半导体键合市场战略、顶级参与者、增长机会、2031 年分析和预测

  • Report Code : TIPRE00029751
  • Category : Electronics and Semiconductor
  • No. of Pages : 150
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Semiconductor Bonding Market Dynamics, Report, Scope by 2031

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预计到 2031 年,半导体键合市场规模将从 2023 年的 7.0973 亿美元增至 13.8472 亿美元。预计 2023-2031 年期间市场复合年增长率将达到 8.7%。物联网设备对堆叠芯片技术的需求增长以及政府对半导体行业的投资可能仍是市场的主要趋势。

半导体键合市场分析

消费电子产品、航空航天和国防设备以及医疗设备和机械对半导体键合的需求推动了市场的增长。预测期内,政府推动电动汽车市场的举措将产生对半导体键合的需求。智能手机和可穿戴设备的需求不断增长,进一步推动了市场的增长。

半导体键合市场概况

半导体键合用于生产大量设备和集成电路。半导体行业不断增长的需求是推动半导体键合市场的主要因素之一。制造业、汽车业、医疗保健等各行各业对半导体的需求促进了市场的增长。

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半导体键合市场:

半导体键合市场
  • Semiconductor Bonding Market
    复合年增长率(2023 - 2031)
    8.7%
  • 2023 年市场规模
    7.0973 亿美元
  • 市场规模 2031
    13.8472 亿美元

市场动态

增长动力
  • 物联网设备对堆叠芯片技术的需求不断增长
未来趋势
  • 人工智能、工业物联网和先进制造技术等新兴技术
机会
  • 政府对半导体行业的投资

关键人物

  • 帕洛玛技术公司
  • 松下公司
  • 东丽工业公司
  • 库利克与索法工业公司
  • 戴雅斯自动化(香港)有限公司
  • ASMPT 有限公司(原 ASM 太平洋科技有限公司)
  • EV 集团
  • 雅马哈摩托车公司(雅马哈机器人控股
  • WestBond 公司
  • 应用材料公司

区域概况

Semiconductor Bonding Market
  • 北美
  • 欧洲
  • 亚太
  • 南美洲和中美洲
  • 中东和非洲

市场细分

Semiconductor Bonding Market类型
  • 芯片焊接机
  • 晶圆键合机
  • 倒装芯片接合机
Semiconductor Bonding Market技术
  • 射频设备
  • MEMS 和传感器
  • 引领
  • CMOS 图像传感器
  • 3D NAND
  • 示例 PDF 通过定性和定量分析展示了内容结构和信息的性质。

半导体键合市场驱动因素和机遇

政府对半导体行业的投资

由于电动汽车、消费电子产品、机械等制造商对半导体的需求,半导体行业正在快速增长。全球各国政府机构都致力于推动国内制造业,以推动经济增长并减少对进口的依赖。为此,他们正在投资半导体制造业。例如,拜登总统于 2022 年 8 月 9 日签署了两党共同制定的《芯片和科学法案》。商务部正在监督 500 亿美元的资金,以振兴美国半导体产业并加强该国的经济和国家安全。

混合键合的出现

半导体键合的先进技术之一是混合键合。该技术正得到广泛关注,以有效地测试和准备用于大批量生产的混合键合方法。它正被用于半导体研发部门。采用混合键合可节省汽车、消费电子等行业系统的空间。因此,由于对这种先进技术的需求,市场参与者正在推出创新的解决方案。例如,2024 年 5 月,SÜSS MicroTec SE 推出了 XBC300 Gen2 D2W/W2W,这是一种突破性的混合键合平台,专为 200 毫米和 300 毫米基板设计,提供多功能晶圆到晶圆 (W2W) 和芯片到晶圆 (D2W) 键合功能。

半导体键合市场报告细分分析

有助于得出半导体键合市场分析的关键部分是类型和技术。

  • 根据类型,半导体键合市场分为芯片键合机、晶圆键合机和倒装芯片键合机。晶圆键合机部分在 2023 年占据了最大的市场份额。
  • 根据最终用户,市场细分为 RF 设备、MEMS 和传感器、LED、CMOS 图像传感器和 3D NAND。RF 设备细分市场在 2023 年占据了相当大的市场份额。

半导体键合市场份额(按地区)分析

半导体键合市场报告的地理范围主要分为五个区域:北美、亚太、欧洲、中东和非洲、南美和中美。

2023 年,亚太地区占据了最大的市场份额。中国、印度、日本和台湾是占据了很大市场份额的国家。政府当局正在投资半导体制造,这产生了对半导体键合的需求。例如,2022 年 11 月,印度政府批准了一项旨在发展印度半导体和显示器制造生态系统的综合计划,经费超过 100 亿美元。该计划旨在为从事硅半导体工厂、显示器工厂、化合物半导体/硅光子学/传感器(包括 MEMS)工厂/分立半导体工厂、半导体封装(ATMP/OSAT)和半导体设计的公司/财团提供有吸引力的激励支持。

半导体键合市场报告范围

报告属性细节
2023 年的市场规模7.0973亿美元
2031 年市场规模13.8472亿美元
全球复合年增长率(2023 - 2031)8.7%
史料2021-2022
预测期2024-2031
涵盖的领域按类型
  • 芯片焊接机
  • 晶圆键合机
  • 倒装芯片接合机
按技术分类
  • 射频设备
  • MEMS 和传感器
  • 引领
  • CMOS 图像传感器
  • 3D NAND
覆盖地区和国家北美
  • 我们
  • 加拿大
  • 墨西哥
欧洲
  • 英国
  • 德国
  • 法国
  • 俄罗斯
  • 意大利
  • 欧洲其他地区
亚太
  • 中国
  • 印度
  • 日本
  • 澳大利亚
  • 亚太其他地区
南美洲和中美洲
  • 巴西
  • 阿根廷
  • 南美洲和中美洲其他地区
中东和非洲
  • 南非
  • 沙特阿拉伯
  • 阿联酋
  • 中东和非洲其他地区
市场领导者和主要公司简介
  • 帕洛玛技术公司
  • 松下公司
  • 东丽工业公司
  • 库利克与索法工业公司
  • 戴雅斯自动化(香港)有限公司
  • ASMPT 有限公司(原 ASM 太平洋科技有限公司)
  • EV 集团
  • 雅马哈摩托车公司(雅马哈机器人控股
  • WestBond 公司
  • 应用材料公司
  • 示例 PDF 通过定性和定量分析展示了内容结构和信息的性质。

半导体键合市场新闻和最新发展

半导体键合市场通过收集一手和二手研究后的定性和定量数据进行评估,其中包括重要的公司出版物、协会数据和数据库。下面列出了半导体键合市场的一些发展情况:

  • 作为田中贵金属的核心公司之一,田中贵金属工业株式会社开发工业贵金属产品,宣布已建立一种金粒子接合技术,用于半导体的高密度安装,该技术使用 AuRoFUSE 低温烧制膏进行金对金接合。AuRoFUSE 是由亚微米级金粒子和溶剂组成的组合物,可形成具有低电阻和高热导率的接合材料,从而实现低温下的金属接合。使用 AuRoFUSE 预制件(干燥膏状),该技术可实现 4 μm 细间距安装,凸块尺寸为 20 μm。(来源:田中控股株式会社,新闻稿,2024 年 3 月)
  • BE Semiconductor Industries NV(“公司”或“Besi”)是一家领先的半导体行业组装设备制造商,该公司宣布已收到一家领先的半导体逻辑制造商的 26 台混合键合系统订单。(来源:Besi,新闻稿,2024 年 5 月)

半导体键合市场报告范围和交付成果

“半导体键合市场规模和预测(2021-2031)”报告对以下领域进行了详细的市场分析:

  • 半导体键合市场规模及全球、区域和国家层面所有关键细分市场的预测
  • 半导体键合市场趋势以及市场动态,如驱动因素、限制因素和关键机遇
  • 详细的 PEST/波特五力分析和 SWOT 分析
  • 半导体键合市场分析涵盖主要市场趋势、全球和区域框架、主要参与者、法规和最新市场发展
  • 行业格局和竞争分析,涵盖市场集中度、热图分析、知名参与者以及半导体键合市场的最新发展
  • 详细的公司简介
Report Coverage
Report Coverage

Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends

Segment Covered
Segment Covered

This text is related
to segments covered.

Regional Scope
Regional Scope

North America, Europe, Asia Pacific, Middle East & Africa, South & Central America

Country Scope
Country Scope

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to country scope.

Frequently Asked Questions


What would be the estimated value of the semiconductor bonding market by 2031?

The estimated value of the semiconductor bonding market will be US$ 1384.72 million by 2031.

Which are the leading players operating in the semiconductor bonding market?

Palomar Technologies; Panasonic Corporation; Toray Industries Inc; Kulicke & Soffa Industries, Inc; DIAS Automation (HK) Ltd; ASMPT Ltd (formerly ASM Pacific Technology Ltd.); EV Group; Yamaha Motor Corporation (Yamaha Robotics Holdings); WestBond, Inc.; and Applied Materials, Inc. are some of the key players operating in the semiconductor bonding market.

What are the driving factors impacting the semiconductor bonding market?

The rise in demand for stack die technology in IoT devices, and government investment in the semiconductor industry are the key driving factors impacting the semiconductor bonding market.

What is the future trend of the semiconductor bonding market?

Emerging technologies such as AI, IIoT, and advanced manufacturing techniques are key trends in the semiconductor bonding market.

What is the expected CAGR of the semiconductor bonding market?

The global semiconductor bonding market is estimated to register a CAGR of 8.7% during the forecast period 2023–2031.

The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.

  1. Data Collection and Secondary Research:

As a market research and consulting firm operating from a decade, we have published and advised several client across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.

Several associations trade associates, technical forums, institutes, societies and organization are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in last 3 years are scrutinized and analyzed to understand the current market trends.

  1. Primary Research:

The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.

For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.

A typical research interview fulfils the following functions:

  • Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
  • Validates and strengthens in-house secondary research findings
  • Develops the analysis team’s expertise and market understanding

Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:

  • Industry participants: VPs, business development managers, market intelligence managers and national sales managers
  • Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.

Below is the breakup of our primary respondents by company, designation, and region:

Research Methodology

Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.

  1. Data Analysis:

Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.

  • Macro-Economic Factor Analysis:

We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.

  • Country Level Data:

Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.

  • Company Profile:

The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.

  • Developing Base Number:

Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.

  1. Data Triangulation and Final Review:

The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.

We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.

We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.

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