The Wafer Back Grinding Tape Market is expected to register a CAGR of 4.4% from 2025 to 2031, with a market size expanding from US$ XX million in 2024 to US$ XX Million by 2031.
The report is segmented by Type (UV Curable, Non-UV); Wafer Size (6-Inch, 8-Inch, 12-Inch, Others). The global analysis is further broken-down at regional level and major countries. The Report Offers the Value in USD for the above analysis and segments.
Purpose of the ReportThe report Wafer Back Grinding Tape Market by The Insight Partners aims to describe the present landscape and future growth, top driving factors, challenges, and opportunities. This will provide insights to various business stakeholders, such as:
- Technology Providers/Manufacturers: To understand the evolving market dynamics and know the potential growth opportunities, enabling them to make informed strategic decisions.
- Investors: To conduct a comprehensive trend analysis regarding the market growth rate, market financial projections, and opportunities that exist across the value chain.
- Regulatory bodies: To regulate policies and police activities in the market with the aim of minimizing abuse, preserving investor trust and confidence, and upholding the integrity and stability of the market.
Wafer Back Grinding Tape Market Segmentation
Type- UV Curable
- Non-UV
- 6-Inch
- 8-Inch
- 12-Inch
- Others
Strategic Insights
Wafer Back Grinding Tape Market Growth Drivers- Increasing Demand for Semiconductors in Consumer Electronics: The growing demand for consumer electronics, including smartphones, tablets, laptops, and wearables, is driving the need for semiconductors. Wafer back grinding tapes are essential in the semiconductor manufacturing process, particularly for thinning and grinding silicon wafers. As the semiconductor industry expands, driven by the proliferation of consumer electronic devices, the demand for wafer back grinding tapes increases significantly.
- Miniaturization of Electronic Devices and Advancements in Packaging Technologies: The trend towards miniaturization in electronic devices and advancements in packaging technologies, such as system-in-package (SiP) and 3D ICs, require precise and efficient wafer thinning processes. Wafer back grinding tapes are critical in the thinning of wafers to achieve smaller and more compact chips with high-performance capabilities. This miniaturization trend in consumer electronics, automotive, and telecommunications drives the demand for back grinding tapes to support these innovations.
- Growth of the Automotive Industry and Demand for Advanced Driver Assistance Systems (ADAS): The increasing adoption of advanced driver assistance systems (ADAS) in automobiles, driven by the rise in electric vehicles (EVs) and autonomous driving technologies, is fueling the demand for high-performance semiconductors. Wafer back grinding tapes are crucial in processing wafers used in automotive semiconductor applications, supporting the growing need for semiconductor components in ADAS, sensors, and power electronics in vehicles
- Shift Towards Thinner and More Flexible Wafer Back Grinding Tapes: There is a growing trend toward the development of thinner and more flexible wafer back grinding tapes to accommodate the increasing need for ultra-thin wafers. These tapes are designed to provide better adhesion, reliability, and handling during the back grinding process, making them ideal for advanced semiconductor applications, such as stacked and flexible devices. Manufacturers are focusing on improving the performance characteristics of these tapes to meet the demands of next-generation semiconductor packaging.
- Adoption of Eco-Friendly and Sustainable Wafer Back Grinding Tapes: Environmental concerns are pushing the semiconductor industry towards adopting more eco-friendly and sustainable materials in their manufacturing processes. There is a noticeable trend toward the use of environmentally friendly, recyclable, or biodegradable wafer back grinding tapes. These tapes are designed to minimize waste, reduce harmful chemical use, and contribute to greener manufacturing practices, aligning with industry-wide sustainability goals.
- Integration of Advanced Adhesive Technologies in Wafer Back Grinding Tapes: To enhance the performance and efficiency of wafer back grinding tapes, there is an increasing trend in the integration of advanced adhesive technologies. These new adhesives are designed to provide superior bonding strength, reduce defects, and enable smoother and faster grinding processes. Additionally, advanced adhesives help maintain wafer integrity during thinning and grinding, addressing challenges such as wafer breakage and stress. This trend is particularly beneficial for applications that require high precision, such as MEMS (Micro-Electro-Mechanical Systems) and RF (Radio Frequency) devices.
- Rise in Demand for 5G Technology and Internet of Things (IoT) Devices: The growing adoption of 5G technology and the expansion of IoT devices are creating new opportunities for the wafer back grinding tape market. These technologies rely heavily on advanced semiconductor components, such as RF chips and sensors, which require wafer thinning processes during production. As 5G infrastructure and IoT applications grow, the demand for wafer back grinding tapes will rise to support the increasing production of these advanced semiconductor components.
- Advancements in Wafer-Level Packaging (WLP) and 3D IC Technologies: Wafer-level packaging (WLP) and 3D IC technologies are gaining traction as semiconductor packaging methods that offer improved performance, reduced size, and lower costs. These technologies require precise wafer thinning processes, for which wafer back grinding tapes are essential. As WLP and 3D IC technologies continue to evolve, they present a significant opportunity for the wafer back grinding tape market, as these methods require the use of advanced materials to support high-density packaging and miniaturization
Market Report Scope
Key Selling Points
- Comprehensive Coverage: The report comprehensively covers the analysis of products, services, types, and end users of the Wafer Back Grinding Tape Market, providing a holistic landscape.
- Expert Analysis: The report is compiled based on the in-depth understanding of industry experts and analysts.
- Up-to-date Information: The report assures business relevance due to its coverage of recent information and data trends.
- Customization Options: This report can be customized to cater to specific client requirements and suit the business strategies aptly.
The research report on the Wafer Back Grinding Tape Market can, therefore, help spearhead the trail of decoding and understanding the industry scenario and growth prospects. Although there can be a few valid concerns, the overall benefits of this report tend to outweigh the disadvantages.
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- Sample PDF showcases the content structure and the nature of the information with qualitative and quantitative analysis.
- Request discounts available for Start-Ups & Universities
- Sample PDF showcases the content structure and the nature of the information with qualitative and quantitative analysis.
- Request discounts available for Start-Ups & Universities
Report Coverage
Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends
Segment Covered
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to segments covered.
Regional Scope
North America, Europe, Asia Pacific, Middle East & Africa, South & Central America
Country Scope
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to country scope.
Frequently Asked Questions
Some of the customization options available based on the request are an additional 3-5 company profiles and country-specific analysis of 3-5 countries of your choice. Customizations are to be requested/discussed before making final order confirmation# as our team would review the same and check the feasibility
The report can be delivered in PDF/PPT format; we can also share excel dataset based on the request
Technological Innovations in Adhesive Materials is anticipated to play a significant role in the global Wafer Back Grinding Tape market in the coming years
The major factors driving the Wafer Back Grinding Tape market are Growth in Semiconductor Industry and Rise in Demand for Advanced Packaging Solutions.
The Wafer Back Grinding Tape Market is estimated to witness a CAGR of 4.4% from 2023 to 2031
1. INTRODUCTION
1.1. SCOPE OF THE STUDY
1.2. THE INSIGHT PARTNERS RESEARCH REPORT GUIDANCE
1.3. MARKET SEGMENTATION
1.3.1 Wafer Back Grinding Tape Market - By Type
1.3.2 Wafer Back Grinding Tape Market - By Wafer Size
1.3.3 Wafer Back Grinding Tape Market - By Region
1.3.3.1 By Country
2. KEY TAKEAWAYS
3. RESEARCH METHODOLOGY
4. WAFER BACK GRINDING TAPE MARKET LANDSCAPE
4.1. OVERVIEW
4.2. PORTER'S FIVE FORCES ANALYSIS
4.2.1 Bargaining Power of Buyers
4.2.1 Bargaining Power of Suppliers
4.2.1 Threat of Substitute
4.2.1 Threat of New Entrants
4.2.1 Competitive Rivalry
4.3. ECOSYSTEM ANALYSIS
4.4. EXPERT OPINIONS
5. WAFER BACK GRINDING TAPE MARKET - KEY MARKET DYNAMICS
5.1. KEY MARKET DRIVERS
5.2. KEY MARKET RESTRAINTS
5.3. KEY MARKET OPPORTUNITIES
5.4. FUTURE TRENDS
5.5. IMPACT ANALYSIS OF DRIVERS AND RESTRAINTS
6. WAFER BACK GRINDING TAPE MARKET - GLOBAL MARKET ANALYSIS
6.1. WAFER BACK GRINDING TAPE - GLOBAL MARKET OVERVIEW
6.2. WAFER BACK GRINDING TAPE - GLOBAL MARKET AND FORECAST TO 2027
6.3. MARKET POSITIONING/MARKET SHARE
7. WAFER BACK GRINDING TAPE MARKET - REVENUE AND FORECASTS TO 2027 - TYPE
7.1. OVERVIEW
7.2. TYPE MARKET FORECASTS AND ANALYSIS
7.3. UV CURABLE
7.3.1. Overview
7.3.2. UV Curable Market Forecast and Analysis
7.4. NON-UV
7.4.1. Overview
7.4.2. Non-UV Market Forecast and Analysis
8. WAFER BACK GRINDING TAPE MARKET - REVENUE AND FORECASTS TO 2027 - WAFER SIZE
8.1. OVERVIEW
8.2. WAFER SIZE MARKET FORECASTS AND ANALYSIS
8.3. 6-INCH
8.3.1. Overview
8.3.2. 6-Inch Market Forecast and Analysis
8.4. 8-INCH
8.4.1. Overview
8.4.2. 8-Inch Market Forecast and Analysis
8.5. 12-INCH
8.5.1. Overview
8.5.2. 12-Inch Market Forecast and Analysis
8.6. OTHERS
8.6.1. Overview
8.6.2. Others Market Forecast and Analysis
9. WAFER BACK GRINDING TAPE MARKET REVENUE AND FORECASTS TO 2027 - GEOGRAPHICAL ANALYSIS
9.1. NORTH AMERICA
9.1.1 North America Wafer Back Grinding Tape Market Overview
9.1.2 North America Wafer Back Grinding Tape Market Forecasts and Analysis
9.1.3 North America Wafer Back Grinding Tape Market Forecasts and Analysis - By Type
9.1.4 North America Wafer Back Grinding Tape Market Forecasts and Analysis - By Wafer Size
9.1.5 North America Wafer Back Grinding Tape Market Forecasts and Analysis - By Countries
9.1.5.1 United States Wafer Back Grinding Tape Market
9.1.5.1.1 United States Wafer Back Grinding Tape Market by Type
9.1.5.1.2 United States Wafer Back Grinding Tape Market by Wafer Size
9.1.5.2 Canada Wafer Back Grinding Tape Market
9.1.5.2.1 Canada Wafer Back Grinding Tape Market by Type
9.1.5.2.2 Canada Wafer Back Grinding Tape Market by Wafer Size
9.1.5.3 Mexico Wafer Back Grinding Tape Market
9.1.5.3.1 Mexico Wafer Back Grinding Tape Market by Type
9.1.5.3.2 Mexico Wafer Back Grinding Tape Market by Wafer Size
9.2. EUROPE
9.2.1 Europe Wafer Back Grinding Tape Market Overview
9.2.2 Europe Wafer Back Grinding Tape Market Forecasts and Analysis
9.2.3 Europe Wafer Back Grinding Tape Market Forecasts and Analysis - By Type
9.2.4 Europe Wafer Back Grinding Tape Market Forecasts and Analysis - By Wafer Size
9.2.5 Europe Wafer Back Grinding Tape Market Forecasts and Analysis - By Countries
9.2.5.1 Germany Wafer Back Grinding Tape Market
9.2.5.1.1 Germany Wafer Back Grinding Tape Market by Type
9.2.5.1.2 Germany Wafer Back Grinding Tape Market by Wafer Size
9.2.5.2 France Wafer Back Grinding Tape Market
9.2.5.2.1 France Wafer Back Grinding Tape Market by Type
9.2.5.2.2 France Wafer Back Grinding Tape Market by Wafer Size
9.2.5.3 Italy Wafer Back Grinding Tape Market
9.2.5.3.1 Italy Wafer Back Grinding Tape Market by Type
9.2.5.3.2 Italy Wafer Back Grinding Tape Market by Wafer Size
9.2.5.4 United Kingdom Wafer Back Grinding Tape Market
9.2.5.4.1 United Kingdom Wafer Back Grinding Tape Market by Type
9.2.5.4.2 United Kingdom Wafer Back Grinding Tape Market by Wafer Size
9.2.5.5 Russia Wafer Back Grinding Tape Market
9.2.5.5.1 Russia Wafer Back Grinding Tape Market by Type
9.2.5.5.2 Russia Wafer Back Grinding Tape Market by Wafer Size
9.2.5.6 Rest of Europe Wafer Back Grinding Tape Market
9.2.5.6.1 Rest of Europe Wafer Back Grinding Tape Market by Type
9.2.5.6.2 Rest of Europe Wafer Back Grinding Tape Market by Wafer Size
9.3. ASIA-PACIFIC
9.3.1 Asia-Pacific Wafer Back Grinding Tape Market Overview
9.3.2 Asia-Pacific Wafer Back Grinding Tape Market Forecasts and Analysis
9.3.3 Asia-Pacific Wafer Back Grinding Tape Market Forecasts and Analysis - By Type
9.3.4 Asia-Pacific Wafer Back Grinding Tape Market Forecasts and Analysis - By Wafer Size
9.3.5 Asia-Pacific Wafer Back Grinding Tape Market Forecasts and Analysis - By Countries
9.3.5.1 Australia Wafer Back Grinding Tape Market
9.3.5.1.1 Australia Wafer Back Grinding Tape Market by Type
9.3.5.1.2 Australia Wafer Back Grinding Tape Market by Wafer Size
9.3.5.2 China Wafer Back Grinding Tape Market
9.3.5.2.1 China Wafer Back Grinding Tape Market by Type
9.3.5.2.2 China Wafer Back Grinding Tape Market by Wafer Size
9.3.5.3 India Wafer Back Grinding Tape Market
9.3.5.3.1 India Wafer Back Grinding Tape Market by Type
9.3.5.3.2 India Wafer Back Grinding Tape Market by Wafer Size
9.3.5.4 Japan Wafer Back Grinding Tape Market
9.3.5.4.1 Japan Wafer Back Grinding Tape Market by Type
9.3.5.4.2 Japan Wafer Back Grinding Tape Market by Wafer Size
9.3.5.5 South Korea Wafer Back Grinding Tape Market
9.3.5.5.1 South Korea Wafer Back Grinding Tape Market by Type
9.3.5.5.2 South Korea Wafer Back Grinding Tape Market by Wafer Size
9.3.5.6 Rest of Asia-Pacific Wafer Back Grinding Tape Market
9.3.5.6.1 Rest of Asia-Pacific Wafer Back Grinding Tape Market by Type
9.3.5.6.2 Rest of Asia-Pacific Wafer Back Grinding Tape Market by Wafer Size
9.4. MIDDLE EAST AND AFRICA
9.4.1 Middle East and Africa Wafer Back Grinding Tape Market Overview
9.4.2 Middle East and Africa Wafer Back Grinding Tape Market Forecasts and Analysis
9.4.3 Middle East and Africa Wafer Back Grinding Tape Market Forecasts and Analysis - By Type
9.4.4 Middle East and Africa Wafer Back Grinding Tape Market Forecasts and Analysis - By Wafer Size
9.4.5 Middle East and Africa Wafer Back Grinding Tape Market Forecasts and Analysis - By Countries
9.4.5.1 South Africa Wafer Back Grinding Tape Market
9.4.5.1.1 South Africa Wafer Back Grinding Tape Market by Type
9.4.5.1.2 South Africa Wafer Back Grinding Tape Market by Wafer Size
9.4.5.2 Saudi Arabia Wafer Back Grinding Tape Market
9.4.5.2.1 Saudi Arabia Wafer Back Grinding Tape Market by Type
9.4.5.2.2 Saudi Arabia Wafer Back Grinding Tape Market by Wafer Size
9.4.5.3 U.A.E Wafer Back Grinding Tape Market
9.4.5.3.1 U.A.E Wafer Back Grinding Tape Market by Type
9.4.5.3.2 U.A.E Wafer Back Grinding Tape Market by Wafer Size
9.4.5.4 Rest of Middle East and Africa Wafer Back Grinding Tape Market
9.4.5.4.1 Rest of Middle East and Africa Wafer Back Grinding Tape Market by Type
9.4.5.4.2 Rest of Middle East and Africa Wafer Back Grinding Tape Market by Wafer Size
9.5. SOUTH AND CENTRAL AMERICA
9.5.1 South and Central America Wafer Back Grinding Tape Market Overview
9.5.2 South and Central America Wafer Back Grinding Tape Market Forecasts and Analysis
9.5.3 South and Central America Wafer Back Grinding Tape Market Forecasts and Analysis - By Type
9.5.4 South and Central America Wafer Back Grinding Tape Market Forecasts and Analysis - By Wafer Size
9.5.5 South and Central America Wafer Back Grinding Tape Market Forecasts and Analysis - By Countries
9.5.5.1 Brazil Wafer Back Grinding Tape Market
9.5.5.1.1 Brazil Wafer Back Grinding Tape Market by Type
9.5.5.1.2 Brazil Wafer Back Grinding Tape Market by Wafer Size
9.5.5.2 Argentina Wafer Back Grinding Tape Market
9.5.5.2.1 Argentina Wafer Back Grinding Tape Market by Type
9.5.5.2.2 Argentina Wafer Back Grinding Tape Market by Wafer Size
9.5.5.3 Rest of South and Central America Wafer Back Grinding Tape Market
9.5.5.3.1 Rest of South and Central America Wafer Back Grinding Tape Market by Type
9.5.5.3.2 Rest of South and Central America Wafer Back Grinding Tape Market by Wafer Size
10. INDUSTRY LANDSCAPE
10.1. MERGERS AND ACQUISITIONS
10.2. AGREEMENTS, COLLABORATIONS AND JOIN VENTURES
10.3. NEW PRODUCT LAUNCHES
10.4. EXPANSIONS AND OTHER STRATEGIC DEVELOPMENTS
11. WAFER BACK GRINDING TAPE MARKET, KEY COMPANY PROFILES
11.1. AI TECHNOLOGY, INC.
11.1.1. Key Facts
11.1.2. Business Description
11.1.3. Products and Services
11.1.4. Financial Overview
11.1.5. SWOT Analysis
11.1.6. Key Developments
11.2. AMC CO., LTD
11.2.1. Key Facts
11.2.2. Business Description
11.2.3. Products and Services
11.2.4. Financial Overview
11.2.5. SWOT Analysis
11.2.6. Key Developments
11.3. DENKA COMPANY LIMITED
11.3.1. Key Facts
11.3.2. Business Description
11.3.3. Products and Services
11.3.4. Financial Overview
11.3.5. SWOT Analysis
11.3.6. Key Developments
11.4. FORCE-ONE APPLIED MATERIALS
11.4.1. Key Facts
11.4.2. Business Description
11.4.3. Products and Services
11.4.4. Financial Overview
11.4.5. SWOT Analysis
11.4.6. Key Developments
11.5. FURUKAWA ELECTRIC CO., LTD.
11.5.1. Key Facts
11.5.2. Business Description
11.5.3. Products and Services
11.5.4. Financial Overview
11.5.5. SWOT Analysis
11.5.6. Key Developments
11.6. LINTEC CORPORATION
11.6.1. Key Facts
11.6.2. Business Description
11.6.3. Products and Services
11.6.4. Financial Overview
11.6.5. SWOT Analysis
11.6.6. Key Developments
11.7. LOADPOINT
11.7.1. Key Facts
11.7.2. Business Description
11.7.3. Products and Services
11.7.4. Financial Overview
11.7.5. SWOT Analysis
11.7.6. Key Developments
11.8. MITSUI CHEMICALS
11.8.1. Key Facts
11.8.2. Business Description
11.8.3. Products and Services
11.8.4. Financial Overview
11.8.5. SWOT Analysis
11.8.6. Key Developments
11.9. NITTO DENKO CORPORATION
11.9.1. Key Facts
11.9.2. Business Description
11.9.3. Products and Services
11.9.4. Financial Overview
11.9.5. SWOT Analysis
11.9.6. Key Developments
11.10. PANTECH TAPE CO., LTD.
11.10.1. Key Facts
11.10.2. Business Description
11.10.3. Products and Services
11.10.4. Financial Overview
11.10.5. SWOT Analysis
11.10.6. Key Developments
12. APPENDIX
12.1. ABOUT THE INSIGHT PARTNERS
12.2. GLOSSARY OF TERMS
1. AI Technology, Inc.
2. AMC Co., Ltd
3. Denka Company Limited
4. Force-One Applied Materials
5. FURUKAWA ELECTRIC CO., LTD.
6. LINTEC Corporation
7. Loadpoint
8. Mitsui Chemicals
9. NITTO DENKO CORPORATION
10. Pantech Tape Co., Ltd.
The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.
- Data Collection and Secondary Research:
As a market research and consulting firm operating from a decade, we have published many reports and advised several clients across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.
Several associations trade associates, technical forums, institutes, societies and organizations are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in the last 3 years are scrutinized and analyzed to understand the current market trends.
- Primary Research:
The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.
For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/Sales Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.
A typical research interview fulfils the following functions:
- Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
- Validates and strengthens in-house secondary research findings
- Develops the analysis team’s expertise and market understanding
Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:
- Industry participants: VPs, business development managers, market intelligence managers and national sales managers
- Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.
Below is the breakup of our primary respondents by company, designation, and region:
Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.
- Data Analysis:
Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.
- 3.1 Macro-Economic Factor Analysis:
We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.
- 3.2 Country Level Data:
Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.
- 3.3 Company Profile:
The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.
- 3.4 Developing Base Number:
Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.
- Data Triangulation and Final Review:
The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.
We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.
We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.
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