3D IC 和 2.5D IC 封装市场分析及预测(按规模、份额、增长、趋势划分)2031 年

  • Report Code : TIPRE00039688
  • Category : Electronics and Semiconductor
  • No. of Pages : 150
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预计 3D IC 和 2.5D IC 封装市场在 2025 年至 2031 年期间的复合年增长率为 10.8%,市场规模将从 2024 年的 XX 百万美元扩大到 2031 年的 XX 百万美元。

该报告按封装技术(3D 晶圆级芯片规模封装、3D TSV 和 2.5D)、应用(逻辑、存储器、MEMS/传感器、成像和光电子、LED)、最终用途(电信、消费电子、汽车、军事和国防、医疗设备、其他)细分

报告目的

Insight Partners 发布的《3D IC 和 2.5D IC 封装市场》报告旨在描述当前的市场格局和未来增长、主要驱动因素、挑战和机遇。这将为各业务利益相关者提供见解,例如:

  • 技术提供商/制造商:了解不断变化的市场动态并了解潜在的增长机会,使他们能够做出明智的战略决策。
  • 投资者:对市场增长率、市场财务预测以及整个价值链中存在的机会进行全面的趋势分析。
  • 监管机构:规范市场政策和警察活动,旨在最大限度地减少滥用行为,维护投资者的信任和信心,维护市场的完整性和稳定性。

 

3D IC 和 2.5D IC 封装市场细分

 

包装技术

  • 3D晶圆级芯片规模封装
  • 3D TSV 和 2.5D

应用

  • 逻辑
  • 记忆
  • MEMS/传感器
  • 成像与光电子
  • 引领

最终用途

  • 电信
  • 消费电子产品
  • 汽车
  • 军事与国防
  • 医疗器械

地理

  • 北美
  • 欧洲
  • 亚太地区
  • 中东和非洲
  • 南美洲和中美洲

 

定制此报告以满足您的要求

您可以免费定制任何报告,包括本报告的部分内容、国家级分析、Excel 数据包,以及为初创企业和大学提供优惠和折扣

3D IC 和 2.5D IC 封装市场:战略洞察

3D IC and 2.5D IC Packaging Market
  • 获取此报告的顶级关键市场趋势。
    此免费样品将包括数据分析,从市场趋势到估计和预测。

 

3D IC 和 2.5D IC 封装市场增长动力

  • 高性能计算需求不断增长:人工智能、机器学习和大数据分析等应用对高性能计算 (HPC) 的需求日益增长,这是 3D IC 和 2.5D IC 封装市场的重要驱动力。这些先进的封装技术能够实现更高的互连密度和更佳的热管理,这对于满足现代应用的计算需求至关重要。随着各行各业追求更高的性能和效率,3D 和 2.5D IC 封装解决方案的采用预计将大幅增长。
  • 电子设备小型化:消费电子、电信和物联网设备持续小型化趋势推动了对 3D 和 2.5D IC 封装技术的需求。这些封装方法能够在紧凑的空间内实现更高集成度的多个芯片,这对于开发更小、更轻、更高效的设备至关重要。随着制造商寻求优化空间并实现更高性能,先进封装解决方案的市场正在不断扩大。3.
  • 半导体制造技术的进步:硅通孔 (TSV) 和先进互连技术等半导体制造工艺的不断进步,正在推动 3D IC 和 2.5D IC 封装市场的增长。这些创新增强了 IC 封装的可扩展性和性能,使制造商能够打造出满足各种应用日益增长的需求的产品。随着半导体技术的不断发展,对能够与这些进步相辅相成的先进封装解决方案的需求变得至关重要。

3D IC 和 2.5D IC 封装市场未来趋势

  • 系统级芯片 (SoC) 设计的应用日益广泛:在各种电子应用中,包括移动设备和汽车系统,系统级芯片 (SoC) 设计的采用趋势日益增长。3D IC 和 2.5D IC 封装技术有助于将多种功能集成到单个芯片上,从而提高性能并降低功耗。这一趋势推动了更紧凑、更高效的设备的发展,进一步推动了对先进封装解决方案的需求。
  • 专注于热管理解决方案:随着电子设备功能越来越强大、体积越来越小,有效的热管理解决方案变得越来越重要。开发先进热管理技术(例如3D IC和2.5D IC封装中的热通孔和散热器)的趋势日益增强。制造商正致力于优化热性能,以确保高性能设备的可靠运行和长寿命,这正在塑造封装市场的未来。
  • 行业合作与伙伴关系:3D IC 和 2.5D IC 封装市场正见证着半导体制造商、封装公司和研究机构之间合作与伙伴关系的趋势。这些合作旨在推动创新、共享资源,并开发能够满足行业不断发展的需求的下一代封装技术。随着各公司寻求利用彼此的优势来增强产品供应和市场覆盖范围,合资企业和战略联盟正变得越来越普遍。

3D IC 和 2.5D IC 封装市场机遇

  • 汽车和物联网领域的新兴应用:电动汽车 (EV) 和物联网 (IoT) 的兴起为 3D IC 和 2.5D IC 封装市场带来了巨大的机遇。这些应用需要先进的封装解决方案来处理复杂的功能,例如传感器集成、数据处理和连接。随着汽车和物联网行业的持续增长,对满足其特定需求的创新封装解决方案的需求也将不断增长,这为制造商提供了充足的机会。
  • 5G技术部署的增长:5G技术的全球部署为3D IC和2.5D IC封装市场创造了巨大的机遇。5G网络的高速、低延迟要求需要能够支持更高数据处理和传输能力的先进半导体解决方案。能够提升性能和效率的封装技术对于满足5G基础设施的需求至关重要,并将在未来几年为市场带来显著增长奠定基础。
  • 研发投入:3D IC 和 2.5D IC 封装市场的企业在研发方面拥有越来越多的投资机会。通过专注于开发创新的封装技术和材料,企业能够从竞争对手中脱颖而出,并应对新兴的行业挑战。研发投入可以带来性能、成本降低和可持续性方面的突破,使企业能够占领新的细分市场并增强竞争优势。

 

3D IC 和 2.5D IC 封装市场区域洞察

Insight Partners 的分析师已详尽阐述了预测期内影响 3D IC 和 2.5D IC 封装市场的区域趋势和因素。本节还讨论了北美、欧洲、亚太地区、中东和非洲以及南美和中美洲的 3D IC 和 2.5D IC 封装市场细分和地域分布。

3D IC and 2.5D IC Packaging Market
  • 获取 3D IC 和 2.5D IC 封装市场的区域特定数据

3D IC 和 2.5D IC 封装市场报告范围

报告属性细节
2024年的市场规模XX百万美元
2031年的市场规模XX百万美元
全球复合年增长率(2025-2031)10.8%
史料2021-2023
预测期2025-2031
涵盖的领域按封装技术
  • 3D晶圆级芯片规模封装
  • 3D TSV 和 2.5D
按应用
  • 逻辑
  • 记忆
  • MEMS/传感器
  • 成像与光电子
  • 引领
按最终用途
  • 电信
  • 消费电子产品
  • 汽车
  • 军事与国防
  • 医疗器械
覆盖地区和国家北美
  • 我们
  • 加拿大
  • 墨西哥
欧洲
  • 英国
  • 德国
  • 法国
  • 俄罗斯
  • 意大利
  • 欧洲其他地区
亚太
  • 中国
  • 印度
  • 日本
  • 澳大利亚
  • 亚太其他地区
南美洲和中美洲
  • 巴西
  • 阿根廷
  • 南美洲和中美洲其他地区
中东和非洲
  • 南非
  • 沙特阿拉伯
  • 阿联酋
  • 中东和非洲其他地区
市场领导者和主要公司简介
  • 三星电子有限公司
  • 台湾半导体制造股份有限公司
  • 英特尔公司
  • 日月光科技控股股份有限公司
  • Amkor 技术
  • 博通
  • 德州仪器公司
  • 联华电子
  • 长电科技集团股份有限公司
  • 力成科技股份有限公司

 

3D IC 和 2.5D IC 封装市场参与者密度:了解其对业务动态的影响

3D IC 和 2.5D IC 封装市场正在快速增长,这得益于终端用户需求的不断增长,而这些需求的驱动因素包括消费者偏好的不断变化、技术进步以及对产品优势的认知度不断提高。随着需求的增长,企业正在扩展产品线,不断创新以满足消费者需求,并抓住新兴趋势,从而进一步推动市场增长。

市场参与者密度是指特定市场或行业内企业或公司的分布情况。它表明特定市场空间内竞争对手(市场参与者)的数量相对于其规模或总市值而言。

在 3D IC 和 2.5D IC 封装市场运营的主要公司有:

  1. 三星电子有限公司
  2. 台湾半导体制造股份有限公司
  3. 英特尔公司
  4. 日月光科技控股股份有限公司
  5. Amkor 技术
  6. 博通

免责声明以上列出的公司没有按照任何特定顺序排列。


3D IC and 2.5D IC Packaging Market

 

  • 获取 3D IC 和 2.5D IC 封装市场主要参与者概览

 

 

主要卖点

 

  • 全面覆盖:报告全面涵盖了 3D IC 和 2.5D IC 封装市场的产品、服务、类型和最终用户的分析,提供了整体概况。
  • 专家分析:本报告基于对行业专家和分析师的深入了解而编写。
  • 最新信息:该报告涵盖了最新信息和数据趋势,确保了业务相关性。
  • 定制选项:此报告可以定制以满足特定客户要求并适合业务策略。

因此,这份关于3D IC和2.5D IC封装市场的研究报告,有助于引领解读行业现状和增长前景的步伐。尽管存在一些合理的担忧,但本报告的总体优势往往大于劣势。

  • 历史分析(2 年)、基准年、预测(7 年)及复合年增长率
  • PEST 和 SWOT 分析
  • 市场规模价值/数量 - 全球、区域、国家
  • 行业和竞争格局
  • Excel 数据集
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Report Coverage
Report Coverage

Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends

Segment Covered
Segment Covered

This text is related
to segments covered.

Regional Scope
Regional Scope

North America, Europe, Asia Pacific, Middle East & Africa, South & Central America

Country Scope
Country Scope

This text is related
to country scope.

常见问题


What are the deliverable formats of the 3D IC and 2.5D IC Packaging market report?

The report can be delivered in PDF/PPT format; we can also share excel dataset based on the request.

What is the future trend of the 3D IC and 2.5D IC Packaging market?

There is a growing trend towards the adoption of system-on-chip (SoC) designs in various electronic applications, including mobile devices and automotive systems.

Which are the leading players operating in the 3D IC and 2.5D IC Packaging market?

The major players in the market includes Samsung Electronics Ltd., Taiwan Semiconductor Manufacturing Company, Ltd., Intel Corporation, ASE Technology Holding Co., Ltd., Amkor Technology, Broadcom, Texas Instruments Inc., United Microelectronics Corporation, JCET Group Co., Ltd., and Powertech Technology Inc.

What are the driving factors impacting the global 3D IC and 2.5D IC Packaging market?

Rising Demand for High-Performance Computing: The increasing need for high-performance computing (HPC) in applications such as artificial intelligence, machine learning, and big data analytics is a significant driver for the 3D IC and 2.5D IC packaging market.

What is the expected CAGR of the 3D IC and 2.5D IC Packaging market?

The global 3D IC and 2.5D IC Packaging market is expected to grow at a CAGR of 10.8% during the forecast period 2024 - 2031.

Trends and growth analysis reports related to Electronics and Semiconductor : READ MORE..   
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The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.

  1. Data Collection and Secondary Research:

As a market research and consulting firm operating from a decade, we have published and advised several client across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.

Several associations trade associates, technical forums, institutes, societies and organization are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in last 3 years are scrutinized and analyzed to understand the current market trends.

  1. Primary Research:

The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.

For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.

A typical research interview fulfils the following functions:

  • Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
  • Validates and strengthens in-house secondary research findings
  • Develops the analysis team’s expertise and market understanding

Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:

  • Industry participants: VPs, business development managers, market intelligence managers and national sales managers
  • Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.

Below is the breakup of our primary respondents by company, designation, and region:

Research Methodology

Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.

  1. Data Analysis:

Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.

  • Macro-Economic Factor Analysis:

We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.

  • Country Level Data:

Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.

  • Company Profile:

The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.

  • Developing Base Number:

Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.

  1. Data Triangulation and Final Review:

The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.

We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.

We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.