Semiconductor Metrology And Inspection Market Scope And Analysis

  • Report Code : TIPRE00004996
  • Category : Electronics and Semiconductor
  • Status : Published
  • No. of Pages : 150
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Semiconductor Metrology and Inspection Market Scope and Analysis Report by 2028

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Semiconductor Metrology and Inspection Market Report Scope

Report Attribute Details
Market size in 2022 US$ 7.55 Billion
Market Size by 2028 US$ 8.29 Billion
Global CAGR (2022 - 2028) 6.6%
Historical Data 2020-2021
Forecast period 2023-2028
Segments Covered By Type
  • Wafer Inspection System
  • Mask Inspection System
  • Thin Film Metrology
  • Bump Inspection
  • Package Inspection
  • Lead Frame Inspection
  • Probe Card Inspection
By Technology
  • Optical and E-Beam
By Organization Size
  • Large Enterprises and SMEs
Regions and Countries Covered North America
  • US
  • Canada
  • Mexico
Europe
  • UK
  • Germany
  • France
  • Russia
  • Italy
  • Rest of Europe
Asia-Pacific
  • China
  • India
  • Japan
  • Australia
  • Rest of Asia-Pacific
South and Central America
  • Brazil
  • Argentina
  • Rest of South and Central America
Middle East and Africa
  • South Africa
  • Saudi Arabia
  • UAE
  • Rest of Middle East and Africa
Market leaders and key company profiles
  • Applied Materials Inc
  • ASML Holdings N V
  • Hitachi High Technologies Corporation
  • JEOL Ltd
  • KLA Corporation
  • Lasertec Corporation
  • NOVA Measuring Instruments
  • Nikon Metrology N V
  • Onto Innovation
  • In the semiconductor metrology and inspection market, the companies are mainly focused on the development of advanced and efficient products.

    • In 2022, Lasertec Corporation announced the release of the MATRICS X9ULTRA series, a mask inspection system designed to inspect the photomasks used in extreme ultraviolet (EUV) lithography while their pellicles are not attached.
    • In 2020, KLA Corporation announced two new products—the PWG5 wafer geometry system and the Surfscan SP7XP wafer defect inspection system. The new systems are designed to address exceedingly difficult issues in the manufacture of leading-edge memory and logic integrated circuits.