3D 堆叠市场规模预计将从 2023 年的 18.1 亿美元增至 2031 年的 59.4 亿美元。预计 2023 年至 2031 年期间,该市场的复合年增长率将达到 16.0%。为游戏目的采用快速处理器可能仍将是市场的主要趋势。
3D堆叠市场分析
3D 堆叠配置中的较短互连可降低功耗并提高信号完整性,使其成为节能和高性能应用的理想解决方案。3D 堆叠技术的日益普及是推动3D 堆叠市场增长的关键因素。该技术允许在基板上堆叠芯片,从而创建更小、更节能的封装芯片。此外,3D 堆叠技术促进了创新、功能丰富的产品的开发,特别是在消费电子领域。垂直堆叠内存和逻辑组件的能力允许创建更强大、更紧凑的设备,这符合市场对时尚、高性能设备的需求。
3D 堆叠市场概览
3D 堆叠技术代表了半导体封装领域的一项变革性进步,为电子元件集成和互连方式带来了范式转变。这项尖端技术涉及垂直堆叠多个集成电路 (IC) 层,通常使用硅通孔 (TSV) 建立堆叠层之间的连接。3D 堆叠技术有可能彻底改变各个行业的产品设计和性能,以更紧凑的形式实现卓越的功能。此外,这项技术使企业能够始终站在技术创新的前沿,在快速发展的电子设备和半导体解决方案领域中保持竞争地位。3D 堆叠技术能够将不同的组件(如内存、逻辑和传感器)高效集成到单个封装中,从而提高性能并减少占用空间。该技术有助于提供简化的制造流程、优化的供应链管理和节省成本。
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3D 堆叠市场驱动因素和机遇
消费电子产品需求上升利好市场
智能手机、平板电脑、智能手表和便携式设备等时尚、功能丰富、节能的设备需求不断增长,给制造商带来了巨大的压力,要求它们提供紧凑、高性能的解决方案。例如,根据 2024 年 2 月发布的 Omdia 数据, 2023 年第四季度智能手机的初步出货量为 3.28 亿部。这比 2022 年第四季度增长了 8.6%,使 2023 年第四季度成为自 2021 年第二季度以来首次出现大幅增长的季度。全球消费者正在广泛使用智能手机进行购物、通信、娱乐和其他用途。这些设备使用 3D 堆叠芯片封装,这正在彻底改变其设计和功能。3D 堆叠芯片封装能够显着减小外形尺寸而不会影响性能。通过垂直堆叠多层集成电路,该技术允许在紧凑的空间内顺利集成各种组件。这种整合不仅简化了设计和组装流程,而且还使制造商能够制造出更薄、更美观的设备,以满足消费者不断变化的喜好。
高带宽内存需求激增
高带宽存储器 (HBM) 通过垂直堆叠大量动态随机存取存储器 (DRAM) 达到极高的密度,具有快速数据处理和低功耗的特点。它在高性能计算 (HPC) 中至关重要,例如生成式 AI,这需要以极快的速度处理大量数据。三星电子 12 层堆叠 HBM 使用下一代 3D 堆叠封装技术来提高性能和产量。HBM3 的处理速度为 6.4Gbps,带宽为 819 GB/s,比上一代 DRAM 快 1.8 倍,同时功耗降低 10%。高性能计算应用对 HBM 的需求鼓励市场参与者增加产量。例如,2024 年 3 月,SK HYNIX INC 开始批量生产 HBM3E1,这是最新的超高性能 AI 存储器产品。HBM3E 专为快速处理大量数据的 AI 系统而设计。高带宽存储器被电信、汽车、医疗保健和制造业等各个行业用于高速数据处理。
3D 堆叠市场报告细分分析
有助于得出 3D 堆叠市场分析的关键部分是技术、设备类型和最终用户。
- 根据技术,3D 堆叠市场细分为硅通孔、单片 3D 集成和 3D 混合键合。硅通孔细分市场在 2023 年占据了更大的市场份额。
- 根据设备类型,3D 堆叠市场细分为存储设备、mems/传感器、led、成像和光电子等。存储设备细分市场在 2023 年占据了市场主导地位。
- 从终端用户来看,3D 堆叠市场细分为消费电子、电信、汽车、制造、医疗保健等。消费电子领域在 2023 年占据了市场主导地位。
3D 堆叠市场份额(按地区)分析
- 3D 堆叠市场分为五大区域:北美、欧洲、亚太地区 (APAC)、中东和非洲 (MEA) 以及南美和中美。2023 年,亚太地区占据市场主导地位,其次是北美和欧洲。
- 亚太地区 3D 堆叠市场的增长归因于半导体制造和消费电子产品需求的不断增长。据亚太基金会称,中国大陆和台湾大幅增加了对芯片制造的投资,预计这也将使韩国和日本受益。此外,台湾半导体制造公司计划在日本设立第一家工厂,这符合日本首相优先发展半导体制造以进一步扩大国内供应链的议程。此外,预计半导体制造和消费电子行业的扩张将在预测期内为市场增长创造丰厚的机会。
3D 堆叠市场区域洞察
Insight Partners 的分析师已详细解释了预测期内影响 3D 堆叠市场的区域趋势和因素。本节还讨论了北美、欧洲、亚太地区、中东和非洲以及南美和中美洲的 3D 堆叠市场细分和地理位置。
- 获取 3D 堆叠市场的区域特定数据
3D 堆叠市场报告范围
报告属性 | 细节 |
---|---|
2023 年的市场规模 | 181万美元 |
2031 年市场规模 | 594万美元 |
全球复合年增长率(2023 - 2031) | 16.0% |
史料 | 2021-2022 |
预测期 | 2024-2031 |
涵盖的领域 | 通过互联技术
|
覆盖地区和国家 | 北美
|
市场领导者和主要公司简介 |
|
3D 堆叠市场参与者密度:了解其对业务动态的影响
3D 堆叠市场正在快速增长,这得益于终端用户需求的不断增长,而这些需求又源于消费者偏好的不断变化、技术进步以及对产品优势的认识不断提高等因素。随着需求的增加,企业正在扩大其产品范围,进行创新以满足消费者的需求,并利用新兴趋势,从而进一步推动市场增长。
市场参与者密度是指在特定市场或行业内运营的企业或公司的分布情况。它表明在给定市场空间中,相对于其规模或总市场价值,有多少竞争对手(市场参与者)存在。
在 3D 堆叠市场运营的主要公司有:
- 台湾半导体制造有限公司
- 英特尔公司
- 超微半导体公司
- 博通公司
- 恩智浦半导体
- 日月光科技
免责声明:上面列出的公司没有按照任何特定顺序排列。
- 获取 3D 堆叠市场顶级关键参与者概览
3D 堆叠市场新闻和最新发展
通过收集一手和二手研究后的定性和定量数据来评估 3D 堆叠市场,其中包括重要的公司出版物、协会数据和数据库。下面列出了 3D 堆叠市场的一些发展:
- 在 2023 年 IEEE 国际电子设备会议 (IEDM) 上,英特尔研究人员展示了 3D 堆叠互补金属氧化物半导体 (CMOS) 晶体管与背面供电和直接背面接触相结合的进展。该公司还报告了背面供电(例如背面接触)的最新研发突破的扩展路径,并且首次在同一 300 毫米 (mm) 晶圆上(而不是在封装上)成功展示了硅晶体管与氮化镓 (GaN) 晶体管的大规模 3D 单片集成。(来源:英特尔公司,新闻稿,2023 年 12 月)
3D 堆叠市场报告覆盖范围和交付成果
“3D 堆叠市场规模和预测(2021-2031 年)”对市场进行了详细分析,涵盖以下领域:
- 范围内涵盖的所有关键细分市场的全球、区域和国家层面的 3D 堆叠市场规模和预测
- 3D 堆叠市场趋势以及市场动态,例如驱动因素、限制因素和关键机遇
- 详细的 PEST/波特五力分析和 SWOT 分析
- 3D 堆叠市场分析涵盖关键市场趋势、全球和区域框架、主要参与者、法规和最新市场发展
- 行业格局和竞争分析,涵盖市场集中度、热图分析、知名参与者以及 3D 堆叠市场的最新发展
- 详细的公司简介
- Historical Analysis (2 Years), Base Year, Forecast (7 Years) with CAGR
- PEST and SWOT Analysis
- Market Size Value / Volume - Global, Regional, Country
- Industry and Competitive Landscape
- Excel Dataset
Report Coverage
Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends
Segment Covered
This text is related
to segments covered.
Regional Scope
North America, Europe, Asia Pacific, Middle East & Africa, South & Central America
Country Scope
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to country scope.
Frequently Asked Questions
The key players holding majority shares in the global 3D stacking market are Taiwan Semiconductor Manufacturing Company Limited, Intel Corp, Advanced Micro Devices, Broadcom Inc., NXP Semiconductors, ASE Technology, Texas Instruments Incorporated, MediaTek Inc., Amkor Technology, and Samsung Semiconductor, Inc.
Asia Pacific dominated the 3D stacking market in 2023.
The rising demand for consumer electronic is the major factors that propel the global 3D stacking market.
The global 3D stacking market is estimated to register a CAGR of 16.0% during the forecast period 2023–2031.
The global 3D stacking market is expected to reach US$ 5.94 billion by 2031.
Adotion of fast processors for gaming purposes to play a significant role in the global 3D stacking market in the coming years.
Trends and growth analysis reports related to Electronics and Semiconductor : READ MORE..
The List of Companies - 3D Stacking Market
- Taiwan Semiconductor Manufacturing Co Ltd
- Samsung Electronics Co Ltd
- Intel Corp
- MediaTek Inc
- Texas Instruments Inc
- Amkor Technology Inc
- ASE Technology Holding Co Ltd
- Advanced Micro Devices Inc
- 3M Co
- Globalfoundries Inc
The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.
- Data Collection and Secondary Research:
As a market research and consulting firm operating from a decade, we have published and advised several client across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.
Several associations trade associates, technical forums, institutes, societies and organization are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in last 3 years are scrutinized and analyzed to understand the current market trends.
- Primary Research:
The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.
For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.
A typical research interview fulfils the following functions:
- Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
- Validates and strengthens in-house secondary research findings
- Develops the analysis team’s expertise and market understanding
Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:
- Industry participants: VPs, business development managers, market intelligence managers and national sales managers
- Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.
Below is the breakup of our primary respondents by company, designation, and region:
Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.
- Data Analysis:
Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.
- Macro-Economic Factor Analysis:
We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.
- Country Level Data:
Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.
- Company Profile:
The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.
- Developing Base Number:
Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.
- Data Triangulation and Final Review:
The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.
We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.
We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.