Substrate Like Pcb Market Scope And Analysis

Report Code : TIPRE00014544
Category : Electronics and Semiconductor

No. of Pages : 150

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Substrate-Like PCB Market Scope and Analysis Report by 2028

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Substrate-Like PCB Market Report Scope

Report Attribute	Details
Market size in 2023	US$ 1.74 Billion
Market Size by 2031	US$ 6.86 Billion
Global CAGR (2023 - 2031)	18.7%
Historical Data	2021-2022
Forecast period	2024-2031
Segments Covered	By Line/Space 25/25 and 30/30 µm Less than 25/25 µm By Inspection Technologies Automated Optical Inspection Direct Imaging Automated Optical Shaping By Application Consumer Electronics Automotive Medical Industrial
Regions and Countries Covered	North America US Canada Mexico Europe UK Germany France Russia Italy Rest of Europe Asia-Pacific China India Japan Australia Rest of Asia-Pacific South and Central America Brazil Argentina Rest of South and Central America Middle East and Africa South Africa Saudi Arabia UAE Rest of Middle East and Africa
Market leaders and key company profiles	AT S Compeq Co Ltd DAEDUCK ELECTRONICS Co Ltd IBIDEN KINSUS INTERCONNECT TECHNOLOGY CORP Korea Circuit SAMSUNG ELECTRO MECHANICS TTM Technologies Inc Unimicron Zhen Ding Tech Group Technology Holding Limited

Substrate-Like PCB Market News and Recent Developments

The substrate-like PCB market is evaluated by gathering qualitative and quantitative data post primary and secondary research, which includes important corporate publications, association data, and databases. A few of the developments in the substrate-like PCB market are listed below:

Samsung decided to invest a total of US$850 million in the establishment of FCBGA (Flip-chip Ball Grid Array) production facilities and infrastructure for its Vietnamese production plant. The investment will be executed in phases until 2023. With this investment, Samsung Electro-Mechanics plans to focus its capabilities on the semiconductor package substrate business, which is expected to grow significantly in the long term. (Source: Samsung Company Website/Newsletter, December 2021)
AT&S opened its first plant in Kulim, Malaysia, on 24 January 2024 and expected numerous guests from the world of politics and business on this occasion. The new AT&S plant in Kulim will produce IC substrates for the next generation of microchips for high-performance computing, data centers and AI applications of leading manufacturers such as AMD. (Source: AT&S Company Website, January 2024)

Substrate-Like PCB Market Report Coverage and Deliverables

The “Substrate-Like PCB Market Size and Forecast (2021–2031)” report provides a detailed analysis of the market covering below areas:

Substrate-like PCB market size and forecast at global, regional, and country levels for all the key market segments covered under the scope.
Substrate-like PCB market trends as well as market dynamics such as drivers, restraints, and key opportunities.
Detailed PEST/Porter’s Five Forces and SWOT analysis.
Substrate-like PCB market analysis covering key market trends, global and regional framework, major players, regulations, and recent market developments.
Industry landscape and competition analysis covering market concentration, heat map analysis, prominent players, and recent developments for the substrate-like PCB market.
Detailed company profiles.