US Semiconductor Assembly and Testing Services Market is expected to reach US$ 15,798.4 million by 2028

Assembly and Packaging Services to Dominate the US Semiconductor Assembly and Testing Services Market during 2021–2028

According to The Insight Partners market research study on “US Semiconductor Assembly and Testing Services Market Forecast to 2028 – COVID-19 Impact and Analysis – by Service (Assembly and Packaging Services, and Testing Services) and Application (Consumer Electronics, Automotive, Medical, Space, Military, and Others),” the market is expected to reach US$ 15,798.4 million by 2028 from US$ 10,723.0 million in 2021; it is estimated to grow at a CAGR of 5.7% from 2021 to 2028. The report provides trends prevailing in the market along with the drivers and restraints pertaining to the market growth.

Assembly and packaging were considered a fairly non-critical part of the design; however, at present, it is an essential and a significant part of semiconductor manufacturing and design. It affects power, performance, and cost on a macro level, and the basic functionality of all chips on a micro level. Assembly and packaging take a wafer with completed, unseparated chips, and turns it into separate, packaged chips. The package is the container that holds the semiconductor die. The package protects the die, connects the chip to a board or other chips, and may dissipate heat. Assembly and packaging products are available in different materials; it can be standard or custom and can have active or passive cooling. Electronic packaging provides the interconnection from the IC to the printed circuit board (PCB). Another function is to provide the desired mechanical and environmental protection to ensure reliability and performance.

The fundamental package assembly processes for hermetic and leadframe packaging and has remained relatively unchanged over the past 30 years, but the materials and equipment have undergone considerable development. Assembly equipment is no longer as labor intensive, and processing is typically carried out on automated equipment designed and manufactured for high-volume production. Materials are of higher purity and have properties tailored for a specific application. Many types of packages are in use today, and most of them are either in research at universities or ready for production — everything from complex stacked die with through-silicon via to fan-outs and complex systems on chip. Although foundries are expanding their packaging efforts, the packaging may be done by the outsourced assembly and test (OSAT). As complexity and profitability increases, there is an intense competition between foundries and OSATs to grab a larger share of this market.

Amkor Technology, ASE Group, Unisem Group, DPA Components International (DPACI), GlobalFoundries U.S. Inc.; Golden Altos Corporation, Grinding & Dicing Services, Inc.; Micross, Precision Test Solutions, Promex Industries Inc.; and SkyWater Technology are among the leading companies operating in the US semiconductor assembly and testing services market. These players are focused on adopting organic growth strategies such as product launches and expansions to sustain their position in the market.

US Semiconductor Assembly and Testing Services Market Breakdown, by Service, 2020 and 2028

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US Semiconductor Assembly and Testing Services Market to Grow at a CAGR of 5.7% to reach US$ 15,798.4 million from 2021 to 2028

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US Semiconductor Assembly and Testing Services Market Forecast to 2028 - COVID-19 Impact and Country Analysis By Service (Assembly and Packaging Services and Testing Services) and Application (Consumer Electronics, Automotive, Medical, Space, Military, and Others)

The report segments the US Semiconductor Assembly and Testing Services Market as follows:

By Service

• Assembly and Packaging Services
• Testing Services

By Application

• Consumer Electronics
• Automotive
• Medical
• Space
• Military
• Other Applications