Consumer Electronics Segment to Dominate APAC SiP technology Market during 2019–2027
According to The Insight Partners market research study on “APAC SiP technology Market to 2027 – COVID-19 Impact and Regional Analysis and Forecast by Packaging Technology, Packaging Type, Interconnection technique, and End-User Industry” is expected to reach US$ 9,881.8 million by 2027 from US$ 6,843.3 million in 2019. The market is estimated to grow at a CAGR of 7.0% from 2020 to 2027. The report provides trends prevailing in the APAC SiP technology market along with the drivers and restraints pertaining to the market growth. Growing need of smartphone and PC to enhance the performance and this is the major factor driving the growth of the APAC SiP technology market. However, technical problems and presence of substitutes hinders the growth of APAC SiP technology market.
The APAC SiP technology market has been segmented into by packaging technology, packaging type, interconnection technique, and end-user industry. Based on packaging technology, the APAC SiP technology market is segmented into 2D IC, 2.5D IC, and 3D IC. 2D IC segment held the largest market share in 2019. Based on packaging type, the APAC SiP technology market is segmented into flip-chip/wire-bond SiP, fan-out SiP and embedded SiP. Flip-chip/wire-bond SiP segment held a substantial market share in 2019. Based on interconnection technique, the APAC SiP technology market is categorized into small outline, flat packages, pin grid arrays, surface mount, and others. Pin grid arrays held the largest share during the forecast period. Based on end-user industry, the APAC SiP technology market is segmented into automotive, aerospace and defense, consumer electronics, telecommunication, and others. Consumer electronics held the largest market share throughout the forecast period.
The COVID-19 outbreak was first reported in China. China, India, South Korea, Japan, and other countries are increasingly moving toward the new networking solution such as 5G, 4G, and VoLTE. China and India are the biggest manufacturing hubs in the region and have increasing focus toward the industrialization. Lockdown, imposed due to COVID-19 outbreak, is hindering the market growth as businesses are remaining close. Manufacturing industry is also hampered, but soon its growth is expected to get recovered by enhancing the production capabilities in second half of the year 2021. The demand for many advanced electronics products such as smartwatch, smart wearable, and healthcare machines is rising at the significant rate. Companies in Asia are also restructuring their capabilities by adopting various strategies such as automation, partnership, and acquisition. For instance, Universal Scientific Industrial (Shanghai) Co., Ltd. acquired the Asteelflash Group to utilize their production facilities for increasing production of SiP modules and other electronics devices.
Amkor Technology, Inc.; ASE Technology Holding Co., Ltd.; ChipMOS TECHNOLOGIES INC.; JCET Group Co., Ltd.; Qualcomm Technologies, Inc.; Renesas Electronics Corporation; Samsung; Taiwan Semiconductor Manufacturing Company, Limited; and Texas Instruments Incorporated are among the leading companies in the APAC SiP technology market. The companies are focused on adopting organic growth strategies such as product launches and expansions to sustain their position in the dynamic market. For instance, in 2020, JCET Group Co., Ltd acquired Analog Devices Inc.’s test facility in Singapore.
The report segments the APAC SiP Technology Market follows:
APAC SiP Technology Market – By Packaging Technology
- 2D IC
- 2.5D IC
- 3D IC
APAC SiP Technology Market – By Packaging Type
- Flip-Chip/Wire-Bond SiP
- Fan-Out SiP
- Embedded SiP
APAC SiP Technology Market – By Interconnection technique
- Small Outline
- Flat Packages
- Pin Grid Arrays
- Surface Mount
- Others
APAC SiP Technology Market – By End-User Industry
- Automotive
- Aerospace and Defense
- Consumer Electronics
- Telecommunication
- Others
APAC SiP Technology Market – By Country
- Australia
- China
- India
- Japan
- South Korea
- Rest of APAC
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