Terahertz Technology Market Analysis, Size, and Growth (2023-2030)
Terahertz Technology Market Report Scope
Report Attribute | Details |
---|---|
Market size in 2022 | US$ 461.9 Million |
Market Size by 2030 | US$ 3,003.1 Million |
Global CAGR (2022 - 2030) | 26.4% |
Historical Data | 2020-2021 |
Forecast period | 2023-2030 |
Segments Covered |
By Component
|
Regions and Countries Covered | North America
|
Market leaders and key company profiles |
Recent Developments:
Inorganic and organic strategies such as mergers and acquisitions are highly adopted by companies in the terahertz technology market. A few recent key market developments are listed below:
- In 2023, Das-Nano technology was chosen by the Volkswagen Group to measure the layer thickness of its car body coverings. The automobile industry is highly competitive, necessitating the most stringent in-line quality control methods. However, the existing globally utilized quality control methods for measuring automobile body coating thickness have significant shortcomings that have been rectified with modern technology.
- In 2022, Advantest Corporation announced that its TAS7500 terahertz spectroscopic imaging system received a Laser Industry Award for Excellent Product at the Laser Society of Japan's 14th Industry Awards.
- In Nov-2021, A collaborative team of scientists from Vienna University of Technology (TU Wien) in Austria, the Institute of Solid State Physics in Russia, and Terasense Group, Inc. in the United States continued their R&D efforts aimed at developing THz Phase waveplates to support the ability to control and shaping terahertz beams.
- In May-2022, TeraView is thrilled to announce the release of the EOTPR 4500, a purpose-built integrated circuit package inspection machine. The auto prober technology developed by EOTPR 4500 will address the demands of the most modern IC packaging technology by accommodating substrate sizes of up to 150mmx150mm while enhancing probe tip positioning precision to +/- 0.5 m. Using the new auto prober, customers can probe very large chip-let devices with landing contact sizes of less than 5 m, such as copper pillars and TSV tips.