电子组装焊接市场概况、增长、趋势、分析、研究报告(2023-2028)

  • Report Code : TIPRE00029876
  • Category : Electronics and Semiconductor
  • Status : Published
  • No. of Pages : 119
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Soldering in Electronics Assembly Market Size Report – Global Forecasts 2028

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[研究报告] 电子组装焊接市场预计将从 2023 年的 20.0196 亿美元增长到 2028 年的 26.2471 亿美元;预计 2023 年至 2028 年的复合年增长率为 5.6%。

电子元件的小型化在电子行业中发挥着重要作用。它有助于节省空间,以便集成额外的部件或技术,或者可以减小消费电子产品、医疗设备、汽车等的整体尺寸。例如,电池尺寸的减小有助于计算机小型化。此外,小型化有助于节省所用材料的总成本。对于微型元件,焊接使用的材料较少,与普通尺寸的元件或设备相比,这有助于节省所用材料的成本。小型化的这些好处正在推动电子市场对这种技术的需求。此外,对金属颗粒尺寸较小的焊膏的需求推动了电子组装市场焊接的增长。总部位于法国的 INVENTEC 提供 Ecorel Free JP32 和 Ecorel Free HT 235-16LVD 焊膏,可用于超细间距电子制造应用的小型化。由于对小型化的需求不断增长,该公司正在开发更多的焊膏产品。因此,电子行业小型化程度的提高预计将为电子组装市场焊接提供增长机会。

 

电子组装市场中的焊接 -

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电子组装市场中的焊接:

Soldering in Electronics Assembly Market: Strategic Insights

Soldering in Electronics Assembly Market
  • CAGR
    CAGR (2023 - 2028)
    5.6%
  • Market Size 2023
    US$ 2 Billion
  • Market Size 2028
    US$ 2.62 Billion

Market Dynamics

GROWTH DRIVERS
  • 电子行业的增长
  • 新产品开发
FUTURE TRENDS
  • 焊接机器人
OPPORTUNITIES
  • 电子工业小型化程度不断提高

Key Players

  • Lucas Milhaupt Inc
  • GENMA Europe GmbH
  • S Bond Technology
  • Fusion Incorporated
  • Indium Corporation
  • KOKI Company Ltd
  • SUPERIOR FLUX MFG CO
  • MacDermid Alpha Electronics Solutions
  • Nathan Trotter Co Inc

Regional Overview

Regional And Country Scope
  • 北美(美国、加拿大、墨西哥)
  • 欧洲(英国、德国、法国、俄罗斯、意大利、欧洲其他地区)
  • 亚太地区(中国、印度、日本、澳大利亚、亚太地区其他地区)
  • 南美洲和中美洲(巴西、阿根廷、南美洲和中美洲其他地区)
  • 中东和非洲(南非、沙特阿拉伯、阿联酋、中东和非洲其他地区)

Market Segmentation

Segment 1产品(线材、焊膏、棒材、焊剂及其他)

    电子组装市场中的焊接
    • Soldering in Electronics Assembly Market
      复合年增长率(2023 - 2028)
      5.6%
    • 2023 年市场规模
      20 亿美元
    • 2028 年市场规模
      26.2 亿美元

    市场动态

    增长动力
    • 电子产业的增长
    • 新产品开发
    未来的趋势
    • 焊接机器人
    机会
    • 电子工业小型化程度不断提高

    关键人物;主力;重要一员

    •  
    • 卢卡斯-米尔豪普特公司
    • GENMA 欧洲有限公司
    • S-Bond 技术
    • 融合公司
    • 铟公司
    • 光机株式会社
    • 卓越通量与制造公司
    • 麦德美德阿尔法电子解决方案
    • 内森·特罗特公司

    区域概况

    Soldering in Electronics Assembly Market
    • 北美
    • 欧洲
    • 亚太
    • 南美洲和中美洲
    • 中东和非洲

    市场细分

    Soldering in Electronics Assembly Market产品
    • 金属丝
    • 粘贴
    • 酒吧
    • 通量
    • 其他的
    • 示例 PDF 通过定性和定量分析展示了内容结构和信息的性质。

     

    COVID-19 疫情对电子组装市场焊接的影响

    新冠疫情导致制造业中断,影响了从供应链和运营到资本支出、贷款和长期战略的每一个流程。疫情扰乱了零部件出口,并中断了大规模制造。根据联合国贸易和发展会议 (UNCTAD) 的数据,2020 年全球外国直接投资 (FDI) 与 2019 年相比下降了 42%。疫情期间,锡和铅的价格飙升,导致焊接产品需求下降。另一方面,由于疫情,对起搏器、除颤器、神经刺激器、超声波机器和输液泵等医疗设备的需求增加。此外,在家办公文化和在线教育是疫情期间推动笔记本电脑和手机需求的一些因素。例如,联想由于采用在家办公模式,在 2020 年第二季度取得了可观的财务业绩;同比增长 7%。因此,COVID 的影响对电子组装市场的焊接业务造成了负面影响。

     

    市场洞察 – 电子组装市场中的焊接

     

    多年来,中国和印度大幅增加了对制造业的投资。这些国家还启动了“中国制造 2025”和“印度制造”等计划,以促进本地制造业的发展。此外,廉价劳动力的存在推动了印度和中国制造业的快速发展,使这些国家成为生产消费电子产品和电子元件(如 PCB、传感器、硬盘和主板)的中心。此外,跨国公司在医疗设备制造、电子和汽车等行业的投资增加,在该地区建立生产工厂,预计将在未来几年进一步促进亚太地区电子组装焊接市场的增长。

     

    产品洞察

    根据产品,电子组装中的焊接市场规模细分为焊丝、焊膏、助焊剂、焊条和其他。 2022 年,焊丝部分占据了最大的市场份额。 焊锡丝有多种厚度、类型和焊接方法。 手动焊锡丝、激光焊接和自动烙铁焊接是常用的焊接方法。 根据成分,市场上有含铅和无铅焊锡丝。 大多数应用中都使用无铅焊锡丝来符合 RoHS 指令。 无铅焊锡丝具有很强的润湿性,因为它含有 3% 的银。 无银焊锡丝节省了电子组装的运营成本。

    焊剂芯焊锡丝可用于各种工艺,包括自动焊接和机器人焊接。Indium Corporation 生产的 CW-818 焊剂芯焊锡丝具有快速润湿速度,可最大限度地缩短手动和机器人焊接工艺的循环时间;该焊锡丝具有焊剂芯的耐热性和低飞溅特性,从而为手动和机器人焊接工艺提供更好的组件。

     

    电子组装市场中的焊接报告范围

    报告属性细节
    2023 年的市场规模20亿美元
    2028 年市场规模26.2亿美元
    全球复合年增长率(2023 - 2028)5.6%
    历史数据2021-2022
    预测期2024-2028
    涵盖的领域按产品
    • 金属丝
    • 粘贴
    • 酒吧
    • 通量
    • 其他的
    覆盖地区和国家北美
    • 我们
    • 加拿大
    • 墨西哥
    欧洲
    • 英国
    • 德国
    • 法国
    • 俄罗斯
    • 意大利
    • 欧洲其他地区
    亚太
    • 中国
    • 印度
    • 日本
    • 澳大利亚
    • 亚太其他地区
    南美洲和中美洲
    • 巴西
    • 阿根廷
    • 南美洲和中美洲其他地区
    中东和非洲
    • 南非
    • 沙特阿拉伯
    • 阿联酋
    • 中东和非洲其他地区
    市场领导者和主要公司简介
    •  
    • 卢卡斯-米尔豪普特公司
    • GENMA 欧洲有限公司
    • S-Bond 技术
    • 融合公司
    • 铟公司
    • 光机株式会社
    • 卓越通量与制造公司
    • 麦德美德阿尔法电子解决方案
    • 内森·特罗特公司
    • 示例 PDF 通过定性和定量分析展示了内容结构和信息的性质。

     

    全球电子组装焊接市场规模按产品细分。根据产品,市场分为焊丝、焊膏、助焊剂、焊条和其他。按地区,电子组装焊接市场分为北美、欧洲、亚太地区 (APAC)、中东和非洲 (MEA) 和南美 (SAM)。

    GENMA Europe GmbH、Indium Corporation、Fusion Incorporated、AIM Metals & Alloys LP 和 MacDermid Alpha Electronics Solutions 是全球电子组装市场的主要焊接参与者。

    电子组装焊接市场参与者主要致力于开发先进、高效的产品。

    • 2021年,电子制造服务提供商“富士康科技集团”和半导体公司“联发科”宣布合作开发用于智能制造 和工业4.0应用的新型5G解决方案。此次合作可能会为焊接电子行业带来新的进步。
    • 2020 年,焊接设备制造商“Metcal”与电子产品分销商“Farnell”合作,扩大其产品供应并在欧洲吸引新客户。

    Soldering in Electronics Assembly Market Report Scope

    Report Attribute Details
    Market size in US$ 2 Billion
    Market Size by US$ 2.62 Billion
    Global CAGR 5.6%
    Historical Data 2021-2022
    Forecast period 2024-2028
    Segments Covered By 产品(线材、焊膏、棒材、焊剂及其他)
    Regions and Countries Covered 北美(美国、加拿大、墨西哥)
    • 北美(美国、加拿大、墨西哥)
    欧洲(英国、德国、法国、俄罗斯、意大利、欧洲其他地区)
    • 欧洲(英国、德国、法国、俄罗斯、意大利、欧洲其他地区)
    亚太地区(中国、印度、日本、澳大利亚、亚太地区其他地区)
    • 亚太地区(中国、印度、日本、澳大利亚、亚太地区其他地区)
    南美洲和中美洲(巴西、阿根廷、南美洲和中美洲其他地区)
    • 南美洲和中美洲(巴西、阿根廷、南美洲和中美洲其他地区)
    中东和非洲(南非、沙特阿拉伯、阿联酋、中东和非洲其他地区)
    • 中东和非洲(南非、沙特阿拉伯、阿联酋、中东和非洲其他地区)
    Market leaders and key company profiles
  • Lucas Milhaupt Inc
  • GENMA Europe GmbH
  • S Bond Technology
  • Fusion Incorporated
  • Indium Corporation
  • KOKI Company Ltd
  • SUPERIOR FLUX MFG CO
  • MacDermid Alpha Electronics Solutions
  • Nathan Trotter Co Inc
  • Report Coverage
    Report Coverage

    Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends

    Segment Covered
    Segment Covered

    This text is related
    to segments covered.

    Regional Scope
    Regional Scope

    North America, Europe, Asia Pacific, Middle East & Africa, South & Central America

    Country Scope
    Country Scope

    This text is related
    to country scope.

    Frequently Asked Questions


    Which are the key players holding the major market share of soldering in electronics assembly market?

    The key players of soldering in electronics assembly market are encompassed with GENMA Europe GmbH, Indium Corporation, Fusion Incorporated, AIM Metals & Alloys LP, and MacDermid Alpha Electronics Solutions.

    What is the estimated global market size for the soldering in electronics assembly market in 2023?

    The global soldering in electronics assembly market was valued at US$ 2,001.96 Mn in 2023

    Based on product segment, which is the leading method in the soldering in electronics assembly market?

    The wire segment led the global soldering in electronics assembly market in 2022.

    What are the driving factors impacting the global soldering in electronics assembly market?

    The key driving factors impacting soldering in electronics assembly market growth includes:
    • Growth of Electronic Industry
    • New Product Developments

    Which countries are registering a high growth rate during the forecast period?

    The US, the UK, India, the UAE, Brazil are the countries registering high growth rate during the forecast period.

    Which is the fastest growing regional market during the forecast period?

    APAC is the fastest-growing regional market in the global soldering in electronics assembly market between 2023-2028.

    The List of Companies - Soldering in Electronics Assembly Market

    1. Lucas-Milhaupt, Inc
    2. GENMA Europe GmbH
    3. S-Bond Technology
    4. Fusion Incorporated
    5. Indium Corporation
    6. KOKI Company Ltd
    7. SUPERIOR FLUX & MFG. CO.
    8. MacDermid Alpha Electronics Solutions
    9. Nathan Trotter & Co., Inc.
    10. AIM Metals & Alloys LP

    The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.

    1. Data Collection and Secondary Research:

    As a market research and consulting firm operating from a decade, we have published and advised several client across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.

    Several associations trade associates, technical forums, institutes, societies and organization are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in last 3 years are scrutinized and analyzed to understand the current market trends.

    1. Primary Research:

    The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.

    For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.

    A typical research interview fulfils the following functions:

    • Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
    • Validates and strengthens in-house secondary research findings
    • Develops the analysis team’s expertise and market understanding

    Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:

    • Industry participants: VPs, business development managers, market intelligence managers and national sales managers
    • Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.

    Below is the breakup of our primary respondents by company, designation, and region:

    Research Methodology

    Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.

    1. Data Analysis:

    Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.

    • Macro-Economic Factor Analysis:

    We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.

    • Country Level Data:

    Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.

    • Company Profile:

    The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.

    • Developing Base Number:

    Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.

    1. Data Triangulation and Final Review:

    The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.

    We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.

    We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.

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