Wafer Level Packaging Market Size and Forecasts (2021 - 2031), Global and Regional Share, Trends, and Growth Opportunity Analysis

MARKET OVERVIEW

Wafer level packaging (WLP) is a chip-scale package (CSP) technology, and it enables integration of wafer fab, test, packaging, and burn-in at wafer level to simplify the manufacturing procedure. With the growing demand for smaller and faster consumer electronics, the market is expected to experience a positive impact. The broad use of WLP in radar technology has empowered it to become a crucial part of self-driving cars. Further, the healthcare industry and wearable devices market would hugely utilize wafer level packaging technology. The boost in these industries would positively impact the wafer level packaging market during the forecast period.

MARKET SCOPE

The "Global Wafer Level Packaging Market Analysis to 2031" is a specialized and in-depth study with a special focus on the global market trend analysis. The report aims to provide an overview of the wafer level packaging market with detailed market segmentation by packaging type, process type, application, and geography. The report provides key statistics on the market status of the leading wafer level packaging market players and offers key trends and opportunities in the market.

MARKET SEGMENTATION

•   Based on packaging type, the global wafer level packaging market is segmented into flip chips, fan-out wafer level packaging, and through-silicon via.
  
•   On the basis of process type, the market is segmented into Electrochemical Deposition (ECD), Physical Vapor Deposition (PVD), etch, Chemical Vapor Deposition (CVD), and Chemical Mechanical Planarization (CMP).
  
•   Based on application, the market is segmented into electronics and semiconductor, aerospace and defense, automotive, and others.
  

MARKET DYNAMICS

Drivers:

•   The growing requirement for circuit miniaturization in microelectronic devices is driving the growth of the wafer level packaging market.
  
•   Demand for low cost, small sizes, and high performance of packaging solutions are anticipated to witness massive demand during the forecast period.
  

Restraints:

•   The manufacturing cost is the major factor that may restrain the growth of the wafer level packaging market.
  

REGIONAL FRAMEWORK

The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides an overview and forecast of the global market based on various segments. It also provides market size and forecast estimates from the year 2021 to 2031 with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), the Middle East and Africa (MEA), and South America. The wafer level packaging market by each region is later sub-segmented by respective countries and segments. The report covers the analysis and forecast of 18 countries globally along with the current trend and opportunities prevailing in the region.

The report analyzes factors affecting the market from both demand and supply side and further evaluates market dynamics affecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, MEA, and South America after evaluating political, economic, social and technological factors affecting the wafer level packaging market in these regions.

IMPACT OF COVID-19 ON WAFER LEVEL PACKAGING MARKET
COVID-19 first began in Wuhan (China) during December 2019 and since then it has spread at a fast pace across the globe. The US, India, Brazil, Russia, France, the UK, Turkey, Italy, and Spain are some of the worst affected countries in terms confirmed cases and reported deaths. The COVID-19 has been affecting economies and industries in various countries due to lockdowns, travel bans, and business shutdowns. Shutdown of various plants and factories has affected the global supply chains and negatively impacted the manufacturing, delivery schedules, and sales of products in global market. Few companies have already announced possible delays in product deliveries and slump in future sales of their products. In addition to this, the global travel bans imposed by countries in Europe, Asia-Pacific, and North America are affecting the business collaborations and partnerships opportunities.

MARKET PLAYERS

The report covers key developments in the wafer level packaging market as organic and inorganic growth strategies. Various companies are focusing on organic growth strategies such as product launches, product approvals and others such as patents and events. Inorganic growth strategies activities witnessed in the market were acquisitions, and partnership & collaborations. These activities have paved way for the expansion of business and customer base of market players. The market payers from wafer level packaging market are anticipated to lucrative growth opportunities in the future with the rising demand in the global market.

The report also includes the profiles of key companies along with their SWOT analysis and market strategies in the wafer level packaging market. In addition, the report focuses on leading industry players with information such as company profiles, components, and services offered, financial information of the last 3 years, the key development in the past five years.

•   Amkor Technology
  
•   Applied Materials, Inc.
  
•   Brewer Science, Inc.
  
•   Deca Technologies
  
•   Fujitsu
  
•   Infineon Technologies AG
  
•   LAM RESEARCH CORPORATION
  
•   Siliconware Precision Industries Co., Ltd.
  
•   STATS ChipPAC Ltd
  
•   Tokyo Electron Limited
  

The Insight Partner's dedicated research and analysis team consist of experienced professionals with advanced statistical expertise and offer various customization options in the existing study.

Wafer Level Packaging Report Scope