3d Stacking Market Scope And Analysis

3D Stacking Market Report Scope

3D Stacking Market News and Recent Developments

The 3D stacking market is evaluated by gathering qualitative and quantitative data post primary and secondary research, which includes important corporate publications, association data, and databases. A few of the developments in the 3D stacking market are listed below:

• Intel researchers showcased advancements in 3D stacked complementary metal oxide semiconductor (CMOS) transistors combined with backside power and direct backside contacts at the 2023 IEEE International Electron Devices Meeting (IEDM). The company also reported on scaling paths for recent R&D breakthroughs for backside power delivery, such as backside contacts, and it was the first to demonstrate successful large-scale 3D monolithic integration of silicon transistors with gallium nitride (GaN) transistors on the same 300-millimeter (mm) wafer, rather than on the package. (Source: Intel Corp, Press Release, December 2023)

3D Stacking Market Report Coverage and Deliverables

The "3D Stacking Market Size and Forecast (2021–2031)" provides a detailed analysis of the market covering the areas mentioned below:

• 3D stacking market size and forecast at global, regional, and country levels for all the key market segments covered under the scope
• 3D stacking market trends as well as market dynamics such as drivers, restraints, and key opportunities
• Detailed PEST/Porter’s Five Forces and SWOT analysis
• 3D stacking market analysis covering key market trends, global and regional framework, major players, regulations, and recent market developments
• Industry landscape and competition analysis covering market concentration, heat map analysis, prominent players, and recent developments for the 3D stacking market
• Detailed company profiles