Wafer Level Packaging Market SWOT Analysis by 2031
Wafer level packaging (WLP) is a chip-scale package (CSP) technology, and it enables integration of wafer fab, test, packaging, and burn-in at wafer level to simplify the manufacturing procedure. With the growing demand for smaller and faster consumer electronics, the market is expected to experience a positive impact. The broad use of WLP in radar technology has empowered it to become a crucial part of self-driving cars. Further, the healthcare industry and wearable devices market would hugely utilize wafer level packaging technology. The boost in these industries would positively impact the wafer level packaging market during the forecast period.
MARKET SCOPE
The "Global Wafer Level Packaging Market Analysis to 2031" is a specialized and in-depth study with a special focus on the global market trend analysis. The report aims to provide an overview of the wafer level packaging market with detailed market segmentation by packaging type, process type, application, and geography. The report provides key statistics on the market status of the leading wafer level packaging market players and offers key trends and opportunities in the market.
MARKET SEGMENTATION
- Based on packaging type, the global wafer level packaging market is segmented into flip chips, fan-out wafer level packaging, and through-silicon via.
- On the basis of process type, the market is segmented into Electrochemical Deposition (ECD), Physical Vapor Deposition (PVD), etch, Chemical Vapor Deposition (CVD), and Chemical Mechanical Planarization (CMP).
- Based on application, the market is segmented into electronics and semiconductor, aerospace and defense, automotive, and others.
MARKET DYNAMICS
Drivers:
- The growing requirement for circuit miniaturization in microelectronic devices is driving the growth of the wafer level packaging market.
- Demand for low cost, small sizes, and high performance of packaging solutions are anticipated to witness massive demand during the forecast period.
Restraints:
- The manufacturing cost is the major factor that may restrain the growth of the wafer level packaging market.
REGIONAL FRAMEWORK
The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides an overview and forecast of the global market based on various segments. It also provides market size and forecast estimates from the year 2021 to 2031 with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), the Middle East and Africa (MEA), and South America. The wafer level packaging market by each region is later sub-segmented by respective countries and segments. The report covers the analysis and forecast of 18 countries globally along with the current trend and opportunities prevailing in the region.
The report analyzes factors affecting the market from both demand and supply side and further evaluates market dynamics affecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, MEA, and South America after evaluating political, economic, social and technological factors affecting the wafer level packaging market in these regions.
IMPACT OF COVID-19 ON WAFER LEVEL PACKAGING MARKET
COVID-19 first began in Wuhan (China) during December 2019 and since then it has spread at a fast pace across the globe. The US, India, Brazil, Russia, France, the UK, Turkey, Italy, and Spain are some of the worst affected countries in terms confirmed cases and reported deaths. The COVID-19 has been affecting economies and industries in various countries due to lockdowns, travel bans, and business shutdowns. Shutdown of various plants and factories has affected the global supply chains and negatively impacted the manufacturing, delivery schedules, and sales of products in global market. Few companies have already announced possible delays in product deliveries and slump in future sales of their products. In addition to this, the global travel bans imposed by countries in Europe, Asia-Pacific, and North America are affecting the business collaborations and partnerships opportunities.
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- Sample PDF showcases the content structure and the nature of the information with qualitative and quantitative analysis.
- Request discounts available for Start-Ups & Universities
The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides an overview and forecast of the global market based on various segments. It also provides market size and forecast estimates from the year 2021 to 2031 with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), the Middle East and Africa (MEA), and South America. The wafer level packaging market by each region is later sub-segmented by respective countries and segments. The report covers the analysis and forecast of 18 countries globally along with the current trend and opportunities prevailing in the region.
The report analyzes factors affecting the market from both demand and supply side and further evaluates market dynamics affecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, MEA, and South America after evaluating political, economic, social and technological factors affecting the wafer level packaging market in these regions.
IMPACT OF COVID-19 ON WAFER LEVEL PACKAGING MARKET
COVID-19 first began in Wuhan (China) during December 2019 and since then it has spread at a fast pace across the globe. The US, India, Brazil, Russia, France, the UK, Turkey, Italy, and Spain are some of the worst affected countries in terms confirmed cases and reported deaths. The COVID-19 has been affecting economies and industries in various countries due to lockdowns, travel bans, and business shutdowns. Shutdown of various plants and factories has affected the global supply chains and negatively impacted the manufacturing, delivery schedules, and sales of products in global market. Few companies have already announced possible delays in product deliveries and slump in future sales of their products. In addition to this, the global travel bans imposed by countries in Europe, Asia-Pacific, and North America are affecting the business collaborations and partnerships opportunities.
MARKET PLAYERS
The report covers key developments in the wafer level packaging market as organic and inorganic growth strategies. Various companies are focusing on organic growth strategies such as product launches, product approvals and others such as patents and events. Inorganic growth strategies activities witnessed in the market were acquisitions, and partnership & collaborations. These activities have paved way for the expansion of business and customer base of market players. The market payers from wafer level packaging market are anticipated to lucrative growth opportunities in the future with the rising demand in the global market.
The report also includes the profiles of key companies along with their SWOT analysis and market strategies in the wafer level packaging market. In addition, the report focuses on leading industry players with information such as company profiles, components, and services offered, financial information of the last 3 years, the key development in the past five years.
- Amkor Technology
- Applied Materials, Inc.
- Brewer Science, Inc.
- Deca Technologies
- Fujitsu
- Infineon Technologies AG
- LAM RESEARCH CORPORATION
- Siliconware Precision Industries Co., Ltd.
- STATS ChipPAC Ltd
- Tokyo Electron Limited
- Sample PDF showcases the content structure and the nature of the information with qualitative and quantitative analysis.
- Request discounts available for Start-Ups & Universities
Report Coverage
Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends
Segment Covered
This text is related
to segments covered.
Regional Scope
North America, Europe, Asia Pacific, Middle East & Africa, South & Central America
Country Scope
This text is related
to country scope.
1. INTRODUCTION
1.1. SCOPE OF THE STUDY
1.2. THE INSIGHT PARTNERS RESEARCH REPORT GUIDANCE
1.3. MARKET SEGMENTATION
1.3.1 Wafer Level Packaging Market - By Packaging Type
1.3.2 Wafer Level Packaging Market - By Process Type
1.3.3 Wafer Level Packaging Market - By Application
1.3.4 Wafer Level Packaging Market - By Region
1.3.4.1 By Country
2. KEY TAKEAWAYS
3. RESEARCH METHODOLOGY
4. WAFER LEVEL PACKAGING MARKET LANDSCAPE
4.1. OVERVIEW
4.2. PORTER'S FIVE FORCES ANALYSIS
4.2.1 Bargaining Power of Buyers
4.2.1 Bargaining Power of Suppliers
4.2.1 Threat of Substitute
4.2.1 Threat of New Entrants
4.2.1 Competitive Rivalry
4.3. ECOSYSTEM ANALYSIS
4.4. EXPERT OPINIONS
5. WAFER LEVEL PACKAGING MARKET - KEY MARKET DYNAMICS
5.1. KEY MARKET DRIVERS
5.2. KEY MARKET RESTRAINTS
5.3. KEY MARKET OPPORTUNITIES
5.4. FUTURE TRENDS
5.5. IMPACT ANALYSIS OF DRIVERS AND RESTRAINTS
6. WAFER LEVEL PACKAGING MARKET - GLOBAL MARKET ANALYSIS
6.1. WAFER LEVEL PACKAGING - GLOBAL MARKET OVERVIEW
6.2. WAFER LEVEL PACKAGING - GLOBAL MARKET AND FORECAST TO 2028
6.3. MARKET POSITIONING/MARKET SHARE
7. WAFER LEVEL PACKAGING MARKET - REVENUE AND FORECASTS TO 2028 - PACKAGING TYPE
7.1. OVERVIEW
7.2. PACKAGING TYPE MARKET FORECASTS AND ANALYSIS
7.3. FLIP CHIPS
7.3.1. Overview
7.3.2. Flip Chips Market Forecast and Analysis
7.4. FAN-OUT WAFER LEVEL PACKAGING
7.4.1. Overview
7.4.2. Fan-out Wafer Level Packaging Market Forecast and Analysis
7.5. THROUGH-SILICON VIA
7.5.1. Overview
7.5.2. Through-Silicon Via Market Forecast and Analysis
8. WAFER LEVEL PACKAGING MARKET - REVENUE AND FORECASTS TO 2028 - PROCESS TYPE
8.1. OVERVIEW
8.2. PROCESS TYPE MARKET FORECASTS AND ANALYSIS
8.3. ELECTROCHEMICAL DEPOSITION (ECD)
8.3.1. Overview
8.3.2. Electrochemical Deposition (ECD) Market Forecast and Analysis
8.4. PHYSICAL VAPOR DEPOSITION (PVD)
8.4.1. Overview
8.4.2. Physical Vapor Deposition (PVD) Market Forecast and Analysis
8.5. ETCH
8.5.1. Overview
8.5.2. Etch Market Forecast and Analysis
8.6. CHEMICAL VAPOR DEPOSITION (CVD)
8.6.1. Overview
8.6.2. Chemical Vapor Deposition (CVD) Market Forecast and Analysis
8.7. CHEMICAL MECHANICAL PLANARIZATION (CMP)
8.7.1. Overview
8.7.2. Chemical Mechanical Planarization (CMP) Market Forecast and Analysis
9. WAFER LEVEL PACKAGING MARKET - REVENUE AND FORECASTS TO 2028 - APPLICATION
9.1. OVERVIEW
9.2. APPLICATION MARKET FORECASTS AND ANALYSIS
9.3. ELECTRONICS AND SEMICONDUCTOR
9.3.1. Overview
9.3.2. Electronics and Semiconductor Market Forecast and Analysis
9.4. AEROSPACE AND DEFENSE
9.4.1. Overview
9.4.2. Aerospace and Defense Market Forecast and Analysis
9.5. AUTOMOTIVE
9.5.1. Overview
9.5.2. Automotive Market Forecast and Analysis
9.6. OTHERS
9.6.1. Overview
9.6.2. Others Market Forecast and Analysis
10. WAFER LEVEL PACKAGING MARKET REVENUE AND FORECASTS TO 2028 - GEOGRAPHICAL ANALYSIS
10.1. NORTH AMERICA
10.1.1 North America Wafer Level Packaging Market Overview
10.1.2 North America Wafer Level Packaging Market Forecasts and Analysis
10.1.3 North America Wafer Level Packaging Market Forecasts and Analysis - By Packaging Type
10.1.4 North America Wafer Level Packaging Market Forecasts and Analysis - By Process Type
10.1.5 North America Wafer Level Packaging Market Forecasts and Analysis - By Application
10.1.6 North America Wafer Level Packaging Market Forecasts and Analysis - By Countries
10.1.6.1 United States Wafer Level Packaging Market
10.1.6.1.1 United States Wafer Level Packaging Market by Packaging Type
10.1.6.1.2 United States Wafer Level Packaging Market by Process Type
10.1.6.1.3 United States Wafer Level Packaging Market by Application
10.1.6.2 Canada Wafer Level Packaging Market
10.1.6.2.1 Canada Wafer Level Packaging Market by Packaging Type
10.1.6.2.2 Canada Wafer Level Packaging Market by Process Type
10.1.6.2.3 Canada Wafer Level Packaging Market by Application
10.1.6.3 Mexico Wafer Level Packaging Market
10.1.6.3.1 Mexico Wafer Level Packaging Market by Packaging Type
10.1.6.3.2 Mexico Wafer Level Packaging Market by Process Type
10.1.6.3.3 Mexico Wafer Level Packaging Market by Application
10.2. EUROPE
10.2.1 Europe Wafer Level Packaging Market Overview
10.2.2 Europe Wafer Level Packaging Market Forecasts and Analysis
10.2.3 Europe Wafer Level Packaging Market Forecasts and Analysis - By Packaging Type
10.2.4 Europe Wafer Level Packaging Market Forecasts and Analysis - By Process Type
10.2.5 Europe Wafer Level Packaging Market Forecasts and Analysis - By Application
10.2.6 Europe Wafer Level Packaging Market Forecasts and Analysis - By Countries
10.2.6.1 Germany Wafer Level Packaging Market
10.2.6.1.1 Germany Wafer Level Packaging Market by Packaging Type
10.2.6.1.2 Germany Wafer Level Packaging Market by Process Type
10.2.6.1.3 Germany Wafer Level Packaging Market by Application
10.2.6.2 France Wafer Level Packaging Market
10.2.6.2.1 France Wafer Level Packaging Market by Packaging Type
10.2.6.2.2 France Wafer Level Packaging Market by Process Type
10.2.6.2.3 France Wafer Level Packaging Market by Application
10.2.6.3 Italy Wafer Level Packaging Market
10.2.6.3.1 Italy Wafer Level Packaging Market by Packaging Type
10.2.6.3.2 Italy Wafer Level Packaging Market by Process Type
10.2.6.3.3 Italy Wafer Level Packaging Market by Application
10.2.6.4 United Kingdom Wafer Level Packaging Market
10.2.6.4.1 United Kingdom Wafer Level Packaging Market by Packaging Type
10.2.6.4.2 United Kingdom Wafer Level Packaging Market by Process Type
10.2.6.4.3 United Kingdom Wafer Level Packaging Market by Application
10.2.6.5 Rest of Europe Wafer Level Packaging Market
10.2.6.5.1 Rest of Europe Wafer Level Packaging Market by Packaging Type
10.2.6.5.2 Rest of Europe Wafer Level Packaging Market by Process Type
10.2.6.5.3 Rest of Europe Wafer Level Packaging Market by Application
10.3. ASIA-PACIFIC
10.3.1 Asia-Pacific Wafer Level Packaging Market Overview
10.3.2 Asia-Pacific Wafer Level Packaging Market Forecasts and Analysis
10.3.3 Asia-Pacific Wafer Level Packaging Market Forecasts and Analysis - By Packaging Type
10.3.4 Asia-Pacific Wafer Level Packaging Market Forecasts and Analysis - By Process Type
10.3.5 Asia-Pacific Wafer Level Packaging Market Forecasts and Analysis - By Application
10.3.6 Asia-Pacific Wafer Level Packaging Market Forecasts and Analysis - By Countries
10.3.6.1 China Wafer Level Packaging Market
10.3.6.1.1 China Wafer Level Packaging Market by Packaging Type
10.3.6.1.2 China Wafer Level Packaging Market by Process Type
10.3.6.1.3 China Wafer Level Packaging Market by Application
10.3.6.2 India Wafer Level Packaging Market
10.3.6.2.1 India Wafer Level Packaging Market by Packaging Type
10.3.6.2.2 India Wafer Level Packaging Market by Process Type
10.3.6.2.3 India Wafer Level Packaging Market by Application
10.3.6.3 Japan Wafer Level Packaging Market
10.3.6.3.1 Japan Wafer Level Packaging Market by Packaging Type
10.3.6.3.2 Japan Wafer Level Packaging Market by Process Type
10.3.6.3.3 Japan Wafer Level Packaging Market by Application
10.3.6.4 South Korea Wafer Level Packaging Market
10.3.6.4.1 South Korea Wafer Level Packaging Market by Packaging Type
10.3.6.4.2 South Korea Wafer Level Packaging Market by Process Type
10.3.6.4.3 South Korea Wafer Level Packaging Market by Application
10.3.6.5 Rest of Asia-Pacific Wafer Level Packaging Market
10.3.6.5.1 Rest of Asia-Pacific Wafer Level Packaging Market by Packaging Type
10.3.6.5.2 Rest of Asia-Pacific Wafer Level Packaging Market by Process Type
10.3.6.5.3 Rest of Asia-Pacific Wafer Level Packaging Market by Application
10.4. REST OF THE WORLD
10.4.1 Rest of the World Wafer Level Packaging Market Overview
10.4.2 Rest of the World Wafer Level Packaging Market Forecasts and Analysis
10.4.3 Rest of the World Wafer Level Packaging Market Forecasts and Analysis - By Packaging Type
10.4.4 Rest of the World Wafer Level Packaging Market Forecasts and Analysis - By Process Type
10.4.5 Rest of the World Wafer Level Packaging Market Forecasts and Analysis - By Application
10.4.6 Rest of the World Wafer Level Packaging Market Forecasts and Analysis - By Countries
10.4.6.1 MEA Wafer Level Packaging Market
10.4.6.1.1 MEA Wafer Level Packaging Market by Packaging Type
10.4.6.1.2 MEA Wafer Level Packaging Market by Process Type
10.4.6.1.3 MEA Wafer Level Packaging Market by Application
10.4.6.2 SAM Wafer Level Packaging Market
10.4.6.2.1 SAM Wafer Level Packaging Market by Packaging Type
10.4.6.2.2 SAM Wafer Level Packaging Market by Process Type
10.4.6.2.3 SAM Wafer Level Packaging Market by Application
11. INDUSTRY LANDSCAPE
11.1. MERGERS AND ACQUISITIONS
11.2. AGREEMENTS, COLLABORATIONS AND JOIN VENTURES
11.3. NEW PRODUCT LAUNCHES
11.4. EXPANSIONS AND OTHER STRATEGIC DEVELOPMENTS
12. WAFER LEVEL PACKAGING MARKET, KEY COMPANY PROFILES
12.1. AMKOR TECHNOLOGY
12.1.1. Key Facts
12.1.2. Business Description
12.1.3. Products and Services
12.1.4. Financial Overview
12.1.5. SWOT Analysis
12.1.6. Key Developments
12.2. APPLIED MATERIALS, INC.
12.2.1. Key Facts
12.2.2. Business Description
12.2.3. Products and Services
12.2.4. Financial Overview
12.2.5. SWOT Analysis
12.2.6. Key Developments
12.3. BREWER SCIENCE, INC.
12.3.1. Key Facts
12.3.2. Business Description
12.3.3. Products and Services
12.3.4. Financial Overview
12.3.5. SWOT Analysis
12.3.6. Key Developments
12.4. DECA TECHNOLOGIES
12.4.1. Key Facts
12.4.2. Business Description
12.4.3. Products and Services
12.4.4. Financial Overview
12.4.5. SWOT Analysis
12.4.6. Key Developments
12.5. FUJITSU
12.5.1. Key Facts
12.5.2. Business Description
12.5.3. Products and Services
12.5.4. Financial Overview
12.5.5. SWOT Analysis
12.5.6. Key Developments
12.6. INFINEON TECHNOLOGIES AG
12.6.1. Key Facts
12.6.2. Business Description
12.6.3. Products and Services
12.6.4. Financial Overview
12.6.5. SWOT Analysis
12.6.6. Key Developments
12.7. LAM RESEARCH CORPORATION
12.7.1. Key Facts
12.7.2. Business Description
12.7.3. Products and Services
12.7.4. Financial Overview
12.7.5. SWOT Analysis
12.7.6. Key Developments
12.8. SILICONWARE PRECISION INDUSTRIES CO., LTD.
12.8.1. Key Facts
12.8.2. Business Description
12.8.3. Products and Services
12.8.4. Financial Overview
12.8.5. SWOT Analysis
12.8.6. Key Developments
12.9. STATS CHIPPAC LTD
12.9.1. Key Facts
12.9.2. Business Description
12.9.3. Products and Services
12.9.4. Financial Overview
12.9.5. SWOT Analysis
12.9.6. Key Developments
12.10. TOKYO ELECTRON LIMITED
12.10.1. Key Facts
12.10.2. Business Description
12.10.3. Products and Services
12.10.4. Financial Overview
12.10.5. SWOT Analysis
12.10.6. Key Developments
13. APPENDIX
13.1. ABOUT THE INSIGHT PARTNERS
13.2. GLOSSARY OF TERMS
1. Amkor Technology
2. Applied Materials, Inc.
3. Brewer Science, Inc.
4. Deca Technologies
5. Fujitsu
6. Infineon Technologies AG
7. LAM RESEARCH CORPORATION
8. Siliconware Precision Industries Co., Ltd.
9. STATS ChipPAC Ltd
10. Tokyo Electron Limited
The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.
- Data Collection and Secondary Research:
As a market research and consulting firm operating from a decade, we have published many reports and advised several clients across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.
Several associations trade associates, technical forums, institutes, societies and organizations are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in the last 3 years are scrutinized and analyzed to understand the current market trends.
- Primary Research:
The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.
For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/Sales Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.
A typical research interview fulfils the following functions:
- Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
- Validates and strengthens in-house secondary research findings
- Develops the analysis team’s expertise and market understanding
Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:
- Industry participants: VPs, business development managers, market intelligence managers and national sales managers
- Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.
Below is the breakup of our primary respondents by company, designation, and region:
Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.
- Data Analysis:
Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.
- 3.1 Macro-Economic Factor Analysis:
We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.
- 3.2 Country Level Data:
Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.
- 3.3 Company Profile:
The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.
- 3.4 Developing Base Number:
Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.
- Data Triangulation and Final Review:
The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.
We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.
We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.
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