Next Generation Memory Market Scope And Analysis

  • Report Code : TIPTE100000339
  • Category : Electronics and Semiconductor
  • No. of Pages : 150
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Next-Generation Memory Market Scope and Key Players Analysis by 2031

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Next-Generation Memory Market Report Next-Generation Memory Market Size and Share Next-Generation Memory Market Scope and Analysis

Next-Generation Memory Market Report Scope

Report Attribute Details
Market size in 2023 US$ 6.4 billion
Market Size by 2031 US$ 55.96 billion
Global CAGR (2023 - 2031) 31.1%
Historical Data 2021-2022
Forecast period 2024-2031
Segments Covered By Type
  • Non-volatile Memory and Volatile Memory
By Application
  • Consumer Electronics
  • Industrial
  • Automotive and Transportation
  • Enterprise Storage
  • Military & Aerospace
  • Healthcare
  • IT and Telecom
Regions and Countries Covered North America
  • US
  • Canada
  • Mexico
Europe
  • UK
  • Germany
  • France
  • Russia
  • Italy
  • Rest of Europe
Asia-Pacific
  • China
  • India
  • Japan
  • Australia
  • Rest of Asia-Pacific
South and Central America
  • Brazil
  • Argentina
  • Rest of South and Central America
Middle East and Africa
  • South Africa
  • Saudi Arabia
  • UAE
  • Rest of Middle East and Africa
Market leaders and key company profiles
  • Samsung
  • Micron Technology Inc
  • Fujitsu
  • SK HYNIX INC
  • Honeywell International Inc
  • Microchip Technology Inc
  • Everspin Technologies Inc
  • Infineon Technologies AG
  • Kingston Technology Europe Co LLP
  • KIOXIA Singapore Pte Ltd

    • Next-Generation Memory Market News and Recent Developments

    The next-generation memory market is evaluated by gathering qualitative and quantitative data post primary and secondary research, which includes important corporate publications, association data, and databases. The following is a list of developments in the market:

    • In August 2023, SK Hynix Inc. triggered competition in the semiconductor technology race with its next-generation high-bandwidth memory (HBM). SK Hynix has successfully developed the fifth-generation DRAM product, HBM3E, which is specifically built for high-performance artificial intelligence (AI) applications. HBM is a useful and high-performance device that accelerates data processing by vertically integrating many DRAMs, outperforming traditional DRAMs.

    (Source: SK Hynix Inc, Company Website, 2023)

    • In October 2023, Samsung unveiled its next-generation memory solutions at Memory Tech Day, with the goal of playing a vital role in providing sophisticated artificial intelligence models for hyperscale applications. The company has presented a range of cutting-edge memory solutions, including the latest Shinebolt HBM3e memory, the LPDDR5X CAMM2 solutions based on LPDDR package modules, and the detachable AutoSSD.

    (Source: Samsung, Company Website, 2021)

    Next-Generation Memory Market Report Coverage and Deliverables

    The "Next-Generation Memory Market Size and Forecast (2021–2031)" report provides a detailed analysis of the market covering below areas:

    • Market size and forecast at global, regional, and country levels for all the key market segments covered under the scope
    • Market dynamics such as drivers, restraints, and key opportunities
    • Key future trends
    • Detailed PEST/Porter's Five Forces and SWOT analysis
    • Global and regional market analysis covering key market trends, major players, regulations, and recent market developments
    • Industry landscape and competition analysis covering market concentration, heat map analysis, prominent players, and recent developments
    • Detailed company profiles