Embedded Die Packaging Technology Market Dynamics and Analysis by 2031
The embedded die packaging technology market is projected to reach US$ 337.60 million by 2031 from US$ 74.67 million in 2023. The market is expected to register a CAGR of 20.3% during 2023–2031. The growing demand for the miniaturization of electronic devices and rising developments in embedded die packaging technology are likely to be the key drivers and trends of the market.
Embedded Die Packaging Technology Market Analysis
The embedded die packaging technology market is experiencing significant growth globally. This growing demand for the miniaturization of electronic devices and rising developments in embedded die packaging technology. Moreover, the increasing demand to enhance smartphone and automotive device performance and rapid growth in wearable devices and the Internet of things are among other factors bolstering the growth of the trade promotion management software market.
Embedded Die Packaging Technology Market Overview
Embedded die packaging is different than most package types. Generally, in many IC packages, the devices are situated on top of a substrate. The substrate serves as the bridge between the devices and a board in a system.
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Embedded Die Packaging Technology Market: Strategic Insights
Market Size Value in US$ 63.40 Million in 2020 Market Size Value by US$ 242.80 Million by 2028 Growth rate CAGR of 18.6% from 2021-2028 Forecast Period 2021-2028 Base Year 2021
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Embedded Die Packaging Technology Market: Strategic Insights
| Market Size Value in | US$ 63.40 Million in 2020 |
| Market Size Value by | US$ 242.80 Million by 2028 |
| Growth rate | CAGR of 18.6% from 2021-2028 |
| Forecast Period | 2021-2028 |
| Base Year | 2021 |
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Embedded Die Packaging Technology Market Drivers and Opportunities
Growing Demand for Miniaturization of Electronic Devices to Favor Market
Growing demand for miniaturization of electronic devices is indeed driving the market. Miniaturization in electronic devices involves fitting more transistor nodes on a smaller integrated circuit (IC). The IC is then interfaced within its intended system or device so that, once assembled, the system can carry out the desired function. The technology is made tinier yet mightier. Further, by embedding the die within the substrate, the overall footprint of the electronic package is significantly reduced. This is particularly advantageous for applications where space is at a premium, such as in mobile devices, wearables, and medical implants.
Rapid Growth in Wearable Devices and the Internet of Things.
The rapid growth in wearable devices and the Internet of Things is anticipated to hold several opportunities for the embedded die packaging technology market in the coming years. Wearable devices are poised to join the lines between the physical and digital worlds. Augmented reality glasses will overlay information onto an individual's surroundings, providing real-time navigation, translation assistance, and even personalized tours of the city. Embedded die packaging technology helps wearable devices in many IC packages. The devices are situated on top of a substrate.
Embedded Die Packaging Technology Market Report Segmentation Analysis
Key segments that contributed to the derivation of the embedded die packaging technology market analysis are platform, application, and industry.
- Based on the platform, the embedded die packaging technology market is divided into IC package substrate, rigid board, and flexible board. The IC package substrate segment is anticipated to hold a significant market share in the forecast period.
- Based on application, the embedded die packaging technology market is divided into smartphones and tablets, medical and wearable devices, industrial devices, security devices, and other applications. The smartphones and tablets segment is anticipated to hold a significant market share in the forecast period.
- By industry, the market is segmented into consumer electronics, IT and telecommunication, automotive, healthcare, and other industries. The aerospace & defense is anticipated to hold a significant market share in the forecast period.
Embedded Die Packaging Technology Market Share Analysis by Geography
The geographic scope of the embedded die packaging technology market report is mainly divided into five regions: North America, Asia Pacific, Europe, Middle East & Africa, and South & Central America.
North America has dominated the embedded die packaging technology market. High technology adoption trends in various industries in the North American region have fuelled the growth of the embedded die packaging technology market. Factors such as increased adoption of digital tools, high technological spending by government agencies, the growing demand for the miniaturization of electronic devices, and rising developments in embedded die packaging technology are expected to drive the North American embedded die packaging technology market growth. Moreover, a strong emphasis on research and development in the developed economies of the US and Canada is forcing the North American players to bring technologically advanced solutions into the market. In addition, the US has a large number of embedded die packaging technology market players who have been increasingly focusing on developing innovative solutions. All these factors contribute to the region's growth of the embedded die packaging technology market.
Embedded Die Packaging Technology Market Report Scope
Embedded Die Packaging Technology Market News and Recent Developments
The embedded die packaging technology market is evaluated by gathering qualitative and quantitative data post primary and secondary research, which includes important corporate publications, association data, and databases. A few of the developments in the embedded die packaging technology market are listed below:
- ASE promotes embedded die packaging for automotive electronics. Backend house ASE Technology will have its in-house developed embedded die technology, dubbed "Advanced Embedded Active System Integration (ASI), mainly applied to process automotive electronic modules (Source: ASE Company Website, May 2024)
Embedded Die Packaging Technology Market Report Coverage and Deliverables
The “ Embedded Die Packaging Technology Market Size and Forecast (2021–2031)” report provides a detailed analysis of the market covering below areas:
- Embedded die packaging technology market size and forecast at global, regional, and country levels for all the key market segments covered under the scope.
- Embedded die packaging technology market trends as well as market dynamics such as drivers, restraints, and key opportunities.
- Detailed PEST/Porter’s Five Forces and SWOT analysis.
- Embedded die packaging technology market analysis covering key market trends, global and regional framework, major players, regulations, and recent market developments.
- Industry landscape and competition analysis covering market concentration, heat map analysis, prominent players, and recent developments in the embedded die packaging technology market.
- Detailed company profiles.
Report Coverage
Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends
Segment Covered
Platform , Application , and Industry , Geography
Regional Scope
North America, Europe, Asia Pacific, Middle East & Africa, South & Central America
Country Scope
Australia, Canada, China, France, Germany, India, Italy, Japan, MEA, Mexico, Russian Federation, SAM, South Korea, United Kingdom, United States
Frequently Asked Questions
The expected CAGR of the embedded die packaging technology market is 20.8%.
The global embedded die packaging technology market is expected to reach US$ 337.60 million by 2031.
The rapid growth in wearable devices and the Internet of Things is anticipated to drive the market in the forecast period.
The key players holding majority shares in the global embedded die packaging technology market are Amkor Technology, Inc., ASE Group, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Fujikura Ltd., General Electric Company, INANE-ON TECHNOLOGIES AG, Microsemi, SCHWEIZER ELECTRONIC AG, SHINKO ELECTRIC INDUSTRIES CO.; LTD, Taiwan Semiconductor Manufacturing Company, Limited.
The growing demand for the miniaturization of electronic devices and rising developments in embedded die packaging technology are some of the factors driving the embedded die packaging technology market.
North America is anticipated to dominate the embedded die packaging technology market in 2023.
The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.
- Data Collection and Secondary Research:
As a market research and consulting firm operating from a decade, we have published many reports and advised several clients across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.
Several associations trade associates, technical forums, institutes, societies and organizations are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in the last 3 years are scrutinized and analyzed to understand the current market trends.
- Primary Research:
The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.
For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/Sales Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.
A typical research interview fulfils the following functions:
- Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
- Validates and strengthens in-house secondary research findings
- Develops the analysis team’s expertise and market understanding
Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:
- Industry participants: VPs, business development managers, market intelligence managers and national sales managers
- Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.
Below is the breakup of our primary respondents by company, designation, and region:
Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.
- Data Analysis:
Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.
- 3.1 Macro-Economic Factor Analysis:
We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.
- 3.2 Country Level Data:
Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.
- 3.3 Company Profile:
The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.
- 3.4 Developing Base Number:
Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.
- Data Triangulation and Final Review:
The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.
We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.
We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.
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