Rf Front End Chip Market Scope And Analysis

Report Code : TIPRE00017165
Category : Electronics and Semiconductor

Status : Published
No. of Pages : 209

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RF Front-End Chip Market Analysis Report 2023 to 2030

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RF Front-End Chip Market Report Scope

Report Attribute	Details
Market size in 2022	US$ 18.52 Billion
Market Size by 2030	US$ 47.1 Billion
Global CAGR (2022 - 2030)	12.4%
Historical Data	2020-2021
Forecast period	2023-2030
Segments Covered	By Component Power Amplifier Radio Frequency Filter Low Noise Amplifier RF Switch By Application Consumer Electronics Wireless Communication
Regions and Countries Covered	North America US Canada Mexico Europe UK Germany France Russia Italy Rest of Europe Asia-Pacific China India Japan Australia Rest of Asia-Pacific South and Central America Brazil Argentina Rest of South and Central America Middle East and Africa South Africa Saudi Arabia UAE Rest of Middle East and Africa
Market leaders and key company profiles	Infineon Technologies AG TDK Corp Texas Instruments Inc Broadcom Inc Qorvo Inc Skyworks Solutions Inc STMicroelectronics NV Murata Manufacturing Co Ltd Microchip Technology Inc

Key Player Analysis:

Broadcom Corporation; Infineon Technologies AG; Microchip Technology Inc.; Murata Manufacturing Co., Ltd; NXP Semiconductors N.V.; Qorvo Inc.; Skyworks Solutions, Inc.; STMicroelectronics; TDK Corporation; and Texas Instruments Incorporated are among the key players profiled in the RF front-end chip market. Several other major market players were studied and analyzed during this market research study to get a holistic view of the market and its ecosystem. The RF front-end chip market analysis provides detailed market insights, which help the key players strategize their growth.

RF Front-End Chip Market Recent Developments:

The RF front-end chip market forecast can help stakeholders in this marketplace plan their growth strategies. Inorganic and organic strategies such as mergers and acquisitions are highly adopted by companies in the market. A few recent key market developments, as per company press releases, are listed below:

In June 2023, Qorvo announced the availability of the QPQ3509, the first bulk acoustic wave (BAW) 280 MHz band pass filter for the new 5G C-band in North America, and the QPB9850, a compact, highly integrated front-end switch / low noise amplifier (LNA) module for 5G base station RF front-ends. The combination of the QPQ3509's C-band coverage and the QPB9850's high integration and compact design make the devices ideally suited for 5G small cell applications where size and weight are key metrics.
In September 2023, Qorvo introduced two bulk acoustic wave (BAW) filters to support the ongoing global deployment of 5G base stations. The new QPQ3500 and QPQ3501 filters offer base station OEMs pin-compatible, 5G filter solutions that deliver lower insertion loss and superior out-of-band rejection than similar products. Pin compatibility allows the use of common printed circuit boards that support different frequency bands, eliminating costly board redesign and reducing time to market.
In June 2023, Broadcom Inc introduced four RF front-end modules for powering routers using Wi-Fi 7, a new wireless networking standard. These modules can also be used to build Wi-Fi access points (APs), devices used by enterprises for wireless connectivity.
In March 2021, Qorvo announced increased shipments of its RF Fusion20 portfolio, an expansion of its award-winning family of integrated 5G RF front-end (RFFE) modules, to all major 5G smartphone manufacturers. Fusion20 adds receive path integration and RF shielding to deliver full transmit and receive coverage in a complete suite of configurations to match varying regional market needs.