Fabless IC Market Growth Drivers, Trends, and Forecast by 2031

Historic Data: 2021-2023   |   Base Year: 2024   |   Forecast Period: 2025-2031

Coverage: Fabless IC Market covers analysis by Application (Memory, Consumer Electronics, Automotive, Industrial Electronics, Wired Communications, Wireless Communications, FPGA, and Storage/Printer), and Geography (North America, Europe, Asia Pacific, and South and Central America)

  • Report Code : TIPEL00002150
  • Category : Electronics and Semiconductor
  • Status : Upcoming
  • No. of Pages : 150
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Fabless ICs are similar to standard ICs and provide similar functionalities. Fabless chip manufacturers are companies that manufacture semiconductors for usage in several types of electronics like digital smartphones, cameras, and the newer technologically advanced smart cars. The word "fabless" means the manufacturer does not produce the silicon chips, or wafers that are utilized in its products, instead, it outsources the production work to a manufacturing plant, or foundry. The fabless ICs are widely used in memory, automotive, industrial electronics, FPGA, storage/printer, and many others.

Rising demands for low cost, highly reliable, and higher performance based ICs, increasing penetration of ICs in automotive sector are the major drivers propelling the growth of the market. Moreover, growth of ICs in drones, VR devices, and robotics is further expected to provide significant opportunities for the market growth in the coming years. However, high complexity in designing these ICs hinders the fabless IC market growth.

The "Global Fabless IC Market Analysis to 2031" is a specialized and in-depth study of the fabless IC market with a focus on the global market trend. The report aims to provide an overview of global fabless IC market with detailed market segmentation by application and geography. The global fabless IC market is expected to witness high growth during the forecast period. The report provides key statistics on the market status of the leading market players and offers key trends and opportunities in the fabless IC market.

The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides overview and forecast of the global fabless IC market based on application. It also provides market size and forecast till 2031 for overall fabless IC market with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South America (SAM). The market by each region is later sub-segmented by respective countries and segments. The report covers analysis and forecast of 16 countries globally along with current trend and opportunities prevailing in the region.

Besides this, the report analyzes factors affecting market from both demand and supply side and further evaluates market dynamics effecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, MEA and South America after evaluating political, economic, social and technological factors affecting the market in these regions.

Also, key fabless IC market players influencing the market are profiled in the study along with their SWOT analysis and market strategies. The report also focuses on leading industry players with information such as company profiles, products and services offered, financial information of last 3 years, key development in past five years. Some of the key players influencing the fabless IC market are Qualcomm, Broadcom Ltd., NVIDIA Corporation, MediaTek Inc., Advanced Micro Devices, Inc., HiSilicon Technologies Co., Ltd., XILINX INC., Marvell, UniGroup, Inc., and Integrated Silicon Solution Inc. among others.

Fabless IC Report Scope

Report Attribute Details
Market size in 2024 US$ XX million
Market Size by 2031 US$ XX Million
Global CAGR (2025 - 2031) XX%
Historical Data 2021-2023
Forecast period 2025-2031
Segments Covered By Application
  • Memory
  • Consumer Electronics
  • Automotive
  • Industrial Electronics
  • Wired Communications
  • Wireless Communications
  • FPGA
  • Storage/Printer
Regions and Countries Covered North America
  • US
  • Canada
  • Mexico
Europe
  • UK
  • Germany
  • France
  • Russia
  • Italy
  • Rest of Europe
Asia-Pacific
  • China
  • India
  • Japan
  • Australia
  • Rest of Asia-Pacific
South and Central America
  • Brazil
  • Argentina
  • Rest of South and Central America
Middle East and Africa
  • South Africa
  • Saudi Arabia
  • UAE
  • Rest of Middle East and Africa
Market leaders and key company profiles
  • Qualcomm
  • Broadcom Ltd.
  • NVIDIA Corporation
  • MediaTek Inc.
  • Advanced Micro Devices, Inc
  • HiSilicon Technologies Co., Ltd.
  • XILINX INC.
  • Marvell
  • UniGroup, Inc.
    • Historical Analysis (2 Years), Base Year, Forecast (7 Years) with CAGR
    • PEST and SWOT Analysis
    • Market Size Value / Volume - Global, Regional, Country
    • Industry and Competitive Landscape
    • Excel Dataset
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    Report Coverage

    Report Coverage

    Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends

    Segment Covered

    Segment Covered

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    to segments covered.

    Regional Scope

    Regional Scope

    North America, Europe, Asia Pacific, Middle East & Africa, South & Central America

    Country Scope

    Country Scope

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    to country scope.

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    The List of Companies

    1. Qualcomm
    2. Broadcom Ltd.
    3. NVIDIA Corporation
    4. MediaTek Inc.
    5. Advanced Micro Devices, Inc
    6. HiSilicon Technologies Co., Ltd.
    7. XILINX INC.
    8. Marvell
    9. UniGroup, Inc.
    10. Integrated Silicon Solution Inc.
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