Semiconductor Bonding Market Dynamics, Report, Scope by 2031
The semiconductor bonding market size is projected to reach US$ 1384.72 million by 2031 from US$ 709.73 million in 2023. The market is expected to register a CAGR of 8.7% during 2023–2031. The rise in demand for stack die technology in IoT devices and government investment in the semiconductor industry are likely to remain key trends in the market.
Semiconductor Bonding Market Analysis
The need for semiconductor bonding in consumer electronics goods, aerospace and defence equipment, and medical equipment and machinery drive the market growth. The government initiatives to foster the electric vehicle market in the forecast period will generate the demand for semiconductor bonding. The growing demand for smartphones and wearable devices further propels the market growth.
Semiconductor Bonding Market Overview
Semiconductor bonding is used to produce a large number of equipment and integrated circuits. The mounting demand for the semiconductor industry is one of the major factors driving the semiconductor bonding market. The demand for semiconductors from a wide range of industries, such as manufacturing, automotive, healthcare, and others, fosters market growth.
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Semiconductor Bonding Market: Strategic Insights
Market Size Value in US$ 669.48 Million in 2022 Market Size Value by US$ 1,076.82 Million by 2028 Growth rate CAGR of 8.2% from 2022 to 2028 Forecast Period 2022-2028 Base Year 2022
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Semiconductor Bonding Market: Strategic Insights
| Market Size Value in | US$ 669.48 Million in 2022 |
| Market Size Value by | US$ 1,076.82 Million by 2028 |
| Growth rate | CAGR of 8.2% from 2022 to 2028 |
| Forecast Period | 2022-2028 |
| Base Year | 2022 |
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Semiconductor Bonding Market Drivers and Opportunities
Government investment in the semiconductor industry
The semiconductor industry is growing at a rapid pace due to the demand for semiconductors from manufacturers of electric vehicles, consumer electronics, machinery, and others. Government authorities across the globe are focused on fueling domestic manufacturing industries to drive economic growth and reduce their dependency on imports. For this, they are investing in semiconductor manufacturing. For example, President Biden signed the bipartisan CHIPS and Science Act into law on August 9, 2022. The Department of Commerce is overseeing US$ 50 billion to revitalize the US semiconductor industry and strengthen the country’s economic and national security.
The advent of hybrid bonding
One of the advanced technologies in semiconductor bonding is hybrid bonding. This technology is widely gaining traction to test and prepare hybrid bonding methods for high-volume production efficiently. It is being used for the semiconductor research and development departments. The adoption of hybrid bonding results in saving space in systems across industries such as automotive, consumer electronics, and others. Thus, due to the demand for this advanced technology, the market players are launching innovative solutions. For example, in May 2024, SÜSS MicroTec SE introduced the XBC300 Gen2 D2W/W2W, a groundbreaking hybrid bonding platform designed for both 200 mm and 300 mm substrates, providing versatile wafer-to-wafer (W2W) and die-to-wafer (D2W) bonding capabilities.
Semiconductor Bonding Market Report Segmentation Analysis
Key segments that contributed to the derivation of the semiconductor bonding market analysis are the type and technology.
- Based on the type, the semiconductor bonding market is divided into die bonder, wafer bonder, and flip chip bonder. The wafer bonder segment held the largest share of the market in 2023.
- By end user, the market is segmented into RF devices, MEMS and sensors, LED, CMOS image sensors, and 3D NAND. The RF devices segment held a significant share of the market in 2023.
Semiconductor Bonding Market Share Analysis by Geography
The geographic scope of the semiconductor bonding market report is mainly divided into five regions: North America, Asia Pacific, Europe, Middle East & Africa, and South & Central America.
Asia Pacific region held the largest share of the market in 2023. China, India, Japan, and Taiwan are the countries holding a significant share of the market. The government authorities are investing in the manufacturing of semiconductors, which generates the need for semiconductor bonding. For example, in November 2022 in India, a comprehensive program for the development of semiconductors and display manufacturing ecosystem in India was approved by the Government of India with an outlay of more than US$ 10 billion. The program aimed to provide attractive incentive support to companies/consortia that are engaged in silicon semiconductor fabs, display fabs, compound semiconductors/silicon photonics/sensors (including MEMS) fabs / discrete semiconductor fabs, semiconductor packaging (ATMP / OSAT) and semiconductor design.
Semiconductor Bonding Market Report Scope
Semiconductor Bonding Market News and Recent Developments
The semiconductor bonding market is evaluated by gathering qualitative and quantitative data post primary and secondary research, which includes important corporate publications, association data, and databases. A few of the developments in the semiconductor bonding market are listed below:
- TANAKA Kikinzoku Kogyo K.K., which develops industrial precious metals products as one of the core companies of TANAKA Precious Metals, announced that it established a gold particle bonding technology for high-density mounting of semiconductors using AuRoFUSE low-temperature fired paste for gold-to-gold bonding. AuRoFUSE is a composition of submicron-sized gold particles and a solvent that creates a bonding material with low electrical resistance and high thermal conductivity to achieve metal bonding at low temperatures. Using AuRoFUSE preforms (dried paste forms), this technology can reach 4 μm fine-pitch mounting with 20 μm bumps. (Source: TANAKA HOLDINGS Co., Ltd., Press Release, March 2024)
- BE Semiconductor Industries N.V. (the “Company" or "Besi"), a leading manufacturer of assembly equipment for the semiconductor industry, announced the receipt of an order for 26 hybrid bonding systems from a leading semiconductor logic manufacturer. (Source: Besi, Press Release, May 2024)
Semiconductor Bonding Market Report Coverage and Deliverables
The “Semiconductor Bonding Market Size and Forecast (2021–2031)” report provides a detailed analysis of the market covering below areas:
- Semiconductor bonding market size and forecast at global, regional, and country levels for all the key market segments covered under the scope
- Semiconductor bonding market trends as well as market dynamics such as drivers, restraints, and key opportunities
- Detailed PEST/Porter’s Five Forces and SWOT analysis
- Semiconductor bonding market analysis covering key market trends, global and regional framework, major players, regulations, and recent market developments
- Industry landscape and competition analysis covering market concentration, heat map analysis, prominent players, and recent developments for the semiconductor bonding market
- Detailed company profiles
Report Coverage
Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends
Segment Covered
Type and Application
Regional Scope
North America, Europe, Asia Pacific, Middle East & Africa, South & Central America
Country Scope
Argentina, Australia, Brazil, Canada, China, France, Germany, India, Italy, Japan, Mexico, Russia, Saudi Arabia, South Africa, South Korea, UAE, UK, US
Frequently Asked Questions
The estimated value of the semiconductor bonding market will be US$ 1384.72 million by 2031.
Palomar Technologies; Panasonic Corporation; Toray Industries Inc; Kulicke & Soffa Industries, Inc; DIAS Automation (HK) Ltd; ASMPT Ltd (formerly ASM Pacific Technology Ltd.); EV Group; Yamaha Motor Corporation (Yamaha Robotics Holdings); WestBond, Inc.; and Applied Materials, Inc. are some of the key players operating in the semiconductor bonding market.
The rise in demand for stack die technology in IoT devices, and government investment in the semiconductor industry are the key driving factors impacting the semiconductor bonding market.
Emerging technologies such as AI, IIoT, and advanced manufacturing techniques are key trends in the semiconductor bonding market.
The global semiconductor bonding market is estimated to register a CAGR of 8.7% during the forecast period 2023–2031.
The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.
- Data Collection and Secondary Research:
As a market research and consulting firm operating from a decade, we have published many reports and advised several clients across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.
Several associations trade associates, technical forums, institutes, societies and organizations are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in the last 3 years are scrutinized and analyzed to understand the current market trends.
- Primary Research:
The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.
For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/Sales Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.
A typical research interview fulfils the following functions:
- Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
- Validates and strengthens in-house secondary research findings
- Develops the analysis team’s expertise and market understanding
Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:
- Industry participants: VPs, business development managers, market intelligence managers and national sales managers
- Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.
Below is the breakup of our primary respondents by company, designation, and region:
Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.
- Data Analysis:
Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.
- 3.1 Macro-Economic Factor Analysis:
We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.
- 3.2 Country Level Data:
Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.
- 3.3 Company Profile:
The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.
- 3.4 Developing Base Number:
Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.
- Data Triangulation and Final Review:
The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.
We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.
We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.
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