Substrate Like Pcb Market Scope And Analysis

Report Code : TIPRE00014544
Category : Electronics and Semiconductor

Status : Published
No. of Pages : 225

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Substrate-Like PCB Market Trends and Scope by 2031

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Substrate-Like PCB Market Report Scope

Report Attribute	Details
Market size in 2024	US$ 2.97 Billion
Market Size by 2031	US$ 7.16 Billion
Global CAGR (2024 - 2031)	13.4%
Historical Data	2021-2023
Forecast period	2024-2031
Segments Covered	By Line/Space 25/25 and 30/30 µm Less than 25/25 µm By Fabrication Process MSAP UV LDI By Application Consumer Electronics Automotive Industrial Medical
Regions and Countries Covered	North America US Canada Mexico Europe UK Germany France Russia Italy Rest of Europe Asia-Pacific China India Japan Australia Rest of Asia-Pacific South and Central America Brazil Argentina Rest of South and Central America Middle East and Africa South Africa Saudi Arabia UAE Rest of Middle East and Africa
Market leaders and key company profiles	Compeq Manufacturing Co Ltd Kinsus Interconnect Technology Samsung Electro Mechanics Co Ltd AT S Austria Technologie Systemtechnik Aktiengesellschaft Zhen Ding Tech Group Technology Holding Limited TTM Technologies Inc Korea Circuit Shenzhen Kinwong Electronic Co Ltd ICAPE Holding SA LG Innotek Co Ltd

Substrate-Like PCB Market News and Recent Developments

The substrate-like PCBmarket is evaluated by gathering qualitative and quantitative data post primary and secondary research, which includes important corporate publications, association data, and databases. A few of the developments in the substrate-like PCB market are listed below:

ICAPE Group announced the signature of a contract for the acquisition of 100% of the capital of the Japanese group NTW, which specializes in the distribution of PCB in Asia. Access to the ICAPE Group's global logistics platform will enable NTW to offer new services to its customers, expand its product range, and thus increase profitable growth. (Source: ICAPE Group, Press Release, September 2024)
The China Intellectual Property Office announced the evaluation results of the 23rd China Patent Award. Kinwong's multilayer PCB production method and multilayer PCB board won the China Patent Excellence Award. The China Patent Award is co-sponsored by the China Intellectual Property Office and the World Intellectual Property Organization. (Source: Shenzhen Kinwong Electronic Co., Ltd.., Press Release, April 2022)

Substrate-Like PCB Market Report Coverage and Deliverables

The "Substrate-Like PCB Market Size and Forecast (2021–2031)" report provides a detailed analysis of the market covering below areas:

Substrate-Like PCB market size and forecast at global, regional, and country levels for all the key market segments covered under the scope
Substrate-Like PCB market trends, as well as market dynamics such as drivers, restraints, and key opportunities
Detailed PEST and SWOT analysis
Substrate-Like PCB market analysis covering key market trends, global and regional framework, major players, regulations, and recent market developments
Industry landscape and competition analysis covering market concentration, heat map analysis, prominent players, and recent developments for the substrate-like PCB market
Detailed company profiles