Flip Chip Packaging Market Size and Forecasts (2021 - 2031), Global and Regional Share, Trends, and Growth Opportunity Analysis
The "Global Flip Chip Packages Market Analysis to 2028" is a specialized and in-depth study of the flip chip packages industry with a focus on the global market trend. The report aims to provide an overview of the global flip chip packages market with detailed market segmentation by bumping technology, end user, and geography. The global flip chip packages market is expected to witness high growth during the forecast period. The report provides key statistics on the market status of the leading market players and offers key trends and opportunities in the flip chip packages market.
The report provides a detailed overview of the flip chip packages industry including both qualitative and quantitative information. It provides overview and forecast of the global flip chip packages market based on bumping technology and end user. It also provides market size and forecast till 2028 for overall flip chip packages market with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South America (SAM). The market by each region is later sub-segmented by respective countries and segments. The report covers analysis and forecast of 16 countries globally along with current trend and opportunities prevailing in the region.
Besides this, the report analyzes factors affecting flip chip packages market from both demand and supply side and further evaluates market dynamics effecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis.
Also, key market players influencing the flip chip packages market are profiled in the study along with their SWOT analysis and market strategies. The report also focuses on leading industry players with information such as company profiles, products and services offered, financial information of last 3 years, key development in past five years. Some of the key players influencing the flip chip packages market are Intel Corporation, Chipbond Technology, Taiwan Semiconductor Manufacturing Company, Advanced Semiconductor Engineering, Siliconware Precision Industries, Texas Instruments, Inc., Samsung Electronics Co. LTD., Powertech Technology, IBM Corporation, and Amkor Technology Inc. among others. REGIONAL FRAMEWORK
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- Request discounts available for Start-Ups & Universities
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Report Coverage
Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends
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Segment Covered
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Regional Scope
North America, Europe, Asia Pacific, Middle East & Africa, South & Central America
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Country Scope
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1. INTRODUCTION
1.1. THE INSIGHT PARTNERS RESEARCH REPORT GUIDANCE
2. KEY TAKEAWAYS
3. FLIP CHIP PACKAGES MARKET LANDSCAPE
3.1. OVERVIEW
3.2. MARKET SEGMENTATION
3.2.1. Flip chip packages Market - By Bumping Technology
3.2.2. Flip chip packages Market - By End User
3.2.3. Flip chip packages Market - By Region
3.2.3.1. By Country
3.3. PEST ANALYSIS
3.3.1. North America - PEST Analysis
3.3.2. Europe - PEST Analysis
3.3.3. Asia Pacific (APAC) - PEST Analysis
3.3.4. Middle East & Africa (MEA) - PEST Analysis
3.3.5. South America (SAM)- PEST Analysis
4. FLIP CHIP PACKAGES MARKET - KEY INDUSTRY DYNAMICS
4.1. KEY MARKET DRIVERS
4.2. KEY MARKET RESTRAINTS
4.3. KEY MARKET OPPORTUNITIES
4.4. FUTURE TRENDS
4.5. IMPACT ANALYSIS OF DRIVERS, RESTRAINTS & EXPECTED INFLUENCE OF COVID-19 PANDEMIC
5. FLIP CHIP PACKAGES MARKET - GLOBAL MARKET ANALYSIS
5.1. FLIP CHIP PACKAGES - GLOBAL MARKET OVERVIEW
5.2. FLIP CHIP PACKAGES - GLOBAL MARKET AND FORECAST TO 2028
6. FLIP CHIP PACKAGES MARKET REVENUE AND FORECASTS TO 2028 - BUMPING TECHNOLOGY
6.1. OVERVIEW
6.2. BUMPING TECHNOLOGY MARKET FORECASTS AND ANALYSIS
6.3. GOLD BUMPING
6.3.1. Overview
6.3.2. Gold Bumping Market Forecast and Analysis
6.4. SOLDER BUMPING
6.4.1. Overview
6.4.2. Solder Bumping Market Forecast and Analysis
6.5. COPPER PILLAR BUMPING
6.5.1. Overview
6.5.2. Copper Pillar Bumping Market Forecast and Analysis
7. FLIP CHIP PACKAGES MARKET REVENUE AND FORECASTS TO 2028 - END USER
7.1. OVERVIEW
7.2. END USER MARKET FORECASTS AND ANALYSIS
7.3. COMPUTING & NETWORKING
7.3.1. Overview
7.3.2. Computing & Networking Analysis Market Forecast and Analysis
7.4. COMMUNICATION
7.4.1. Overview
7.4.2. Communication Market Forecast and Analysis
7.5. AUTOMOTIVE
7.5.1. Overview
7.5.2. Automotive Market Forecast and Analysis
7.6. INDUSTRIAL
7.6.1. Overview
7.6.2. Industrial Market Forecast and Analysis
7.7. OTHERS
7.7.1. Overview
7.7.2. Others Market Forecast and Analysis
8. FLIP CHIP PACKAGES MARKET REVENUE AND FORECASTS TO 2028 - GEOGRAPHICAL ANALYSIS
8.1. NORTH AMERICA
8.1.1. North America Flip chip packages Market Overview
8.1.2. North America Flip chip packages Market Forecasts and Analysis
8.1.3. North America Market Forecasts and Analysis - By Countries
8.1.3.1. US market
8.1.3.2. Canada market
8.1.3.3. Mexico market
8.1.4. North America Market Forecasts and Analysis - By Bumping Technology
8.1.5. North America Market Forecasts and Analysis - By End Users
8.1.6. North America Market Forecasts and Analysis - By Industry Vertical
8.2. EUROPE
8.2.1. Europe Flip chip packages Market Overview
8.2.2. Europe Flip chip packages Market Forecasts and Analysis
8.2.3. Europe Market Forecasts and Analysis - By Countries
8.2.3.1. France market
8.2.3.2. Germany market
8.2.3.3. Italy market
8.2.3.4. Spain market
8.2.3.5. UK market
8.2.4. Europe Market Forecasts and Analysis - By Bumping Technology
8.2.5. Europe Market Forecasts and Analysis - By End Users
8.2.6. Europe Market Forecasts and Analysis - By Industry Vertical
8.3. ASIA PACIFIC (APAC)
8.3.1. Asia Pacific Flip chip packages Market Overview
8.3.2. Asia Pacific Flip chip packages Market Forecasts and Analysis
8.3.3. Asia Pacific Market Forecasts and Analysis - By Countries
8.3.3.1. Australia
8.3.3.2. China market
8.3.3.3. India market
8.3.3.4. Japan market
8.3.4. Asia Pacific Market Forecasts and Analysis - By Bumping Technology
8.3.5. Asia Pacific Market Forecasts and Analysis - By End Users
8.3.6. Asia Pacific Market Forecasts and Analysis - By Industry Vertical
8.4. MIDDLE EAST AND AFRICA (MEA)
8.4.1. Middle East and Africa Flip chip packages Market Overview
8.4.2. Middle East and Africa Flip chip packages Market Forecasts and Analysis
8.4.3. Middle East and Africa Market Forecasts and Analysis - By Countries
8.4.3.1. South Africa market
8.4.3.2. Saudi Arabia market
8.4.3.3. UAE market
8.4.4. Middle East and Africa Market Forecasts and Analysis - By Bumping Technology
8.4.5. Middle East and Africa Market Forecasts and Analysis - By End Users
8.4.6. Middle East and Africa Market Forecasts and Analysis - By Industry Vertical
8.5. SOUTH AMERICA (SAM)
8.5.1. South America Flip chip packages Market Overview
8.5.2. South America Flip chip packages Market Forecasts and Analysis
8.5.3. South America Market Forecasts and Analysis - By Countries
8.5.3.1. Brazil market
8.5.4. South America Market Forecasts and Analysis - By Bumping Technology
8.5.5. South America Market Forecasts and Analysis - By End Users
8.5.6. South America Market Forecasts and Analysis - By Industry Vertical
9. INDUSTRY LANDSCAPE
9.1. MERGERS & ACQUISITIONS
9.2. MARKET INITIATIVES
9.3. NEW DEVELOPMENTS
9.4. INVESTMENT SCENARIOS
10. COMPETITIVE LANDSCAPE
10.1. COMPETITIVE PRODUCT MAPPING
10.2. MARKET POSITIONING/ MARKET SHARE
11. FLIP CHIP PACKAGES MARKET, KEY COMPANY PROFILES
11.1. INTEL CORPORATION
11.1.1. Key Facts
11.1.2. Business Description
11.1.3. Financial Overview
11.1.4. SWOT Analysis
11.1.5. Key Developments
11.2. CHIPBOND TECHNOLOGY
11.2.1. Key Facts
11.2.2. Business Description
11.2.3. Financial Overview
11.2.4. SWOT Analysis
11.2.5. Key Developments
11.3. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
11.3.1. Key Facts
11.3.2. Business Description
11.3.3. Financial Overview
11.3.4. SWOT Analysis
11.3.5. Key Developments
11.4. ADVANCED SEMICONDUCTOR ENGINEERING
11.4.1. Key Facts
11.4.2. Business Description
11.4.3. Financial Overview
11.4.4. SWOT Analysis
11.4.5. Key Developments
11.5. SILICONWARE PRECISION INDUSTRIES
11.5.1. Key Facts
11.5.2. Business Description
11.5.3. Financial Overview
11.5.4. SWOT Analysis
11.5.5. Key Developments
11.6. TEXAS INSTRUMENTS, INC.
11.6.1. Key Facts
11.6.2. Business Description
11.6.3. Financial Overview
11.6.4. SWOT Analysis
11.6.5. Key Developments
11.7. SAMSUNG ELECTRONICS CO. LTD.
11.7.1. Key Facts
11.7.2. Business Description
11.7.3. Financial Overview
11.7.4. SWOT Analysis
11.7.5. Key Developments
11.8. POWERTECH TECHNOLOGY
11.8.1. Key Facts
11.8.2. Business Description
11.8.3. Financial Overview
11.8.4. SWOT Analysis
11.8.5. Key Developments
11.9. IBM CORPORATION
11.9.1. Key Facts
11.9.2. Business Description
11.9.3. Financial Overview
11.9.4. SWOT Analysis
11.9.5. Key Developments
11.10. AMKOR TECHNOLOGY INC.
11.10.1. Key Facts
11.10.2. Business Description
11.10.3. Financial Overview
11.10.4. SWOT Analysis
11.10.5. Key Developments
12. APPENDIX
12.1. ABOUT THE INSIGHT PARTNERS
12.2. GLOSSARY OF TERMS
12.3. RESEARCH METHODOLOGY
1. Intel Corporation
2. Chipbond Technology
3. Taiwan Semiconductor Manufacturing Company
4. Advanced Semiconductor Engineering
5. Siliconware Precision Industries
6. Texas Instruments, Inc.
7. Samsung Electronics Co. LTD.
8. Powertech Technology
9. IBM Corporation
10. Amkor Technology Inc.
The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.
- Data Collection and Secondary Research:
As a market research and consulting firm operating from a decade, we have published many reports and advised several clients across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.
Several associations trade associates, technical forums, institutes, societies and organizations are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in the last 3 years are scrutinized and analyzed to understand the current market trends.
- Primary Research:
The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.
For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/Sales Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.
A typical research interview fulfils the following functions:
- Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
- Validates and strengthens in-house secondary research findings
- Develops the analysis team’s expertise and market understanding
Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:
- Industry participants: VPs, business development managers, market intelligence managers and national sales managers
- Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.
Below is the breakup of our primary respondents by company, designation, and region:
Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.
- Data Analysis:
Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.
- 3.1 Macro-Economic Factor Analysis:
We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.
- 3.2 Country Level Data:
Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.
- 3.3 Company Profile:
The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.
- 3.4 Developing Base Number:
Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.
- Data Triangulation and Final Review:
The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.
We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.
We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.