7 Years) with CAGR
    • PEST and SWOT Analysis
    • Market Size Value / Volume - Global, Regional, Country
    • Industry and Competitive Landscape
    • Excel Dataset
    Report Coverage

    Report Coverage

    Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends

    Segment Covered

    Segment Covered

    This text is related
    to segments covered.

    Regional Scope

    Regional Scope

    North America, Europe, Asia Pacific, Middle East & Africa, South & Central America

    Country Scope

    Country Scope

    This text is related
    to country scope.

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    The List of Companies

    1. Deutsche Telekom AG
    2. Giesecke and Devrient GmbH
    3. IDEMIA
    4. Infineon Technologies AG
    5. NXP Semiconductors
    6. NTT DOCOMO
    7. Sierra Wireless
    8. STMicroelectronics
    9. Thales Group
    10. Vodafone Idea Limited

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