In-Mold Electronics Market Analysis, Scope, and Growth by 2031
In-Mold Electronics Market Report Scope
Report Attribute | Details |
---|---|
Market size in 2023 | US$ 258.41 Million |
Market Size by 2031 | US$ 1989.35 Million |
Global CAGR (2023 - 2031) | 29.1% |
Historical Data | 2021-2022 |
Forecast period | 2024-2031 |
Segments Covered |
By Application
|
Regions and Countries Covered | North America
|
Market leaders and key company profiles |
In-Mold Electronics Market News and Recent Developments
The In-Mold Electronics Marketis evaluated by gathering qualitative and quantitative data post primary and secondary research, which includes important corporate publications, association data, and databases. The following is a list of developments in the market:
- In September 2022, X2F announced that it had joined a unique collaboration with Covestro, one of the world’s leading manufacturers of high-quality polymer materials, to develop a thermally conductive automotive heat-sink with in-mold electronics using X2F’s transformative controlled viscosity molding technology. This new product was a unique alternative for automotive OEMs and processors who seek a replacement for cast aluminum heat-sinks that is both lighter and more affordable. (Source: X2F, Press Release, 2022)
In-Mold Electronics Market Report Coverage and Deliverables
The “In-Mold Electronics Market Size and Forecast (2021–2031)” report provides a detailed analysis of the market covering below areas:
- Market size and forecast at global, regional, and country levels for all the key market segments covered under the scope
- Market dynamics such as drivers, restraints, and key opportunities
- Key future trends
- Detailed PEST/Porter’s Five Forces and SWOT analysis
- Global and regional market analysis covering key market trends, major players, regulations, and recent market developments
- Industry landscape and competition analysis covering market concentration, heat map analysis, prominent players, and recent developments
- Detailed company profiles