Molded Interconnect Device Market Size and Forecasts (2021 - 2031), Global and Regional Share, Trends, and Growth Opportunity Analysis

Coverage: Molded Interconnect Device Market covers analysis by Product (Antennae and Connectivity Modules, Sensors, Connectors and Switches, Lighting Systems, and Others), End-users [Automotive, Consumer Electronics, Medical, Telecommunications, Military and Aerospace, and Others], Process [Laser Direct Structuring (LDS), Two-Shot Molding, and Film Techniques], and Geography (North America, Europe, Asia Pacific, and South and Central America)

  • Report Code : TIPTE100001138
  • Category : Electronics and Semiconductor
  • No. of Pages : 150
Buy Now

Molded Interconnect Device Market SWOT Analysis by 2031

Buy Now

The molded interconnect device (MID) market is expected to grow from US$ 1,203.5 million in 2021; it is expected to register  at a compound annual growth rate (CAGR) of 14.5% from 2022 to 2031

Molded interconnect devices (MID) allow the amalgamation of mechanical and electrical components and circuits directly on 3D plastic components. MIDs combine the housing, cables, and circuit board that comprises traditional product interfaces and integrate them into a single functional, compact part. It also offers design flexibility, which helps in space savings in a product by eliminating the need for additional components. This helps in reducing the total weight of the product.

MARKET DYNAMICS
Molded interconnect devices help reduce assembly times and production steps through the integration of various circuits and sensors, which optimizes the additional costs incurred and manufacture high-quality components, which is driving the molded interconnect device market. A few other factors propelling the market growth are the increasing use of laser direct structuring (LDS) process to produce 5G antennas that lead to enhanced speed and efficiency of wireless communication)and the growing demand for IoT devices. However, high raw materials prices and tooling costs required during the manufacturing process of MIDs are hampering the molded interconnect device market growth.

MARKET SCOPE
The "Global Molded Interconnect Device Market Analysis to 2031" is a specialized and in-depth study of the market with a special focus on the global market trend analysis. The report aims to provide an overview of the market with detailed market segmentation and key market statistics of the leading players. It also offers key trends and opportunities in the molded interconnect device market.

Strategic Insights

MARKET SEGMENTATION
The molded interconnect device market is segmented into product, end-users, and process. Based on product, the market is segmented into antennae and connectivity modules, sensors, connectors and switches, lighting systems, and others. Based on end-users, the market is categorized into automotive, consumer electronics, medical, telecommunications, military and aerospace, and others. Based on process, the market is segmented into LDS, two-shot molding, and film techniques.


RD Image
  • Sample PDF showcases the content structure and the nature of the information with qualitative and quantitative analysis.
  • Request discounts available for Start-Ups & Universities
REGIONAL FRAMEWORK
The global molded interconnect device market is segmented into five major regions—North America, Europe, Asia Pacific (APAC), Middle East & Africa (MEA), and South America. The report covers analysis and forecast of 18 countries globally along with current trends and opportunities prevailing in the region.

Asia Pacific is expected to witness the highest CAGR during the forecast period. The growth is mainly attributed to the presence of several key original equipment manufacturers (OEMs), semiconductor devices, product manufacturers, and associations and regulatory bodies in the region. A few countries, such as Taiwan, South Korea, and China, offer advanced semiconductor fabrication services and assembling services for electronic systems. Also, a few of the leading manufacturers of MIDs gain a considerable cost advantage by manufacturing their products in Taiwan and China. Further, Johnan, Sunway Communication, Suzhou Cicor Technology, Yomura Technologies, Yazaki Corporation, Chogori Technology, Suzhou Zeeteq Electronics, Toyo Connectors, and SINOPLAST are among the leading companies operating in the molded interconnect device market.

The below figure showcases the revenue growth trend in the molded interconnect device market:

The report analyzes factors, such as drivers, restraints, opportunities, and future trends, that impact the molded interconnect device market. It also provides exhaustive PEST analysis of the factors affecting the market.

IMPACT OF COVID-19 PANDEMIC

The molded interconnect device market is adversely impacted by the COVID-19 pandemic. This is majorly due to the declining demand and production activities in the consumer electronics & automotive sectors. In 2021, several government bodies and associations across the globe imposed lockdowns and restrictions on international imports and exports, leading to the shutdown of various manufacturing plants, thus, hampering supply chain activities.

World Geography

Have a question?

Analyst

Naveen

Naveen will walk you through a 15-minute call to present the report’s content and answer all queries if you have any.

Analyst   Speak to Analyst
  • Sample PDF showcases the content structure and the nature of the information with qualitative and quantitative analysis.
  • Request discounts available for Start-Ups & Universities
MARKET PLAYERS

The global molded interconnect device market is segmented into five major regions—North America, Europe, Asia Pacific (APAC), Middle East & Africa (MEA), and South America. The report covers analysis and forecast of 18 countries globally along with current trends and opportunities prevailing in the region.

Asia Pacific is expected to witness the highest CAGR during the forecast period. The growth is mainly attributed to the presence of several key original equipment manufacturers (OEMs), semiconductor devices, product manufacturers, and associations and regulatory bodies in the region. A few countries, such as Taiwan, South Korea, and China, offer advanced semiconductor fabrication services and assembling services for electronic systems. Also, a few of the leading manufacturers of MIDs gain a considerable cost advantage by manufacturing their products in Taiwan and China. Further, Johnan, Sunway Communication, Suzhou Cicor Technology, Yomura Technologies, Yazaki Corporation, Chogori Technology, Suzhou Zeeteq Electronics, Toyo Connectors, and SINOPLAST are among the leading companies operating in the molded interconnect device market.

The below figure showcases the revenue growth trend in the molded interconnect device market:

The report analyzes factors, such as drivers, restraints, opportunities, and future trends, that impact the molded interconnect device market. It also provides exhaustive PEST analysis of the factors affecting the market.

IMPACT OF COVID-19 PANDEMIC

The molded interconnect device market is adversely impacted by the COVID-19 pandemic. This is majorly due to the declining demand and production activities in the consumer electronics & automotive sectors. In 2021, several government bodies and associations across the globe imposed lockdowns and restrictions on international imports and exports, leading to the shutdown of various manufacturing plants, thus, hampering supply chain activities.

MARKET PLAYERS
The reports cover key developments in the molded interconnect device market. Various companies are focusing on organic growth strategies such as product launches, product approvals, patents, and events. Inorganic growth strategies such as acquisitions, partnerships, and collaborations have encouraged the expansion of business and the customer base of market players. The market players are anticipated to experience lucrative growth opportunities in the coming years with the rising demand for MIDs. The list of a few companies engaged in the molded interconnect device market is mentioned below:

  • Arlington Plating Company
  • HARTING Technology Group
  • LPKF Laser and Electronics AG
  • MacDermid, Inc.
  • Molex, LLC
  • Multiple Dimensions AG
  • RTP Company
  • TE Connectivity
  • TEPROSA GmbH
  • YOMURA

The report includes the profiles of key molded interconnect device companies, along with their SWOT analysis and market strategies. It also focuses on leading industry players with information such as company profiles, components and services offered, financial information for the last three years, and key development in the past five years.

The Insight Partner's dedicated research and analysis team consists of experienced professionals with advanced statistical expertise and offers various customization options in the existing study.

  • Sample PDF showcases the content structure and the nature of the information with qualitative and quantitative analysis.
  • Request discounts available for Start-Ups & Universities
Report Coverage
Report Coverage

Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends

Segment Covered
Segment Covered

Product, End-Users, and Process

Regional Scope
Regional Scope

North America, Europe, Asia Pacific, Middle East & Africa, South & Central America

Country Scope
Country Scope

US, UK, Canada, Germany, France, Italy, Australia, Russia, China, Japan, South Korea, Saudi Arabia, Brazil, Argentina

Table of Contents

1 Introduction
1.1 Scope of Study
1.2 The Insight Partners Research Report Guidance

2 Key Takeaways
3 Molded Interconnect Device (MID) Market Landscape
3.1 Market Overview
3.2 Market Segmentation
3.2.1 Molded Interconnect Device (MID) Market - By Type
3.2.2 Molded Interconnect Device (MID) Market - By End-User
3.2.3 Molded Interconnect Device (MID) Market - By Region
3.2.3.1 By Countries
3.3 PEST Analysis
3.3.1 North America - PEST Analysis
3.3.2 Europe - PEST Analysis
3.3.3 Asia Pacific - PEST Analysis
3.3.4 Middle East and Africa - PEST Analysis
3.3.5 South America - PEST Analysis

4 Molded Interconnect Device (MID) Market - Key Industry Dynamics
4.1 Key Market Drivers
4.2 Key Market Restraints
4.3 Key Market Opportunities
4.4 Future Trends
4.5 Impact Analysis

5 Molded Interconnect Device (MID) Market Analysis- Global
5.1 Global Molded Interconnect Device (MID) Market Overview
5.2 Global Molded Interconnect Device (MID) Market Forecasts and Analysis


6 Molded Interconnect Device (MID) Market Revenue and Forecasts to 2028 - Type
6.1 Overview
6.2 Type Market Forecasts and Analysis
6.3 Two-Shot Molding Process Market
6.3.1 Overview
6.3.2 Two-Shot Molding Process Market Forecasts and Analysis
6.4 Laser Direct Structuring Market
6.4.1 Overview
6.4.2 Laser Direct Structuring Market Forecasts and Analysis
6.5 Metal Spraying Market
6.5.1 Overview
6.5.2 Metal Spraying Market Forecasts and Analysis
6.6 Others Market
6.6.1 Overview
6.6.2 Others Market Forecasts and Analysis

7 Molded Interconnect Device (MID) Market Revenue and Forecasts to 2028 - End-user
7.1 Overview
7.2 End-user Market Forecasts and Analysis
7.3 Automotive
7.3.1 Overview
7.3.2 Automotive Market Forecasts and Analysis
7.4 Consumer Electronics
7.4.1 Overview
7.4.2 Consumer Electronics Market Forecasts and Analysis
7.5 Medical
7.5.1 Overview
7.5.2 Medical Market Forecasts and Analysis
7.6 Telecommunications
7.6.1 Overview
7.6.2 Telecommunications Market Forecasts and Analysis
7.7 Industrial
7.7.1 Overview
7.7.2 Industrial Market Forecasts and Analysis
7.8 Others
7.8.1 Overview
7.8.2 Others Market Forecasts and Analysis
8 Molded Interconnect Device (MID) Market Revenue and Forecasts to 2028 - Geographical Analysis
8.1 North America
8.1.1 North America Molded Interconnect Device (MID) Market Overview
8.1.2 North America Molded Interconnect Device (MID) Market Forecasts and Analysis
8.1.2.1 North America Market Forecasts and Analysis - By Countries
8.1.2.1.1 US market
8.1.2.1.2 Canada market
8.1.2.1.3 Mexico market
8.1.2.2 North America Market Forecasts and Analysis - By Type
8.1.2.3 North America Market Forecasts and Analysis - By End-user
8.2 Europe
8.2.1 Europe Molded Interconnect Device (MID) Market Overview
8.2.2 Europe Molded Interconnect Device (MID) Market Forecasts and Analysis
8.2.2.1 Europe Market Forecasts and Analysis - By Countries
8.2.2.1.1 France market
8.2.2.1.2 Germany market
8.2.2.1.3 Italy market
8.2.2.1.4 Spain market
8.2.2.1.5 UK market
8.2.2.2 Europe Market Forecasts and Analysis - By Type
8.2.2.3 Europe Market Forecasts and Analysis - By End-user
8.3 Asia pacific (APAC)
8.3.1 Asia Pacific Molded Interconnect Device (MID) Market Overview
8.3.2 Asia Pacific Molded Interconnect Device (MID) Market Forecasts and Analysis
8.3.2.1 Asia Pacific Market Forecasts and Analysis - By Countries
8.3.2.1.1 Australia market
8.3.2.1.2 China market
8.3.2.1.3 India market
8.3.2.1.4 Japan market
8.3.2.2 Asia Pacific Market Forecasts and Analysis - By Type
8.3.2.3 Asia Pacific Market Forecasts and Analysis - By End-user
8.4 Middle East and Africa (MEA)
8.4.1 Middle East and Africa Molded Interconnect Device (MID) Market Overview
8.4.2 Middle East and Africa Molded Interconnect Device (MID) Market Forecasts and Analysis
8.4.2.1 Middle East and Africa Market Forecasts and Analysis - By Countries
8.4.2.1.1 South Africa market
8.4.2.1.2 Saudi Arabia market
8.4.2.1.3 UAE market
8.4.2.2 Middle East and Africa Market Forecasts and Analysis - By Type
8.4.2.3 Middle East and Africa Market Forecasts and Analysis - By End-user
8.5 South America (SAM)
8.5.1 South America Molded Interconnect Device (MID) Market Overview
8.5.2 South America Molded Interconnect Device (MID) Market Forecasts and Analysis
8.5.2.1 South America Market Forecasts and Analysis - By Countries
8.5.2.1.1 Brazil market
8.5.2.2 South America Market Forecasts and Analysis - By Type
8.5.2.3 South America Market Forecasts and Analysis - By End-user
9 Industry Landscape
9.1 Mergers & acquisitions
9.2 Market Initiatives
9.3 New developments
9.4 Investment scenarios

10 Competitive Landscape
10.1 Competitive Product mapping
10.2 Market Positioning/ Market Share

11 Molded Interconnect Device (MID) Market, Key Company Profiles
11.1 TE Connectivity
11.1.1 Key Facts
11.1.2 Business Description
11.1.3 Financial Overview
11.1.4 SWOT Analysis
11.1.5 Key Developments
11.2 LPKF Laser & Electronics AG
11.2.1 Key Facts
11.2.2 Business Description
11.2.3 Financial Overview
11.2.4 SWOT Analysis
11.2.5 Key Developments
11.3 Molex, LLC
11.3.1 Key Facts
11.3.2 Business Description
11.3.3 Financial Overview
11.3.4 SWOT Analysis
11.3.5 Key Developments
11.4 MacDermid, Inc.
11.4.1 Key Facts
11.4.2 Business Description
11.4.3 Financial Overview
11.4.4 SWOT Analysis
11.4.5 Key Developments
11.5 HARTING Technology Group
11.5.1 Key Facts
11.5.2 Business Description
11.5.3 Financial Overview
11.5.4 SWOT Analysis
11.5.5 Key Developments
11.6 Arlington Plating Company
11.6.1 Key Facts
11.6.2 Business Description
11.6.3 Financial Overview
11.6.4 SWOT Analysis
11.6.5 Key Developments
11.7 RTP Company
11.7.1 Key Facts
11.7.2 Business Description
11.7.3 Financial Overview
11.7.4 SWOT Analysis
11.7.5 Key Developments
11.8 Multiple Dimensions AG
11.8.1 Key Facts
11.8.2 Business Description
11.8.3 Financial Overview
11.8.4 SWOT Analysis
11.8.5 Key Developments
11.9 TEPROSA
11.9.1 Key Facts
11.9.2 Business Description
11.9.3 Financial Overview
11.9.4 SWOT Analysis
11.9.5 Key Developments
11.10 YOMURA
11.10.1 Key Facts
11.10.2 Business Description
11.10.3 Financial Overview
11.10.4 SWOT Analysis
11.10.5 Key Developments

12 Appendix
12.1 About The Insight Partners
12.2 Glossary of Terms
12.3 Research Methodology

The List of Companies

1. TE Connectivity
2. LPKF Laser & Electronics AG
3. Molex, LLC
4. MacDermid, Inc.
5. HARTING Technology Group
6. Arlington Plating Company
7. RTP Company
8. Multiple Dimensions AG
9. TEPROSA
10. YOMURA

The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.

  1. Data Collection and Secondary Research:

As a market research and consulting firm operating from a decade, we have published many reports and advised several clients across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.

Several associations trade associates, technical forums, institutes, societies and organizations are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in the last 3 years are scrutinized and analyzed to understand the current market trends.

  1. Primary Research:

The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.

For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/Sales Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.

A typical research interview fulfils the following functions:

  • Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
  • Validates and strengthens in-house secondary research findings
  • Develops the analysis team’s expertise and market understanding

Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:

  • Industry participants: VPs, business development managers, market intelligence managers and national sales managers
  • Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.

Below is the breakup of our primary respondents by company, designation, and region:

Research Methodology

Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.

  1. Data Analysis:

Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.

  • 3.1 Macro-Economic Factor Analysis:

We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.

  • 3.2 Country Level Data:

Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.

  • 3.3 Company Profile:

The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.

  • 3.4 Developing Base Number:

Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.

  1. Data Triangulation and Final Review:

The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.

We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.

We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.

Your data will never be shared with third parties, however, we may send you information from time to time about our products that may be of interest to you. By submitting your details, you agree to be contacted by us. You may contact us at any time to opt-out.

Trends and growth analysis reports related to Electronics and Semiconductor : READ MORE..