The Europe substrate like PCB market is expected to reach US$ 173.4 million by 2028 from US$ 79.8 million in 2021. The market is estimated to grow at a CAGR of 11.7% from 2021–2028.
With the rising trends in technologies such as IoT, 5G, smart cars, it is required that the size of the PCB is miniaturized, and substrates become more powerful. To support these technological trends, the use of substrate-like PCB has increased. Smartphone manufacturers are miniaturizing the devices to make them portable and easier to handle. For instance, in May 2018, AT&S showcased various products at the 14th AT&S Technology Forum. One of them was mSAP (modified semi-additive process) technology through which the company can achieve highly miniaturized and precise PCB structures. However, the demand for the miniaturization of packages and the growth in IoT is driving the need for substrate-like PCB modules.
The member states of Europe such as Italy, Spain, and Germany have implemented drastic measures and travel restrictions to limit the spread of coronavirus among its citizens. European countries represent huge market opportunities for substrate-like PCB adoption and growth due to the high purchasing power of individual customers and boosting advanced technologies such as 5G and IoTs. However, due to COVID-19, the manufacturing of PCB devices has seen a sharp decline in European countries, and the automotive and other industries are under stress till Mid-2021. In addition to this, the disruptions in raw materials and electronic component supply from China will further aggravate the manufacturing industries in this region. All these factors are expected to have a direct negative impact on a substrate like PCB market growth in European countries.
With the new features and technologies, vendors can attract new customers and expand their footprints in emerging markets. This factor is likely to drive the substrate like PCB market. The Europe substrate like PCB market is expected to grow at a good CAGR during the forecast period.
Europe Substrate like PCB Market Revenue and Forecast to 2028 (US$ Million)
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- This FREE sample will include data analysis, ranging from market trends to estimates and forecasts.
Europe Substrate like PCB Market Segmentation
By Line/Space
By Line/Space
- 25/25 and 30/30 um
- Less than 25/25 um
By Inspection Technology
- Automated Optical Inspection
- Direct Imaging
- Automated Optical Shaping
By Application
- Consumer electronics
- Automotive
- Medical
- Industrial
- Others
By Country
- Europe
- Germany
- UK
- France
- Italy
- Russia
- Rest of Europe
Companies Mentioned
- Compaq Manufacturing Co., Ltd.
- Ibiden Co, Ltd.
- Kinsus Interconnect Technology
- SAMSUNG ELECTRO-MECHANICS CO, Ltd
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Zhen Ding Tech. Group Technology Holding Limited
- Korea Circuit
- Unimicron Technology Corp.
Europe Substrate like PCB Report Scope
Report Attribute | Details |
---|---|
Market size in 2021 | US$ 79.8 Million |
Market Size by 2028 | US$ 173.4 Million |
Global CAGR (2021 - 2028) | 11.7% |
Historical Data | 2019-2020 |
Forecast period | 2022-2028 |
Segments Covered |
By Line/Space
|
Regions and Countries Covered | Europe
|
Market leaders and key company profiles |
- Historical Analysis (2 Years), Base Year, Forecast (7 Years) with CAGR
- PEST and SWOT Analysis
- Market Size Value / Volume - Global, Regional, Country
- Industry and Competitive Landscape
- Excel Dataset
Report Coverage
Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends
Segment Covered
This text is related
to segments covered.
Regional Scope
North America, Europe, Asia Pacific, Middle East & Africa, South & Central America
Country Scope
This text is related
to country scope.
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- Compaq Manufacturing Co., Ltd.
- Ibiden Co, Ltd.
- Kinsus Interconnect Technology
- SAMSUNG ELECTRO-MECHANICS CO, Ltd
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Zhen Ding Tech. Group Technology Holding Limited
- Korea Circuit
- Unimicron Technology Corp.