EMEA and APAC Solder Materials Market Analysis and Size 2030
市场洞察和分析师观点:
焊接材料涵盖电子组装和焊接工艺中使用的各种产品。这些材料在电子元件和电路板之间建立可靠的电气连接方面发挥着至关重要的作用。在平板电脑、笔记本电脑和智能手机等消费电子产品需求不断增长的推动下,电子行业的不断扩张正在推动欧洲、中东和非洲和亚太地区焊接材料市场的发展。
欧洲、中东和非洲和亚太地区焊接材料市场正在经历显着增长,推动主要是由于汽车和电信这两个关键行业的需求激增。此外,电子设备小型化和更紧凑的趋势需要能够建立高可靠性细间距连接的焊接材料。有关开发创新焊料材料(例如低温焊料合金和免清洗助焊剂)的持续研究,可满足不断变化的行业需求。
增长动力和挑战:
半导体行业由于电子设备需求的增加以及人工智能、物联网和汽车电子等应用的激增,该行业正在经历增长。由于不断创新,半导体技术在过去几年中迅速发展,使得能够开发出具有更好处理能力的小型、快速、节能的芯片。此外,对汽车电气化和自动驾驶能力开发的投资增加,正在为半导体制造商创造利润丰厚的商机。
根据半导体行业协会的数据,全球半导体销售额从 2022 年 11 月的 456 亿美元增长到2023年11月为480亿美元。亚太及其他地区半导体销售额同比增长7.1%,欧洲增长5.6%。此外,2022年中国半导体销售额同比增长7.6%。根据中国海关数据,用于生产硅片、集成电路和平板显示器的芯片制造工具进口额达到2023 年 10 月将达到 43 亿美元。
然而,原材料价格的波动对焊料市场的增长构成重大挑战。焊料材料严重依赖各种原材料,包括锡、银和铜。当这些材料的价格出现大幅波动时,焊料制造商面临着生产成本上升的问题。这可能会挤压他们的利润率并迫使他们提高自己的价格,从而可能阻止客户并阻碍市场增长。这些原材料的价格容易受到各种外部因素的影响,包括地缘政治事件、市场需求和供应链中断。当原材料价格出现突然或不可预测的波动时,会直接影响焊料的生产成本。制造商可能会面临采购必需金属的费用增加,从而导致总体生产成本上升。这些成本上升对于市场内的企业来说可能难以消化,可能会限制其竞争力和盈利能力。所有这些因素都对欧洲、中东和非洲和亚太地区焊接材料市场的增长构成挑战。
报告细分和范围:
“欧洲、中东和非洲和亚太地区焊接材料市场分析到 2030 年的预测”是一项专门且深入的研究,重点关注市场趋势和增长机会。该报告旨在提供市场概况,并按产品和工艺进行详细的市场细分。该市场最近经历了高速增长,预计在预测期内将继续这种趋势。该报告提供了欧洲、中东和非洲和亚太地区焊料消耗的重要统计数据。此外,欧洲、中东和非洲和亚太地区焊接材料市场报告还对影响欧洲、中东和非洲和亚太地区市场表现的各种因素进行了定性评估。该报告还包括对市场领先企业及其关键战略发展的全面分析。还包括对市场动态的多项分析,以帮助确定关键驱动因素、欧洲、中东和非洲 (EMEA) 和亚太地区焊接材料市场趋势以及利润丰厚的机会,从而有助于确定主要收入来源。
欧洲、中东和非洲 (EMEA)亚太地区焊接材料市场预测是根据各种二次和主要研究结果(例如主要公司出版物、协会数据和数据库)进行估计的。此外,生态系统分析和波特五力分析提供了 360 度的市场视角,有助于了解整个供应链以及影响 EMEA 和 APAC 焊料市场表现的各种因素。
细分分析:< br>
欧洲、中东和非洲 (EMEA) 和亚太地区焊接材料市场根据产品和工艺进行细分。根据产品,市场分为糊状、棒状、线状、球状等。到 2022 年,焊膏细分市场将在欧洲、中东和非洲 (EMEA) 和亚太地区焊料材料市场中占据重要份额。焊膏用于电子行业的表面安装组装工艺。它是粉末金属和焊剂的混合物。焊接过程中加热时,焊膏熔化,在元件和电路板之间形成粘合。它通过在孔内/上方印刷焊膏而用于通孔插针焊膏元件。通过模板印刷或喷射印刷将焊膏涂在电路板上,并通过拾放机或手工将元件安装到位。然而,这些过程需要适量的糊剂。在PCB生产过程中,印刷电路板(PCB)制造商通常通过焊膏检查来测试焊膏沉积情况。检查系统在应用元件和熔化焊料之前测量焊盘的体积。
欧洲、中东和非洲和亚太地区焊料材料市场份额 - 按产品划分,2022 年和 2030 年
区域分析:
按地区划分,欧洲、中东和非洲 (EMEA) 和亚太地区焊接材料市场细分为欧洲、亚太地区以及中东和非洲。 2022年欧洲市场价值将超过7亿美元。欧洲长期以来一直是全球电子制造业的关键参与者,推动了焊接材料需求的不断增长。该地区蓬勃发展的电子工业,从消费电子产品到工业机械,都依赖于精确可靠的焊接工艺来组装电子元件。因此,在对能够满足现代电子制造严格要求的高性能材料的需求的推动下,焊接材料市场持续增长。随着世界各国政府对进口和使用海外芯片越来越严格的政策,欧洲市场随着半导体市场的快速变化而增长。欧盟委员会 (EC) 于 2023 年 4 月通过了《欧盟芯片法案》,计划通过筹集 470 亿美元的公共和私人投资,到 2030 年将欧洲在全球芯片生产中的份额翻一番。该计划包括扩大先进芯片制造技术和研发设施。焊料材料通过在半导体元件和基板电极或引线框架之间形成键合层,在半导体制造中发挥着重要作用。
欧盟的汽车工业被认为是一个至关重要的行业,因为它对地区GDP。欧盟是全球领先的机动车辆生产国,宝马和大众等许多优质汽车制造商都位于该地区。该地区的汽车制造行业每年生产约 1920 万辆轿车、货车、公共汽车和卡车。大约 300 个汽车装配和制造工厂分布在该地区约 26 个国家。根据欧洲汽车制造商协会 (ACEA) 的数据,全球 21% 的汽车是由宝马、大众、奥迪和阿斯顿·马丁等公司在欧盟制造的。德国拥有该地区最大的汽车市场份额,即 30%。由于自动驾驶和先进驾驶辅助系统的出现,汽车制造商迅速倾向于采用汽车电子,导致对汽车电子集成的需求不断增加。这一因素推动了对半导体的需求,进一步推动了对焊接材料的需求。上述所有因素都支持欧洲、中东和非洲和亚太地区焊接材料市场的增长。
行业发展和未来机遇:
欧洲、中东和非洲和亚太地区焊接材料市场主要参与者的一些举措,例如以下列出了每份新闻稿:
2023 年,MacDermid Alpha 推出了新一代超低空洞焊膏 - ALPHA OM-362。这种无铅、零卤素、免清洗焊膏可以使底部端接元件 (BTC) 的空洞率低于 10%。 BTC 的设计特性在焊接过程中带来了空隙去除的挑战,这可能导致回流后应用中的散热和机械强度无效。低空洞焊膏对于通过减少这种影响来提高板级可靠性非常重要。2022 年,Indium Corp 将 SiPaste C201HF 添加到其用于精细特征印刷的焊膏产品组合中,该焊膏采用专门为适应精细特征而配制的无卤素、可清洁焊膏印刷,如 01005 和 008004 元件所示。2023 年,Nihon Superior Co Ltd 与 FCT Solder 合作,签订了 SN100CV 焊料合金的许可协议。该公司向 FCT Solder 授予其创新合金 SN100CV 的许可,该合金可提供经济高效的解决方案,并且在可靠性方面优于 SAC305。 2022 年,AIM Solder 宣布收购 BLT Circuit Services, Ltd.,这是一家综合性产品的领先制造商和分销商。适用于印刷电路和化学铣削行业的一系列消耗品。竞争格局和主要公司:
Indium Corp、Fusion Inc、Element Solutions Inc、KOKI Co Ltd、Stannol GmbH & Co KG、AIM Metals & Alloys LP 、Nihon Superior Co Ltd、GENMA Europe GmbH 和 National Solder Co Ltd 是欧洲、中东和非洲和亚太地区焊接材料市场报告中介绍的主要参与者。市场参与者专注于提供高质量的产品来满足客户的需求。
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The List of Companies - EMEA and APAC Solder Materials Market
- AIM Metals & Alloys LP
- KOKI Co Ltd
- Fusion Inc
- Stannol GmbH & Co KG
- National Solder Co (PTY) Ltd
- Nihon Superior Co Ltd
- GENMA Europe GmbH
- Indium Corp
- Element Solutions Inc
- Harima Chemicals Group Inc
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