Radiation Hardened Electronics Market Scope And Analysis

Report Code : TIPRE00011821
Category : Electronics and Semiconductor

No. of Pages : 150

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Radiation-Hardened Electronics Market Analysis Report 2022 to 2028

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Radiation Hardened Electronics Market Report Scope

Report Attribute	Details
Market size in 2023	US$ 1.66 Billion
Market Size by 2031	US$ 2.42 Billion
Global CAGR (2023 - 2031)	4.8%
Historical Data	2021-2022
Forecast period	2024-2031
Segments Covered	By Component Power Management Components Analog & Digital Mixed Signal Devices Memory Controllers & Processors By Manufacturing Technique Radiation Hardening Design Radiation Hardening Process By Application Aerospace & Defense Nuclear Power Plant Space
Regions and Countries Covered	North America US Canada Mexico Europe UK Germany France Russia Italy Rest of Europe Asia-Pacific China India Japan Australia Rest of Asia-Pacific South and Central America Brazil Argentina Rest of South and Central America Middle East and Africa South Africa Saudi Arabia UAE Rest of Middle East and Africa
Market leaders and key company profiles	BAE Systems Data Device Corporation Honeywell International Inc Infineon Technologies AG Renesas Electronics Corporation Texas Instruments Incorporated STMicroelectronics Xilinx Inc AMD VORAGO Technologies Microchip Technology Inc

Radiation Hardened Electronics Market News and Recent Developments

The radiation hardened electronics market is evaluated by gathering qualitative and quantitative data post primary and secondary research, which includes important corporate publications, association data, and databases. A few of the developments in the radiation hardened electronics market are listed below:

EPC Space introduced the EPC7009L16SH, a radiation hardened gallium nitride (GaN) gate driver IC. Utilizing EPC’s exclusive eGaN IC technology, this innovative GaN driver empowers design engineers to fully exploit the capabilities of eGaN FET technology. (Source: EPC Space, Company Website, April 2024)
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, launched a new line of plastic-packaged radiation-hardened (rad-hard) devices for satellite power management systems. The four new devices include the ISL71001SLHM/SEHM point of load (POL) buck regulator, ISL71610SLHM and ISL71710SLHM digital isolators, and the ISL73033SLHM 100V GaN FET and integrated low-side driver. (Source: Renesas Electronics Corporation, Company Website, July 2021)

Radiation Hardened Electronics Market Report Coverage and Deliverables

The “Radiation Hardened Electronics Market Size and Forecast (2021–2031)” report provides a detailed analysis of the market covering below areas:

Radiation hardened electronics market size and forecast at global, regional, and country levels for all the key market segments covered under the scope.
Radiation hardened electronics market trends as well as market dynamics such as drivers, restraints, and key opportunities.
Detailed PEST/Porter’s Five Forces and SWOT analysis.
Radiation hardened electronics market analysis covering key market trends, global and regional framework, major players, regulations, and recent market developments.
Industry landscape and competition analysis covering market concentration, heat map analysis, prominent players, and recent developments for the Radiation hardened electronics market.
Detailed company profiles.