Flip Chips Market Size and Forecasts (2021 - 2031), Global and Regional Share, Trends, and Growth Opportunity Analysis

Coverage: Flip Chips Market covers analysis By Packaging Technology (2.5D IC, 3D IC, 2D IC); Bumping Technology (Copper Pillar, Gold Bumping, Solder Bumping, Others); End User (Electronics, Automotive, Industrial, Healthcare and Life Sciences, IT and Telecommunications, Aerospace and Defense, Others) , and Geography (North America, Europe, Asia Pacific, and South and Central America)

  • Report Code : TIPRE00021271
  • Category : Electronics and Semiconductor
  • No. of Pages : 150
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Flip Chips Market Developments by 2031

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Market Overview

The rising demand for smart electronics across the globe is a key factor expected to drive the growth of the global flip chips market during the forecast period. In addition, the flip chips has modified the portable electronics and electric vehicle industries by proving to be an ideal product for electrical interconnections. Furthermore, an increase in the trend of real-world gaming is also expected to propel the growth of the global flip chip market, as it is incorporated in the processors used inside gaming consoles and graphic cards used in personal computers.

Market Scope

The "Global Flip Chips Market Analysis to 2031" is a specialized and in-depth study of the cabinet power distribution market with a special focus on the global market trend analysis. The report aims to provide an overview of flip chips market with detailed market segmentation by packaging technology, bumping technology, end user, and geography. The global flip chips market is expected to witness high growth during the forecast period. The report provides key statistics on the market status of the leading flip chips market players and offers key trends and opportunities in the flip chips market.

Market Segmentation

The global flip chips market is segmented on the basis of packaging technology, bumping technology, and end user.

  • On the basis of packaging technology, the market is segmented into 3D IC, 2.5D IC, 2D IC
  • On the basis of bumping technology, the market is segmented into Solder Bumping, Gold Bumping, Others.
  • On the basis of end user, the market is segmented into Electronics, Industrial, Automotive and Transport, Healthcare, IT and Telecommunication, Aerospace and Defense, Others.

Market Dynamics

Drivers

  • Surge in need for circuit miniaturization in microelectronic devices will drive the market growth in the forecast period.

Restrains

  • The use of additional wafer bumping, and substrate of higher price will hamper the market growth in the forecast period.

Regional Framework

The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides an overview and forecast of the global market based on various segments. It also provides market size and forecast estimates from the year 2021 to 2031 with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), the Middle East and Africa (MEA), and South America. The automotive connector’s market by each region is later sub-segmented by respective countries and segments. The report covers the analysis and forecast of 18 countries globally along with the current trend and opportunities prevailing in the region.

The report analyzes factors affecting the market from both demand and supply side and further evaluates market dynamics affecting the marketduring the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, MEA, and South America after evaluating political, economic, social and technological factors affecting the automotive connector’s market in these regions.

Impact of Covid-19

The global flip chips market revenue has witnessed significant growth in the last few years; however, the market is witnessing a sudden downfall as the critical electronics manufacturing industries were temporarily closed due to the limit COVID-19's spread. In addition, the COVID-19 pandemic majorly affected the global supply chain by impacting both suppliers via shortages of components, materials, and finished goods and consumers by declining spending in China on semiconductor-dependent products such as consumer electronics, automobiles, and others. Furthermore, the semiconductor industry is compelled to transform its global supply chain model, which will drive the global flip chips market's growth in the forecast period.

MARKET PLAYERS

The report covers key developments in the flip chips market organic and inorganic growth strategies. Various companies are focusing on organic growth strategies such as product launches, product approvals and others such as patents and events. Inorganic growth strategies activities witnessed in the market were acquisitions, and partnership & collaborations. These activities have paved way for the expansion of business and customer base of market players. The market players from flip chips market are anticipated to lucrative growth opportunities in the future with the rising demand for biogas power plant in the global market. The report also includes the profiles of key companies along with their SWOT analysis and market strategies in the flip chips market. In addition, the report focuses on leading industry players with information such as company profiles, components, and services offered, financial information of the last 3 years, the key development in the past five years. 

  • 3M
  • ADVANCED MICRO DEVICES, INC.
  • AMKOR TECHNOLOGY
  • APPLE INC.
  • FUJITSU LIMITED
  • INTEL CORPORATION
  • INTERNATIONAL BUSINESS MACHINES CORPORATION
  • SAMSUNG ELECTRONICS CO., LTD.
  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
  • TEXAS INSTRUMENTS INCORPORATED

The Insight Partner’s dedicated research and analysis team consist of experienced professionals with advanced statistical expertise and offer various customization options in the existing study.

REGIONAL FRAMEWORK
World Geography

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MARKET PLAYERS
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Report Coverage
Report Coverage

Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends

Segment Covered
Segment Covered

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to segments covered.

Regional Scope
Regional Scope

North America, Europe, Asia Pacific, Middle East & Africa, South & Central America

Country Scope
Country Scope

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to country scope.

TABLE OF CONTENTS

1. INTRODUCTION
1.1. SCOPE OF THE STUDY
1.2. THE INSIGHT PARTNERS RESEARCH REPORT GUIDANCE
1.3. MARKET SEGMENTATION
1.3.1 Flip Chips Market - By Packaging Technology
1.3.2 Flip Chips Market - By Bumping Technology
1.3.3 Flip Chips Market - By End User
1.3.4 Flip Chips Market - By Region
1.3.4.1 By Country

2. KEY TAKEAWAYS

3. RESEARCH METHODOLOGY

4. FLIP CHIPS MARKET LANDSCAPE
4.1. OVERVIEW
4.2. PEST ANALYSIS
4.2.1 North America - Pest Analysis
4.2.2 Europe - Pest Analysis
4.2.3 Asia-Pacific - Pest Analysis
4.2.4 Middle East and Africa - Pest Analysis
4.2.5 South and Central America - Pest Analysis
4.3. ECOSYSTEM ANALYSIS
4.4. EXPERT OPINIONS

5. FLIP CHIPS MARKET - KEY MARKET DYNAMICS
5.1. KEY MARKET DRIVERS
5.2. KEY MARKET RESTRAINTS
5.3. KEY MARKET OPPORTUNITIES
5.4. FUTURE TRENDS
5.5. IMPACT ANALYSIS OF DRIVERS AND RESTRAINTS

6. FLIP CHIPS MARKET - GLOBAL MARKET ANALYSIS
6.1. FLIP CHIPS - GLOBAL MARKET OVERVIEW
6.2. FLIP CHIPS - GLOBAL MARKET AND FORECAST TO 2028
6.3. MARKET POSITIONING/MARKET SHARE

7. FLIP CHIPS MARKET - REVENUE AND FORECASTS TO 2028 - PACKAGING TECHNOLOGY
7.1. OVERVIEW
7.2. PACKAGING TECHNOLOGY MARKET FORECASTS AND ANALYSIS
7.3. 2.5D IC
7.3.1. Overview
7.3.2. 2.5D IC Market Forecast and Analysis
7.4. 3D IC
7.4.1. Overview
7.4.2. 3D IC Market Forecast and Analysis
7.5. 2D IC
7.5.1. Overview
7.5.2. 2D IC Market Forecast and Analysis
8. FLIP CHIPS MARKET - REVENUE AND FORECASTS TO 2028 - BUMPING TECHNOLOGY
8.1. OVERVIEW
8.2. BUMPING TECHNOLOGY MARKET FORECASTS AND ANALYSIS
8.3. COPPER PILLAR
8.3.1. Overview
8.3.2. Copper Pillar Market Forecast and Analysis
8.4. GOLD BUMPING
8.4.1. Overview
8.4.2. Gold Bumping Market Forecast and Analysis
8.5. SOLDER BUMPING
8.5.1. Overview
8.5.2. Solder Bumping Market Forecast and Analysis
8.6. OTHERS
8.6.1. Overview
8.6.2. Others Market Forecast and Analysis
9. FLIP CHIPS MARKET - REVENUE AND FORECASTS TO 2028 - END USER
9.1. OVERVIEW
9.2. END USER MARKET FORECASTS AND ANALYSIS
9.3. ELECTRONICS
9.3.1. Overview
9.3.2. Electronics Market Forecast and Analysis
9.4. AUTOMOTIVE
9.4.1. Overview
9.4.2. Automotive Market Forecast and Analysis
9.5. INDUSTRIAL
9.5.1. Overview
9.5.2. Industrial Market Forecast and Analysis
9.6. HEALTHCARE AND LIFE SCIENCES
9.6.1. Overview
9.6.2. Healthcare and Life Sciences Market Forecast and Analysis
9.7. IT AND TELECOMMUNICATIONS
9.7.1. Overview
9.7.2. IT and Telecommunications Market Forecast and Analysis
9.8. AEROSPACE AND DEFENSE
9.8.1. Overview
9.8.2. Aerospace and Defense Market Forecast and Analysis
9.9. OTHERS
9.9.1. Overview
9.9.2. Others Market Forecast and Analysis

10. FLIP CHIPS MARKET REVENUE AND FORECASTS TO 2028 - GEOGRAPHICAL ANALYSIS
10.1. NORTH AMERICA
10.1.1 North America Flip Chips Market Overview
10.1.2 North America Flip Chips Market Forecasts and Analysis
10.1.3 North America Flip Chips Market Forecasts and Analysis - By Packaging Technology
10.1.4 North America Flip Chips Market Forecasts and Analysis - By Bumping Technology
10.1.5 North America Flip Chips Market Forecasts and Analysis - By End User
10.1.6 North America Flip Chips Market Forecasts and Analysis - By Countries
10.1.6.1 United States Flip Chips Market
10.1.6.1.1 United States Flip Chips Market by Packaging Technology
10.1.6.1.2 United States Flip Chips Market by Bumping Technology
10.1.6.1.3 United States Flip Chips Market by End User
10.1.6.2 Canada Flip Chips Market
10.1.6.2.1 Canada Flip Chips Market by Packaging Technology
10.1.6.2.2 Canada Flip Chips Market by Bumping Technology
10.1.6.2.3 Canada Flip Chips Market by End User
10.1.6.3 Mexico Flip Chips Market
10.1.6.3.1 Mexico Flip Chips Market by Packaging Technology
10.1.6.3.2 Mexico Flip Chips Market by Bumping Technology
10.1.6.3.3 Mexico Flip Chips Market by End User
10.2. EUROPE
10.2.1 Europe Flip Chips Market Overview
10.2.2 Europe Flip Chips Market Forecasts and Analysis
10.2.3 Europe Flip Chips Market Forecasts and Analysis - By Packaging Technology
10.2.4 Europe Flip Chips Market Forecasts and Analysis - By Bumping Technology
10.2.5 Europe Flip Chips Market Forecasts and Analysis - By End User
10.2.6 Europe Flip Chips Market Forecasts and Analysis - By Countries
10.2.6.1 Germany Flip Chips Market
10.2.6.1.1 Germany Flip Chips Market by Packaging Technology
10.2.6.1.2 Germany Flip Chips Market by Bumping Technology
10.2.6.1.3 Germany Flip Chips Market by End User
10.2.6.2 France Flip Chips Market
10.2.6.2.1 France Flip Chips Market by Packaging Technology
10.2.6.2.2 France Flip Chips Market by Bumping Technology
10.2.6.2.3 France Flip Chips Market by End User
10.2.6.3 Italy Flip Chips Market
10.2.6.3.1 Italy Flip Chips Market by Packaging Technology
10.2.6.3.2 Italy Flip Chips Market by Bumping Technology
10.2.6.3.3 Italy Flip Chips Market by End User
10.2.6.4 United Kingdom Flip Chips Market
10.2.6.4.1 United Kingdom Flip Chips Market by Packaging Technology
10.2.6.4.2 United Kingdom Flip Chips Market by Bumping Technology
10.2.6.4.3 United Kingdom Flip Chips Market by End User
10.2.6.5 Russia Flip Chips Market
10.2.6.5.1 Russia Flip Chips Market by Packaging Technology
10.2.6.5.2 Russia Flip Chips Market by Bumping Technology
10.2.6.5.3 Russia Flip Chips Market by End User
10.2.6.6 Rest of Europe Flip Chips Market
10.2.6.6.1 Rest of Europe Flip Chips Market by Packaging Technology
10.2.6.6.2 Rest of Europe Flip Chips Market by Bumping Technology
10.2.6.6.3 Rest of Europe Flip Chips Market by End User
10.3. ASIA-PACIFIC
10.3.1 Asia-Pacific Flip Chips Market Overview
10.3.2 Asia-Pacific Flip Chips Market Forecasts and Analysis
10.3.3 Asia-Pacific Flip Chips Market Forecasts and Analysis - By Packaging Technology
10.3.4 Asia-Pacific Flip Chips Market Forecasts and Analysis - By Bumping Technology
10.3.5 Asia-Pacific Flip Chips Market Forecasts and Analysis - By End User
10.3.6 Asia-Pacific Flip Chips Market Forecasts and Analysis - By Countries
10.3.6.1 Australia Flip Chips Market
10.3.6.1.1 Australia Flip Chips Market by Packaging Technology
10.3.6.1.2 Australia Flip Chips Market by Bumping Technology
10.3.6.1.3 Australia Flip Chips Market by End User
10.3.6.2 China Flip Chips Market
10.3.6.2.1 China Flip Chips Market by Packaging Technology
10.3.6.2.2 China Flip Chips Market by Bumping Technology
10.3.6.2.3 China Flip Chips Market by End User
10.3.6.3 India Flip Chips Market
10.3.6.3.1 India Flip Chips Market by Packaging Technology
10.3.6.3.2 India Flip Chips Market by Bumping Technology
10.3.6.3.3 India Flip Chips Market by End User
10.3.6.4 Japan Flip Chips Market
10.3.6.4.1 Japan Flip Chips Market by Packaging Technology
10.3.6.4.2 Japan Flip Chips Market by Bumping Technology
10.3.6.4.3 Japan Flip Chips Market by End User
10.3.6.5 South Korea Flip Chips Market
10.3.6.5.1 South Korea Flip Chips Market by Packaging Technology
10.3.6.5.2 South Korea Flip Chips Market by Bumping Technology
10.3.6.5.3 South Korea Flip Chips Market by End User
10.3.6.6 Rest of Asia-Pacific Flip Chips Market
10.3.6.6.1 Rest of Asia-Pacific Flip Chips Market by Packaging Technology
10.3.6.6.2 Rest of Asia-Pacific Flip Chips Market by Bumping Technology
10.3.6.6.3 Rest of Asia-Pacific Flip Chips Market by End User
10.4. MIDDLE EAST AND AFRICA
10.4.1 Middle East and Africa Flip Chips Market Overview
10.4.2 Middle East and Africa Flip Chips Market Forecasts and Analysis
10.4.3 Middle East and Africa Flip Chips Market Forecasts and Analysis - By Packaging Technology
10.4.4 Middle East and Africa Flip Chips Market Forecasts and Analysis - By Bumping Technology
10.4.5 Middle East and Africa Flip Chips Market Forecasts and Analysis - By End User
10.4.6 Middle East and Africa Flip Chips Market Forecasts and Analysis - By Countries
10.4.6.1 South Africa Flip Chips Market
10.4.6.1.1 South Africa Flip Chips Market by Packaging Technology
10.4.6.1.2 South Africa Flip Chips Market by Bumping Technology
10.4.6.1.3 South Africa Flip Chips Market by End User
10.4.6.2 Saudi Arabia Flip Chips Market
10.4.6.2.1 Saudi Arabia Flip Chips Market by Packaging Technology
10.4.6.2.2 Saudi Arabia Flip Chips Market by Bumping Technology
10.4.6.2.3 Saudi Arabia Flip Chips Market by End User
10.4.6.3 U.A.E Flip Chips Market
10.4.6.3.1 U.A.E Flip Chips Market by Packaging Technology
10.4.6.3.2 U.A.E Flip Chips Market by Bumping Technology
10.4.6.3.3 U.A.E Flip Chips Market by End User
10.4.6.4 Rest of Middle East and Africa Flip Chips Market
10.4.6.4.1 Rest of Middle East and Africa Flip Chips Market by Packaging Technology
10.4.6.4.2 Rest of Middle East and Africa Flip Chips Market by Bumping Technology
10.4.6.4.3 Rest of Middle East and Africa Flip Chips Market by End User
10.5. SOUTH AND CENTRAL AMERICA
10.5.1 South and Central America Flip Chips Market Overview
10.5.2 South and Central America Flip Chips Market Forecasts and Analysis
10.5.3 South and Central America Flip Chips Market Forecasts and Analysis - By Packaging Technology
10.5.4 South and Central America Flip Chips Market Forecasts and Analysis - By Bumping Technology
10.5.5 South and Central America Flip Chips Market Forecasts and Analysis - By End User
10.5.6 South and Central America Flip Chips Market Forecasts and Analysis - By Countries
10.5.6.1 Brazil Flip Chips Market
10.5.6.1.1 Brazil Flip Chips Market by Packaging Technology
10.5.6.1.2 Brazil Flip Chips Market by Bumping Technology
10.5.6.1.3 Brazil Flip Chips Market by End User
10.5.6.2 Argentina Flip Chips Market
10.5.6.2.1 Argentina Flip Chips Market by Packaging Technology
10.5.6.2.2 Argentina Flip Chips Market by Bumping Technology
10.5.6.2.3 Argentina Flip Chips Market by End User
10.5.6.3 Rest of South and Central America Flip Chips Market
10.5.6.3.1 Rest of South and Central America Flip Chips Market by Packaging Technology
10.5.6.3.2 Rest of South and Central America Flip Chips Market by Bumping Technology
10.5.6.3.3 Rest of South and Central America Flip Chips Market by End User

11. INDUSTRY LANDSCAPE
11.1. MERGERS AND ACQUISITIONS
11.2. AGREEMENTS, COLLABORATIONS AND JOIN VENTURES
11.3. NEW PRODUCT LAUNCHES
11.4. EXPANSIONS AND OTHER STRATEGIC DEVELOPMENTS

12. FLIP CHIPS MARKET, KEY COMPANY PROFILES
12.1. 3M
12.1.1. Key Facts
12.1.2. Business Description
12.1.3. Products and Services
12.1.4. Financial Overview
12.1.5. SWOT Analysis
12.1.6. Key Developments
12.2. ADVANCED MICRO DEVICES, INC.
12.2.1. Key Facts
12.2.2. Business Description
12.2.3. Products and Services
12.2.4. Financial Overview
12.2.5. SWOT Analysis
12.2.6. Key Developments
12.3. AMKOR TECHNOLOGY, INC.
12.3.1. Key Facts
12.3.2. Business Description
12.3.3. Products and Services
12.3.4. Financial Overview
12.3.5. SWOT Analysis
12.3.6. Key Developments
12.4. APPLE, INC.
12.4.1. Key Facts
12.4.2. Business Description
12.4.3. Products and Services
12.4.4. Financial Overview
12.4.5. SWOT Analysis
12.4.6. Key Developments
12.5. FUJITSU LIMITED
12.5.1. Key Facts
12.5.2. Business Description
12.5.3. Products and Services
12.5.4. Financial Overview
12.5.5. SWOT Analysis
12.5.6. Key Developments
12.6. INTEL CORPORATION
12.6.1. Key Facts
12.6.2. Business Description
12.6.3. Products and Services
12.6.4. Financial Overview
12.6.5. SWOT Analysis
12.6.6. Key Developments
12.7. IBM CORPORATION
12.7.1. Key Facts
12.7.2. Business Description
12.7.3. Products and Services
12.7.4. Financial Overview
12.7.5. SWOT Analysis
12.7.6. Key Developments
12.8. SAMSUNG ELECTRONICS CO., LTD.
12.8.1. Key Facts
12.8.2. Business Description
12.8.3. Products and Services
12.8.4. Financial Overview
12.8.5. SWOT Analysis
12.8.6. Key Developments
12.9. TEXAS INSTRUMENTS, INC.
12.9.1. Key Facts
12.9.2. Business Description
12.9.3. Products and Services
12.9.4. Financial Overview
12.9.5. SWOT Analysis
12.9.6. Key Developments
12.10. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
12.10.1. Key Facts
12.10.2. Business Description
12.10.3. Products and Services
12.10.4. Financial Overview
12.10.5. SWOT Analysis
12.10.6. Key Developments

13. APPENDIX
13.1. ABOUT THE INSIGHT PARTNERS
13.2. GLOSSARY OF TERMS

The List of Companies

1. 3M
2. Advanced Micro Devices, Inc.
3. Amkor Technology, Inc.
4. Apple, Inc.
5. Fujitsu Limited
6. Intel Corporation
7. IBM Corporation
8. Samsung Electronics Co., Ltd.
9. Texas Instruments, Inc.
10. Taiwan Semiconductor Manufacturing Company

The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.

  1. Data Collection and Secondary Research:

As a market research and consulting firm operating from a decade, we have published many reports and advised several clients across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.

Several associations trade associates, technical forums, institutes, societies and organizations are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in the last 3 years are scrutinized and analyzed to understand the current market trends.

  1. Primary Research:

The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.

For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/Sales Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.

A typical research interview fulfils the following functions:

  • Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
  • Validates and strengthens in-house secondary research findings
  • Develops the analysis team’s expertise and market understanding

Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:

  • Industry participants: VPs, business development managers, market intelligence managers and national sales managers
  • Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.

Below is the breakup of our primary respondents by company, designation, and region:

Research Methodology

Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.

  1. Data Analysis:

Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.

  • 3.1 Macro-Economic Factor Analysis:

We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.

  • 3.2 Country Level Data:

Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.

  • 3.3 Company Profile:

The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.

  • 3.4 Developing Base Number:

Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.

  1. Data Triangulation and Final Review:

The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.

We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.

We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.

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