Semiconductor Bonding Market Scope And Analysis

  • Report Code : TIPRE00029751
  • Category : Electronics and Semiconductor
  • No. of Pages : 150
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Semiconductor Bonding Market Scope, Analysis, and Trends by 2028

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Semiconductor Bonding Market Report Semiconductor Bonding Market Size and Share Semiconductor Bonding Market Scope and Analysis

Semiconductor Bonding Market Report Scope

Report Attribute Details
Market size in 2023 US$ 709.73 Million
Market Size by 2031 US$ 1384.72 Million
Global CAGR (2023 - 2031) 8.7%
Historical Data 2021-2022
Forecast period 2024-2031
Segments Covered By Type
  • Die Bonder
  • Wafer Bonder
  • Flip Chip Bonder
By Technology
  • RF Devices
  • MEMS and Sensors
  • LED
  • CMOS Image Sensors
  • 3D NAND
Regions and Countries Covered North America
  • US
  • Canada
  • Mexico
Europe
  • UK
  • Germany
  • France
  • Russia
  • Italy
  • Rest of Europe
Asia-Pacific
  • China
  • India
  • Japan
  • Australia
  • Rest of Asia-Pacific
South and Central America
  • Brazil
  • Argentina
  • Rest of South and Central America
Middle East and Africa
  • South Africa
  • Saudi Arabia
  • UAE
  • Rest of Middle East and Africa
Market leaders and key company profiles
  • Palomar Technologies
  • Panasonic Corporation
  • Toray Industries Inc
  • Kulicke Soffa Industries Inc
  • DIAS Automation HK Ltd
  • ASMPT Ltd formerly ASM Pacific Technology Ltd
  • EV Group
  • Yamaha Motor Corporation Yamaha Robotics Holdings
  • WestBond Inc
  • Applied Materials Inc

    • Semiconductor Bonding Market News and Recent Developments

    The semiconductor bonding market is evaluated by gathering qualitative and quantitative data post primary and secondary research, which includes important corporate publications, association data, and databases. A few of the developments in the semiconductor bonding market are listed below:

    • TANAKA Kikinzoku Kogyo K.K., which develops industrial precious metals products as one of the core companies of TANAKA Precious Metals, announced that it established a gold particle bonding technology for high-density mounting of semiconductors using AuRoFUSE low-temperature fired paste for gold-to-gold bonding. AuRoFUSE is a composition of submicron-sized gold particles and a solvent that creates a bonding material with low electrical resistance and high thermal conductivity to achieve metal bonding at low temperatures. Using AuRoFUSE preforms (dried paste forms), this technology can reach 4 μm fine-pitch mounting with 20 μm bumps. (Source: TANAKA HOLDINGS Co., Ltd., Press Release, March 2024)
    • BE Semiconductor Industries N.V. (the “Company" or "Besi"), a leading manufacturer of assembly equipment for the semiconductor industry, announced the receipt of an order for 26 hybrid bonding systems from a leading semiconductor logic manufacturer. (Source: Besi, Press Release, May 2024)

    Semiconductor Bonding Market Report Coverage and Deliverables

    The “Semiconductor Bonding Market Size and Forecast (2021–2031)” report provides a detailed analysis of the market covering below areas:

    • Semiconductor bonding market size and forecast at global, regional, and country levels for all the key market segments covered under the scope
    • Semiconductor bonding market trends as well as market dynamics such as drivers, restraints, and key opportunities
    • Detailed PEST/Porter’s Five Forces and SWOT analysis
    • Semiconductor bonding market analysis covering key market trends, global and regional framework, major players, regulations, and recent market developments
    • Industry landscape and competition analysis covering market concentration, heat map analysis, prominent players, and recent developments for the semiconductor bonding market
    • Detailed company profiles