In Mold Electronics Market Scope And Analysis

  • Report Code : TIPRE00010967
  • Category : Electronics and Semiconductor
  • No. of Pages : 150
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In-Mold Electronics Market Analysis, Scope, and Growth by 2031

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In-Mold Electronics Market Report Scope

Report Attribute Details
Market size in 2023 US$ 258.41 Million
Market Size by 2031 US$ 1989.35 Million
Global CAGR (2023 - 2031) 29.1%
Historical Data 2021-2022
Forecast period 2024-2031
Segments Covered By Application
  • Automotive
  • Building Automation
  • Consumer Products
  • Wearable
  • Healthcare
By Ink Type
  • Silver Conductive Ink
  • Carbon Conductive Ink
Regions and Countries Covered North America
  • US
  • Canada
  • Mexico
Europe
  • UK
  • Germany
  • France
  • Russia
  • Italy
  • Rest of Europe
Asia-Pacific
  • China
  • India
  • Japan
  • Australia
  • Rest of Asia-Pacific
South and Central America
  • Brazil
  • Argentina
  • Rest of South and Central America
Middle East and Africa
  • South Africa
  • Saudi Arabia
  • UAE
  • Rest of Middle East and Africa
Market leaders and key company profiles
  • Celanese Corporation
  • e 2 ip
  • DuraTech Industries
  • East West Manufacturing
  • GenesInk
  • Golden Valley Products
  • InMold Solutions
  • Nissha Co Ltd
  • TactoTek Oy
  • YOMURA
  • In-Mold Electronics Market News and Recent Developments

    The In-Mold Electronics Marketis evaluated by gathering qualitative and quantitative data post primary and secondary research, which includes important corporate publications, association data, and databases. The following is a list of developments in the market:

    • In September 2022, X2F announced that it had joined a unique collaboration with Covestro, one of the world’s leading manufacturers of high-quality polymer materials, to develop a thermally conductive automotive heat-sink with in-mold electronics using X2F’s transformative controlled viscosity molding technology. This new product was a unique alternative for automotive OEMs and processors who seek a replacement for cast aluminum heat-sinks that is both lighter and more affordable. (Source: X2F, Press Release, 2022)

    In-Mold Electronics Market Report Coverage and Deliverables

    The “In-Mold Electronics Market Size and Forecast (2021–2031)” report provides a detailed analysis of the market covering below areas:

    • Market size and forecast at global, regional, and country levels for all the key market segments covered under the scope
    • Market dynamics such as drivers, restraints, and key opportunities
    • Key future trends
    • Detailed PEST/Porter’s Five Forces and SWOT analysis
    • Global and regional market analysis covering key market trends, major players, regulations, and recent market developments
    • Industry landscape and competition analysis covering market concentration, heat map analysis, prominent players, and recent developments
    • Detailed company profiles