Substrate-Like PCB Market Overview, Growth, Trends, Analysis, Research Report (2021-2031)

The substrate-like PCB market size is projected to reach US$ 6.86 billion by 2031 from US$ 1.74 billion in 2023. The market is expected to register a CAGR of 18.7% during 2023–2031. Increasing demand for substrates like PCB in the consumer electronics and automotive industry and rising demand for miniaturization in the consumer electronics industry are likely to remain key trends and drivers in the market.

Substrate-Like PCB Market Analysis

Substrate-Like PCB Market is experiencing significant growth globally. This growth is attributed to the increasing demand for substrates like PCB in the consumer electronics and automotive industries and the rising demand for miniaturization in the consumer electronics industry. Moreover, increasing adoption of 5G technology by smartphone manufacturers and a growing adoption of substrate-like PCB in medical and industrial equipment.

Substrate-Like PCB Market Overview

Substrate-like PCBs are analogous to the IC carrier board utilized in semiconductor packaging. The IC carrier board is a high-tech circuit board having one or more chips and other circuitry joining the semiconductor to the package land pattern. Even though substrate-like PCBs are venturing closer to the feature sizes observed in IC carriers, they are considered PCBs since they have both active and passive components.

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Substrate-Like PCB Market: Strategic Insights

Substrate-Like PCB Market

• 
  CAGR (2023 - 2031)

  18.7%
• Market Size 2023
  US$ 1.74 Billion
• Market Size 2031
  US$ 6.86 Billion

Market Dynamics

GROWTH DRIVERS

• Surging Demand for Substrates-Like PCB in Modern Electronics to Favor Market

FUTURE TRENDS

• The adoption of substrates like PCB in medical and industry fields is anticipated to drive the market in the forecast period.

OPPORTUNITIES

• Increasing adoption of 5G technology in smartphones.

Key Players

• AT S
• Compeq Co Ltd
• DAEDUCK ELECTRONICS Co Ltd
• IBIDEN
• KINSUS INTERCONNECT TECHNOLOGY CORP
• Korea Circuit
• SAMSUNG ELECTRO MECHANICS
• TTM Technologies Inc
• Unimicron
• Zhen Ding Tech Group Technology Holding Limited

Regional Overview

• North America
• Europe
• Asia-Pacific
• South and Central America
• Middle East and Africa

Market Segmentation

Line/Space

• 25/25 and 30/30 µm
• Less than 25/25 µm

Inspection Technologies

• Automated Optical Inspection
• Direct Imaging
• Automated Optical Shaping

Application

• Consumer Electronics
• Automotive
• Medical
• Industrial

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Substrate-Like PCB Market Drivers and Opportunities

Surging Demand for Substrates-Like PCB in Modern Electronics to Favor Market.

The evolving landscape of electronics and technological advancements constantly push the boundaries of innovation. Substrate-like PCBs (SLP PCBs) have developed as a revolutionary solution, redefining the method by which printed circuit boards are manufactured and designed. SLP PCBs have several benefits in regard to how they are transforming the realm of modern electronics. The innovative design of the SLP PCBs approach allows for increased enhanced performance, miniaturization, and improved thermal management within electronic devices. As SLP PCBs offer several benefits such as thin profile, advanced layer stack up, high density interconnect, improved thermal performance, and miniaturization, the modern electronics industry its demand is increasing in the market as consumer electronics manufacturers utilize it in manufacturing devices. Thus, considering the above parameters, the surging demand for substrates like PCBs in modern electronics is driving the market globally.

Increasing adoption of 5G technology in smartphones.

SLP PCB is the next generation of high-density PCB, which requires spacing less than or equal to 30/30 μm (40/40 μm is the current limit for HDI) for further reducing the device size, leaving more space for other components. The increasing adoption of SLP by smartphone companies due to the transition from 5G technology provides a massive opportunity for the growth of substrate-like PCB. Further, smartphones have evolved from 4G LTE to 5G support, and the complexity of massive MIMO antenna configurations has made RF front-ends take up additional space in 5G smartphones. In addition, the amount of data processed by the 5G system is expected to grow geometrically in the near future, thereby increasing the requirement for high battery capacity. Thus, PCBs and other electronic components must be compressed, thinner, smaller, and more complex processes. Therefore, considering the above factors, the increasing adoption of 5G technology in smartphones is anticipated to hold several opportunities for the substrate-like PCB market.

Substrate-Like PCB Market Report Segmentation Analysis

Key segments that contributed to the derivation of the substrate-like PCB market analysis are line/space, inspection technologies, and application.

• Based on component, the substrate-like PCB market is divided into 25/25 and 30/30 µm, and Less than 25/25 µm. The 25/25 and 30/30 µm segment is anticipated to hold a significant market share in the forecast period.  
• Based on inspection technologies, the substrate-like PCB market is divided into automated optical inspection, direct imaging, and automated optical shaping. The automated optical inspection segment is anticipated to hold a significant market share in the forecast period.
• By applications, the market is segmented into consumer electronics, automotive, medical, industrial, and others. Consumer electronics is anticipated to hold a significant market share in the forecast period.  

Substrate-Like PCB Market Share Analysis by Geography

The geographic scope of the substrate-like PCB market report is mainly divided into five regions: North America, Asia Pacific, Europe, Middle East & Africa, and South & Central America.

North America has dominated the substrate-like PCB market. High technology adoption trends in various industries in the North American region have fuelled the growth of the substrate-like PCB market. Factors such as increased adoption of digital tools and high technological spending by government agencies are expected to drive the North American engineering software market growth. Moreover, a strong emphasis on research and development in the developed economies of the US and Canada is forcing the North American players to bring technologically advanced solutions into the market. In addition, the US has a large number of substrate-like PCB market players who have been increasingly focusing on developing innovative solutions. All these factors contribute to the region's growth of the substrate-like PCB market.

Substrate-Like PCB Market Report Scope

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Substrate-Like PCB Market News and Recent Developments

The substrate-like PCB market is evaluated by gathering qualitative and quantitative data post primary and secondary research, which includes important corporate publications, association data, and databases. A few of the developments in the substrate-like PCB market are listed below:

• Samsung decided to invest a total of US$850 million in the establishment of FCBGA (Flip-chip Ball Grid Array) production facilities and infrastructure for its Vietnamese production plant. The investment will be executed in phases until 2023. With this investment, Samsung Electro-Mechanics plans to focus its capabilities on the semiconductor package substrate business, which is expected to grow significantly in the long term. (Source: Samsung Company Website/Newsletter, December 2021)
• AT&S opened its first plant in Kulim, Malaysia, on 24 January 2024 and expected numerous guests from the world of politics and business on this occasion. The new AT&S plant in Kulim will produce IC substrates for the next generation of microchips for high-performance computing, data centers and AI applications of leading manufacturers such as AMD. (Source: AT&S Company Website, January 2024)

Substrate-Like PCB Market Report Coverage and Deliverables

The “Substrate-Like PCB Market Size and Forecast (2021–2031)” report provides a detailed analysis of the market covering below areas:

• Substrate-like PCB market size and forecast at global, regional, and country levels for all the key market segments covered under the scope.
• Substrate-like PCB market trends as well as market dynamics such as drivers, restraints, and key opportunities.
• Detailed PEST/Porter’s Five Forces and SWOT analysis.
• Substrate-like PCB market analysis covering key market trends, global and regional framework, major players, regulations, and recent market developments.
• Industry landscape and competition analysis covering market concentration, heat map analysis, prominent players, and recent developments for the substrate-like PCB market.
• Detailed company profiles.