The North America solder materials market is expected to grow from US$ 341.90 Mn in 2019 to US$ 527.74 Mn by 2030; it is estimated to grow at a CAGR of 4.1% from 2020 to 2030.
US, Canada and Mexico are major economies in North America. Various products being available for use is driving the North America solder materials market. There are various types of products available for solder to use in different end-use industries, such as electrical & electronics, construction, bio-medical, and many others. These products include solder wire, solder ball, solder bar, solder paste, flux, and others. Solder wire is comprised of different types of alloys, or of pure tin. Each metal mainly requires a certain type of solder wire to create strong bonds, since the combinations of metals that comprise solder wire melt at different temperatures. The most common metals utilized in solder wire are Lead (Pb) as well as Tin (Sn). For electrical & electronics work, solder wire is available in the market with a range of thicknesses for hand-solder and with cores containing flux. Solder paste or solder cream is basically a materials used in the manufacturing of printed circuit boards for connecting surface mount components to pads on the board. The paste first adheres components in place by being sticky, it is further heated (with the rest of the board) and melting the paste & then form a mechanical bond along with an electrical connection. Solder bar is basically made up solely from high purity metal, which produces a low proportion of dross, and its suitable for dip and wave solder. The quality meets JIS-Z-3282. Solder bar is available with the specification in A grade, S grade, Anti-oxide bar, silver added bar, pure tin bar, and other lead-free solder bars. In an industrial context, the solder bar is hugely utilized in the electronic and electrical industry, which may be of the metal itself or alloy of metals at very low temperatures. Based on usage and percentage of components, there are two types of solder bar called lead-free solder bar and leaded solder bar. Sometimes these bars are called a soft solder bar and hard solder bar. In metallurgy, a flux is known as a chemical cleaning agent, purifying agent, and flowing agent. As for cleaning agents, fluxes mainly facilitate solder, welding, and brazing, by removing oxidation from the different metals to be joined. In an integrated circuit packaging, a solder ball, also called a solder bump, provides the contact between a chip package and a printed circuit board, along with between stacked packages in multichip modules. The chip-scale package, ball grid array, and flip-chip packages generally use solder balls. A solder preform is basically a solid, flat, and manufactured-shape of solder that can be utilized for a wide variety of assembly applications. Solder preforms mostly come in a wide variety of alloys. Solder preforms are widely used in industries ranging from stand-alone industrial applications, PCB Assembly, and high-end power semiconductor packages. As the COVID 19 pandemic continues to grow, it has hampered the solder materials market in North America. The major countries in the North America region are under lockdown. In many countries of North America, where the newest strain of the coronavirus (COVID-19) has made an impact, isolation and social distancing measures have been put in place. The lesser production of goods and commodities is hampering the growth solder materials market as the demand for these solution has weekend over the past couple of months. With the new features and technologies, vendors can attract new customers and expand their footprints in emerging markets. This factor is likely to drive the North America solder materials market. The North America solder materials market is expected to grow at a good CAGR during the forecast period.
North America Solder Materials Market Revenue and Forecast to 2030 (US$ Mn)
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- This FREE sample will include data analysis, ranging from market trends to estimates and forecasts.
North America solder materials market Segmentation
North America solder materials market, by Product
- Wire
- Paste
- Bar
- Flux
- Others
North America solder materials market, by Process
- Screen-Printing
- Robotic
- Laser
- Wave/Reflow
North America solder materials market – By Country
- US
- Canada
- Mexico
North America Solder Materials Report Scope
Report Attribute | Details |
---|---|
Market size in 2019 | US$ 341.90 Million |
Market Size by 2030 | US$ 527.74 Million |
Global CAGR (2020 - 2030) | 4.1% |
Historical Data | 2017-2018 |
Forecast period | 2020-2030 |
Segments Covered |
By Product
|
Regions and Countries Covered | North America
|
Market leaders and key company profiles |
- Historical Analysis (2 Years), Base Year, Forecast (7 Years) with CAGR
- PEST and SWOT Analysis
- Market Size Value / Volume - Global, Regional, Country
- Industry and Competitive Landscape
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Report Coverage
Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends
Segment Covered
Product, and Process (Screen-printing, Robotic, Laser, Wave/Reflow
Regional Scope
North America, Europe, Asia Pacific, Middle East & Africa, South & Central America
Country Scope
US, Canada
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The List of Companies - North America Solder Materials Market
- Fusion Incorporated
- Indium Corporation
- Kester
- KOKI Company Ltd
- Lucas-Milhaupt, Inc.
- Qualitek International, Inc.
- Senju Metal Industry Co., Ltd
- Stannol GmbH & Co. KG
- Tamura Corporation