3d Measurement Sensors In Logistics Market Scope And Analysis

Report Code : TIPRE00030010
Category : Electronics and Semiconductor

Status : Published
No. of Pages : 150

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3D Measurement Sensors in Logistics Market Scope, Growth, Size and Share by 2030

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3D Measurement Sensors in Logistics Market Report Scope

Report Attribute	Details
Market size in 2022	US$ 127.50 Million
Market Size by 2030	US$ 242.13 Million
Global CAGR (2022 - 2030)	8.3%
Historical Data	2020-2021
Forecast period	2023-2030
Segments Covered	By Type Image Sensors Position Sensors Acoustic Sensors Others By Technology Stereo Vision Structured Light Laser Light Others
Regions and Countries Covered	North America US Canada Mexico Europe UK Germany France Russia Italy Rest of Europe Asia-Pacific China India Japan Australia Rest of Asia-Pacific South and Central America Brazil Argentina Rest of South and Central America Middle East and Africa South Africa Saudi Arabia UAE Rest of Middle East and Africa
Market leaders and key company profiles	Micro Epsilon Messtechnik GmbH Co KG Infineon Technologies AG Sony Semiconductor Solutions Corp Cognex Corp ifm Electronic GmbH Intel Corp LMI Technologies Inc Keyence Corp OMRON Corp

Recent Developments:

Inorganic and organic strategies such as mergers and acquisitions are highly adopted by companies in the 3D measurement sensors in logistics market. A few recent key market developments are listed below:

In 2021, Micro-Epsilon developed a 3D snapshot sensor surfaceCONTROL 3D 3200, and it is the right choice for precise geometry, shape, and surface measurements on matt surfaces. The sensor has been developed for automated inline quality inspection.
In 2020, Infineon Technologies AG completed the acquisition of Cypress Semiconductor Corporation. The acquisition tends to offer customers the industry’s most comprehensive portfolio for linking the real with the digital world and shaping digitalization.
In 2020, OMRON Corporation announced that it would sell the B5L Series embedded 3D TOF Sensor Module in Japan from September 1 and globally from October 1. The B5L Series utilizes unique optical design technology to stabilize three-dimensional distance information across a wide area, even under sunlight.
In 2019, The SICK group completed its takeover of the Chilean joint venture SICK SpA by transferring the outstanding 50% of shares from the owning family Schädler in the joint venture. SICK has become the sole owner of SICK SpA as a result of this takeover, strengthening its position in the South American market.
In 2019, SICK AG inaugurated a new production site in China where it will concentrate on localized product manufacture as well as system construction for individual customers. . With this expansion the company will be able to supply more enhanced automation solutions to its customers.