系统级封装 (SiP) 技术市场基于(主要区域、市场参与者、规模和份额)- 预测至 2031 年

  • Report Code : TIPRE00005443
  • Category : Electronics and Semiconductor
  • No. of Pages : 150
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系统级封装 (SiP) 技术市场规模预计将从 2023 年的 153.6 亿美元增至 2031 年的 352.0 亿美元。预计 2023-2031 年市场复合年增长率将达到 10.9%。对电子产品小型化日益增长的需求可能仍是系统级封装 (SiP) 技术市场的一个关键趋势。

 

系统级封装 (SiP) 技术市场分析

据预测,5G 网络连接设备的推出、对具有互联网连接的小型电子设备的需求增加以及物联网 (IoT) 设备的普及将推动全球系统级封装 (SiP) 技术业务的增长。此外,由于智能手机和智能可穿戴设备的使用日益增多,该行业正在发展。然而,更高的集成度可能会导致热问题,这是一个重大的市场制约因素。相反,预计亚太地区的强劲需求将在整个预测时间内支持市场扩张。

 

系统级封装 (SiP) 技术市场概览

被称为“系统级封装”(SiP) 的封装技术将多个无源和电子子元件集成在一个基板上。系统级封装 (SiP) 技术的主要优势之一是它允许将具有多个芯片的 IC 封装与IC 封装内的有源系统或子系统相结合。预计系统级封装 (SiP) 技术的市场扩张将受到发展中国家(尤其是汽车领域)越来越多地采用 SiP 产品的推动。由于微电子设备对电路微型化的需求不断增长等因素,市场增长速度更快。此外,封装设计的最新趋势是系统化。

 

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系统级封装 (SiP) 技术市场:

System in Package (SiP) Technology Market
  • 获取此报告的关键市场趋势。
    这个免费样品将包括数据分析,从市场趋势到估计和预测。

 

系统级封装 (SiP) 技术市场驱动因素和机遇

不断发展的汽车行业

由于人们对化石燃料的敏感性日益增加,以及政府为清洁环境采取的措施不断增加,汽车行业,尤其​​是电动汽车行业将在预测期内经历增长。例如,在汽车行业,通用汽车等巨头计划在 2021 年推出自动驾驶汽车,而奥迪则与 Nvidia 合作开发了非人类监督汽车模型的功能。这款高度自动化的汽车的原型基于奥迪的 Q7 车型。SIP 技术用于智能和电动汽车的电子元件,例如电源模块(ADI µModules)、传感器(MEMS)、变速箱控制单元、车辆中央信息娱乐单元、单芯片模块等。因此,不断发展的汽车行业正在推动系统级封装 (SiP) 技术市场的增长。

 

射频元件在开发先进 5G 基础设施中的潜在用途

未来五年,由于支持高带宽的设备不断涌现,无线网络将出现严重拥堵。这将加速从目前的 3G 和 4G LTE 技术向 5G 的过渡。预计 5G 技术将实现比目前的 4G 和 3G 数据速率快得多的聚合数据速率。

预计到 2021 年,包括美国、日本、韩国、英国、德国和中国在内的多个重要国家都将实施 5​​G 技术。预计这将导致移动用户数量大幅增加,需要开发能够处理用户数据需求的基础设施。因此,为了传输更多数据,需要基于 SiP 的 RF 组件数量将会增加。因此,在预测期内,RF 组件在开发先进 5G 基础设施方面的潜在用途预计将为系统级封装 (SiP) 技术市场参与者带来新的机会。

 

系统级封装 (SiP) 技术市场报告细分分析

有助于得出系统级封装 (SiP) 技术市场分析的关键部分是封装技术、封装类型、互连技术和最终用途行业。

  • 根据封装技术,系统级封装(SiP)技术市场分为2D IC、2.5D IC和3D IC。
  • 根据封装类型,市场分为倒装芯片、引线键合和扇出晶圆级封装。
  • 根据互连技术,市场分为小外形、扁平封装、针栅阵列、表面贴装和其他。
  • 根据最终用途行业,系统级封装 (SiP) 技术市场分为汽车、航空航天和国防、消费电子、电信等。

系统级封装 (SiP) 技术市场份额(按地区)分析

系统级封装 (SiP) 技术市场报告的地理范围主要分为五个区域:北美、亚太、欧洲、中东和非洲以及南美/南美和中美。就收入而言,亚太地区占据了系统级封装 (SiP) 技术最大的市场份额。这归因于中国、印度和韩国等新兴经济国家的需求激增。 

 

 

系统级封装 (SiP) 技术市场区域洞察

Insight Partners 的分析师已详细解释了预测期内影响系统级封装 (SiP) 技术市场的区域趋势和因素。本节还讨论了北美、欧洲、亚太地区、中东和非洲以及南美和中美洲的系统级封装 (SiP) 技术市场细分和地理位置。

System in Package (SiP) Technology Market
  • 获取系统级封装 (SiP) 技术市场的区域特定数据

系统级封装 (SiP) 技术市场报告范围

报告属性细节
2023 年的市场规模153.6亿美元
2031 年市场规模352亿美元
全球复合年增长率(2023 - 2031)10.9%
史料2021-2022
预测期2024-2031
涵盖的领域按封装技术
  • 二维集成电路
  • 2.5D 集成电路
  • 3D 集成电路
按包装类型
  • 倒装芯片/引线键合 SiP
  • 扇出型 SiP
  • 嵌入式 SiP
按互连技术
  • 小轮廓
  • 扁平封装
  • 针栅阵列
  • 表面贴装
按最终用户行业
  • 汽车
  • 航空航天和国防
  • 消费电子产品
  • 电信
覆盖地区和国家北美
  • 我们
  • 加拿大
  • 墨西哥
欧洲
  • 英国
  • 德国
  • 法国
  • 俄罗斯
  • 意大利
  • 欧洲其他地区
亚太
  • 中国
  • 印度
  • 日本
  • 澳大利亚
  • 亚太其他地区
南美洲和中美洲
  • 巴西
  • 阿根廷
  • 南美洲和中美洲其他地区
中东和非洲
  • 南非
  • 沙特阿拉伯
  • 阿联酋
  • 中东和非洲其他地区
市场领导者和主要公司简介
  • 日月光集团
  • Amkor科技有限公司
  • 宏茂科技股份有限公司
  • 富士通有限公司
  • GS 纳米技术
  • 长电科技集团股份有限公司
  • 高通技术公司
  • 瑞萨电子公司
  • 三星电子有限公司
  • 德州仪器公司

市场参与者密度:了解其对商业动态的影响

系统级封装 (SiP) 技术市场正在快速增长,这得益于终端用户需求的不断增长,而这些需求又源于消费者偏好的不断变化、技术进步以及对产品优势的认识不断提高等因素。随着需求的增加,企业正在扩大其产品范围,进行创新以满足消费者的需求,并利用新兴趋势,从而进一步推动市场增长。

市场参与者密度是指在特定市场或行业内运营的企业或公司的分布情况。它表明在给定市场空间中,相对于其规模或总市场价值,有多少竞争对手(市场参与者)存在。

系统封装 (SiP) 技术市场的主要公司有:

  1. 日月光集团
  2. Amkor科技有限公司
  3. 宏茂科技股份有限公司
  4. 富士通有限公司
  5. GS 纳米技术
  6. 长电科技集团股份有限公司

免责声明上面列出的公司没有按照任何特定顺序排列。


System in Package (SiP) Technology Market

 

  • 获取系统级封装 (SiP) 技术市场主要参与者概览

 

系统级封装 (SiP) 技术市场新闻和最新发展

系统级封装 (SiP) 技术市场通过收集一级和二级研究后的定性和定量数据进行评估,其中包括重要的公司出版物、协会数据和数据库。以下是言语和语言障碍市场的发展和策略列表:

  • 2023 年 3 月,Octavo Systems 推出的 OSD62x 系列系统级芯片 (Sip) 产品有助于增强边缘和小型嵌入式处理的性能,以用于下一代应用。德州仪器 (Tl) AM623 和 AM625 处理器是 OSD62x 系列的基础。

(来源:Octavo Systems,新闻稿)

 

系统级封装 (SiP) 技术市场报告覆盖范围和交付成果

“系统级封装 (SiP) 技术市场规模和预测(2021-2031)”报告对以下领域进行了详细的市场分析:

  • 范围内所有主要细分市场的全球、区域和国家层面的市场规模和预测
  • 市场动态,如驱动因素、限制因素和关键机遇
  • 未来主要趋势
  • 详细的 PEST/波特五力分析和 SWOT 分析
  • 全球和区域市场分析涵盖关键市场趋势、主要参与者、法规和最新市场发展
  • 行业格局和竞争分析,涵盖市场集中度、热点图分析、知名参与者和最新发展
  • 详细的公司简介
  • Historical Analysis (2 Years), Base Year, Forecast (7 Years) with CAGR
  • PEST and SWOT Analysis
  • Market Size Value / Volume - Global, Regional, Country
  • Industry and Competitive Landscape
  • Excel Dataset
Report Coverage
Report Coverage

Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends

Segment Covered
Segment Covered

This text is related
to segments covered.

Regional Scope
Regional Scope

North America, Europe, Asia Pacific, Middle East & Africa, South & Central America

Country Scope
Country Scope

This text is related
to country scope.

Frequently Asked Questions


What is the estimated market size for the global System in Package (SiP) technology market in 2023?

The global System in Package (SiP) technology market was estimated to be US$ 15.36 billion in 2023 and is expected to grow at a CAGR of 10.9 % during the forecast period 2023 - 2031.

What are the driving factors impacting the global System in Package (SiP) technology market?

The growing automotive industry and the potential use of RF components in developing advanced 5g infrastructure are the major factors that propel the global System in Package (SiP) technology market.

What are the future trends of the global System in Package (SiP) technology market?

The growing demand for the miniaturization of electronics is anticipated to play a significant role in the global System in Package (SiP) technology market in the coming years.

Which are the key players holding the major market share of the global System in Package (SiP) technology market?

The key players holding majority shares in the global System in Package (SiP) technology market are ASE Group, Amkor Technology, Inc., ChipMOS TECHNOLOGIES INC., Fujitsu Ltd., and GS Nanotech.

What will be the market size of the global System in Package (SiP) technology market by 2031?

The global System in Package (SiP) technology market is expected to reach US$ 35.20 billion by 2031.

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The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.

  1. Data Collection and Secondary Research:

As a market research and consulting firm operating from a decade, we have published and advised several client across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.

Several associations trade associates, technical forums, institutes, societies and organization are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in last 3 years are scrutinized and analyzed to understand the current market trends.

  1. Primary Research:

The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.

For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.

A typical research interview fulfils the following functions:

  • Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
  • Validates and strengthens in-house secondary research findings
  • Develops the analysis team’s expertise and market understanding

Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:

  • Industry participants: VPs, business development managers, market intelligence managers and national sales managers
  • Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.

Below is the breakup of our primary respondents by company, designation, and region:

Research Methodology

Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.

  1. Data Analysis:

Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.

  • Macro-Economic Factor Analysis:

We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.

  • Country Level Data:

Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.

  • Company Profile:

The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.

  • Developing Base Number:

Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.

  1. Data Triangulation and Final Review:

The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.

We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.

We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.