The APAC SiP technology market is expected to grow from US$ 6,843.3 million in 2019 to US$ 9,881.8 million by 2027; it is estimated to grow at a CAGR of 7.0% from 2020 to 2027.
Australia, China, India, Japan, and South Korea are major economies in APAC. Growing need of smartphone and PC is going to enhance the performance and this is the major factor driving the APAC SiP technology market. The system in package technology has huge opportunity in the smartphone and PC market to offers advanced processors, transmitters and other components. Technology is improving the device performance as well as offering better space utilization solution. Few market players are developing the processors and other components using the system in packaging technology, while for others its great opportunity to innovate new solution for smartphone and PC processors. For instance, March, 2019, Asus, one of the leading smartphone brands in APAC market introduced new ZenFone Max Shot and ZenFone Max Plus M2 smartphones equipped with Qualcomm's new Snapdragon SiP1 chip. Similarly, in December, 2019, Qualcomm developed new arm-based processors for notebooks using the SE Technology’s system-in-package (SiP) services. Such development in the SiP offering in smartphone and PC applications clearly shows the potential opportunity for the market. Rising consumption of smartphones is major supporting factor for the SiP technology market for which market players needs to provide more focus. As according to the Ericsson, there are almost 4 billion mobile connections in APAC for year 2016, which are expected rise to 4.6 billion by 2021. Such increasing demand in APAC region only shows the potential for SiP technology in Smartphone industry.The COVID-19 outbreak was first reported in China. China, India, South Korea, Japan, and other countries are increasingly moving toward the new networking solution such as 5G, 4G, and VoLTE. China and India are the biggest manufacturing hubs in the region and have increasing focus toward the industrialization. Lockdown, imposed due to COVID-19 outbreak, is hindering the market growth as businesses are remaining close. Manufacturing industry is also hampered, but soon its growth is expected to get recovered by enhancing the production capabilities in second half of the year 2021. The demand for many advanced electronics products such as smartwatch, smart wearable, and healthcare machines is rising at the significant rate. Companies in Asia are also restructuring their capabilities by adopting various strategies such as automation, partnership, and acquisition. For instance, Universal Scientific Industrial (Shanghai) Co., Ltd. acquired the Asteelflash Group to utilize their production facilities for increasing production of SiP modules and other electronics devices.
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APAC SiP Technology Market Segmentation
APAC SiP Technology Market – By Packaging Technology
- 2D IC
- 2.5D IC
- 3D IC
APAC SiP Technology Market – By Packaging Type
- Flip-Chip/Wire-Bond SiP
- Fan-Out SiP
- Embedded SiP
APAC SiP Technology Market – By Interconnection Technique
- Small Outline
- Flat Packages
- Pin Grid Arrays
- Surface Mount
- Others
APAC SiP Technology Market – By End-User Industry
- Automotive
- Aerospace and Defense
- Consumer Electronics
- Telecommunication
- Others
APAC SiP Technology Market, by Country
- Australia
- China
- India
- Japan
- South Korea
- Rest of APAC
APAC SiP Technology Market - Companies Mentioned
- Amkor Technology, Inc.
- ASE Technology Holding Co., Ltd.
- ChipMOS TECHNOLOGIES INC.
- JCET Group Co., Ltd.
- Qualcomm Technologies, Inc.
- Renesas Electronics Corporation
- Samsung
- Taiwan Semiconductor Manufacturing Company, Limited
- Texas Instruments Incorporated
Report Coverage
Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends
Segment Covered
Packaging Technology, Packaging Type, Interconnection technique, and End-User Industry
Regional Scope
North America, Europe, Asia Pacific, Middle East & Africa, South & Central America
Country Scope
Australia, China, Japan, South Korea
TABLE OF CONTENTS
1. Introduction
1.1 Scope of the Study
1.2 The Insight Partners Research Report Guidance
1.3 Market Segmentation
1.3.1 APAC System in Package (SiP) Technology Market – By Packaging Technology
1.3.2 APAC System in Package (SiP) Technology Market – By Packaging Type
1.3.3 APAC System in Package (SiP) Technology Market – By Interconnection Technology
1.3.4 APAC System in Package (SiP) Technology Market – By End-User Industry
1.3.5 APAC System in Package (SiP) Technology Market – By Country
2. Key Takeaways
3. Research Methodology
3.1 Coverage
3.2 Secondary Research
3.3 Primary Research
4. APAC SiP Technology – Market Landscape
4.1 Market Overview
4.2 APAC PEST Analysis
4.3 Ecosystem Analysis
5. APAC SiP Technology –Market Dynamics
5.1 Key Market Drivers
5.1.1 Miniaturization of Electronic Devices Witnessing High Demand
5.1.2 Increase in Network 5G Network Services Growth
5.2 Key Market Restraints
5.2.1 Technical Problems and Presence of Substitutes
5.3 Key Market Opportunities
5.3.1 Growing Need of Smartphone and PC to Enhance the performance
5.4 Future Trends
5.4.1 Wearable technology and IoT Expecting Substantial Growth
5.5 Impact Analysis of Drivers and Restraints
6. SiP Technology Market – APAC Analysis
6.1 APAC System in Package (SiP) Technology Market Overview
6.2 APAC System in Package (SiP) Technology Market Revenue Forecast and Analysis
6.3 Market Positioning – Five Key Players
7. APAC SiP Technology Market Analysis – by Packaging Technology
7.1 Overview
7.2 APAC SiP Technology Market Breakdown, by packaging technology, 2019 & 2027
7.3 2D IC
7.3.1 Overview
7.3.2 2D IC Market Forecast and Analysis
7.4 2.5D IC
7.4.1 Overview
7.4.2 2.5D IC Market Forecast and Analysis
7.5 3D IC
7.5.1 Overview
7.5.2 3D IC Market Forecast and Analysis
8. APAC SiP Technology Market Analysis – Packaging Type
8.1 Overview
8.2 APAC SiP Technology Market Breakdown, By Packaging Type, 2019 &2027
8.3 Flip-Chip/Wire-Bond SiP Market
8.3.1 Overview
8.3.2 Flip-Chip/Wire-Bond SiP Market Forecast and Analysis
8.4 Fan-Out SiP Market
8.4.1 Overview
8.4.2 Fan-Out SiP Market Forecast and Analysis
8.5 Embedded SiP Market
8.5.1 Overview
8.5.2 Embedded SiP Market Forecast and Analysis
9. APAC SiP Technology Market Analysis – By Interconnection Technique
9.1 Overview
9.2 APAC SiP technology Market Breakdown, By Interconnection Technique, 2019 &2027
9.3 Small Outline
9.3.1 Overview
9.3.2 Small Outline Market Forecast and Analysis
9.4 Flat Packages
9.4.1 Overview
9.4.2 Flat Packages Market Forecast and Analysis
9.5 Pin Grid Arrays
9.5.1 Overview
9.5.2 Pin Grid Arrays Market Forecast and Analysis
9.6 Surface Mount
9.6.1 Overview
9.6.2 Surface Mount Market Forecast and Analysis
9.7 Others
9.7.1 Overview
9.7.2 Others Market Forecast and Analysis
10. APAC SiP Technology Market Analysis – By End-User Industry
10.1 Overview
10.2 APAC SiP technology Market Breakdown, By END-USER INDUSTRY, 2019 & 2027
10.3 Automotive
10.3.1 Overview
10.3.2 Automotive Market Forecast and Analysis
10.4 Aerospace & Defense
10.4.1 Overview
10.4.2 Aerospace and Defense Market Forecast and Analysis
10.5 Consumer Electronics
10.5.1 Overview
10.5.2 Consumer Electronics
10.6 Telecommunications
10.6.1 Overview
10.6.2 Telecommunication Market Forecast and Analysis
10.7 Others
10.7.1 Overview
10.7.2 Others Market Forecast and Analysis
11. APAC SiP Technology Market – Country Analysis
11.1 Overview
11.1.1 APAC: SiP technology Market, By Country
11.1.2 China SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)
11.1.2.1 China System in Package (SiP) Technology Market, by Packaging Technology
11.1.2.2 China System in Package (SiP) Technology Market, by Packaging Type
11.1.2.3 China System in Package (SiP) Technology Market, by Interconnection Technology
11.1.2.4 China System in Package (SiP) Technology Market, by End-User Industry
11.1.3 Japan SiP Technology Market Revenue and Forecast to 2027 (US$ million)
11.1.3.1 Japan System in Package (SiP) Technology Market, by Packaging Technology
11.1.3.2 Japan System in Package (SiP) Technology Market, by Packaging
11.1.3.3 Japan System in Package (SiP) Technology Market, by Interconnection Technology
11.1.3.4 Japan System in Package (SiP) Technology Market, by End-user Industry
11.1.4 Australia SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)
11.1.4.1 Australia System in Package (SiP) Technology Market, by Packaging Technology
11.1.4.2 Australia System in Package (SiP) Technology Market, by Packaging Type
11.1.4.3 Australia System in Package (SiP) Technology Market, by Interconnection Technology
11.1.4.4 Australia System in Package (SiP) Technology Market, by End-user Industry
11.1.5 India SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
11.1.5.1 India System in Package (SiP) Technology Market, by Packaging Technology
11.1.5.2 India System in Package (SiP) Technology Market, by Packaging Type
11.1.5.3 India System in Package (SiP) Technology Market, by Interconnection Technology
11.1.5.4 India System in Package (SiP) Technology Market, by End-User Industry
11.1.6 South Korea SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
11.1.6.1 South Korea System in Package (SiP) Technology Market, by Packaging Technogym
11.1.6.2 South Korea System in Package (SiP) Technology Market, by Packaging Type
11.1.6.3 South Korea System in Package (SiP) Technology Market, by Interconnection Technology
11.1.6.4 South Korea System in Package (SiP) Technology Market, by End-user Industry
11.1.7 Rest of APAC SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
11.1.7.1 Rest of APAC System in Package (SiP) Technology Market, by Packaging Technology
11.1.7.2 Rest of APAC System in Package (SiP) Technology Market, by Packaging
11.1.7.3 Rest of APAC System in Package (SiP) Technology Market, by Interconnection Technology
11.1.7.4 Rest of APAC System in Package (SiP) Technology Market, by End-user Industry
12. APAC SiP Technology Market - COVID-19 Impact Analysis
12.1 APAC: Impact Assessment of COVID-19 Pandemic
13. Industry Landscape
13.1 Overview
13.2 Market Initiative
14. Company Profiles
14.1 Amkor Technology, Inc.
14.1.1 Key Facts
14.1.2 Business Description
14.1.3 Products and Services
14.1.4 Financial Overview
14.1.5 SWOT Analysis
14.1.6 Key Developments
14.2 ASE Technology Holding Co. Ltd
14.2.1 Key Facts
14.2.2 Business Description
14.2.3 Products and Services
14.2.4 Financial Overview
14.2.5 SWOT Analysis
14.2.6 Key Developments
14.3 ChipMOS TECHNOLOGIES INC.
14.3.1 Key Facts
14.3.2 Business Description
14.3.3 Products and Services
14.3.4 Financial Overview
14.3.5 SWOT Analysis
14.3.6 Key Developments
14.4 JCET Group Co., Ltd.
14.4.1 Key Facts
14.4.2 Business Description
14.4.3 Products and Services
14.4.4 SWOT Analysis
14.4.5 Key Developments
14.5 QUALCOMM INCORPORATED
14.5.1 Key Facts
14.5.2 Business Description
14.5.3 Products and Services
14.5.4 Financial Overview
14.5.5 SWOT Analysis
14.5.6 Key Developments
14.6 Samsung
14.6.1 Key Facts
14.6.2 Business Description
14.6.3 Products and Services
14.6.4 Financial Overview
14.6.5 SWOT Analysis
14.6.6 Key Developments
14.7 Renesas Electronics Corporation
14.7.1 Key Facts
14.7.2 Business Description
14.7.3 Products and Services
14.7.4 Financial Overview
14.7.5 SWOT Analysis
14.7.6 Key Developments
14.8 Texas Instruments Incorporated
14.8.1 Key Facts
14.8.2 Business Description
14.8.3 Products and Services
14.8.4 Financial Overview
14.8.5 SWOT Analysis
14.8.6 Key Developments
14.9 Taiwan Semiconductor Manufacturing Company, Limited
14.9.1 Key Facts
14.9.2 Business Description
14.9.3 Products and Services
14.9.4 Financial Overview
14.9.5 SWOT Analysis
14.9.6 Key Developments
15. Appendix
15.1 About The Insight Partners
15.2 Glossary of TermsLIST OF TABLES
Table 1. APAC System in Package (SiP) Technology Market Revenue and Forecasts to 2027 (US$ Million)
Table 2. China System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 3. China System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 4. China System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 5. China System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 6. Japan System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 7. Japan System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 8. Japan System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 9. Japan System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 10. Australia System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 11. Australia System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 12. Australia System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 13. Australia System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 14. India System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 15. India System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 16. India System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 17. India System in Package (SiP) Technology Market, by End-User Industry – Revenue and Forecast to 2027 (USD Million)
Table 18. South Korea System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 19. South Korea System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 20. South Korea System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 21. South Korea System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 22. Rest of APAC System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 23. Rest of APAC System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 24. Rest of APAC System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 25. Rest of APAC System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 26. Glossary of TermsLIST OF FIGURES
Figure 1. APAC System in Package (SiP) Technology Market Segmentation
Figure 2. APAC System in Package (SiP) Technology Market Segmentation - Country
Figure 3. APAC System in Package (SiP) Technology Market Overview
Figure 4. China Held the Largest Share in APAC System in Package (SiP) Technology Market in 2019
Figure 5. APAC System in Package (SiP) Technology Market, By Packaging Technology
Figure 6. APAC System in Package (SiP) Technology Market, By Packaging Type
Figure 7. APAC System in Package (SiP) Technology Market, By Interconnection Technology
Figure 8. APAC System in Package (SiP) Technology Market, By End-User Industry
Figure 9. APAC: PEST Analysis
Figure 10. APAC System in package (SiP) technology Market- Ecosystem Analysis
Figure 11. APAC System in package (SiP) technology Market Impact Analysis of Drivers and Restraints
Figure 12. APAC System in Package (SiP) Technology Market Revenue Forecast and Analysis, (US$ Million)
Figure 13. APAC SiP technology Market Breakdown, by packaging technology, 2019 & 2027 (%)
Figure 14. APAC 2D IC Market Revenue and Forecast to 2027 (US$ Mn)
Figure 15. APAC 2.5D IC Market Revenue and Forecast to 2027 (US$ Mn)
Figure 16. APAC 3D IC Market Revenue and Forecast to 2027 (US$ Mn)
Figure 17. APAC SiP Technology Market Breakdown, By Packaging Type, 2019 & 2027 (%)
Figure 18. APAC Flip-Chip/ Wire-Bond Sip Market Revenue and Forecast to 2027 (US$ MN)
Figure 19. APAC Fan-Out SiP Market Revenue and Forecast to 2027 (US$ Mn)
Figure 20. APAC Embedded SiP Market Revenue and Forecast to 2027 (US$ Mn)
Figure 21. APAC SiP Technology Market Breakdown, By Interconnection Technique, 2019 &2027 (%)
Figure 22. APAC Small Outline Market Revenue and Forecast to 2027 (US$ Mn)
Figure 23. APAC Flat Packages Market Revenue and Forecast to 2027 (US$ Mn)
Figure 24. APAC Pin Grid Arrays Market Revenue and Forecast to 2027 (US$ Mn)
Figure 25. APAC Surface Mount Market Revenue and Forecast to 2027 (US$ Mn)
Figure 26. APAC Others Market Revenue and Forecast to 2027 (US$ Mn)
Figure 27. APAC SiP Technology Market Breakdown, By END-USER INDUSTRY, 2019 & 2027 (%)
Figure 28. APAC Automotive Market Revenue and Forecast to 2027 (US$ Mn)
Figure 29. APAC Aerospace and Defense Market Revenue and Forecast to 2027 (US$ Mn)
Figure 30. APAC Consumer Electronics Market Revenue and Forecast to 2027 (US$ Mn)
Figure 31. APAC Telecommunication Market Revenue and Forecast to 2027 (US$ Mn)
Figure 32. APAC Others Market Revenue and Forecast to 2027 (US$ Mn)
Figure 33. APAC SiP Technology Market Revenue Share, By Country (2019 and 2027)
Figure 34. China SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)
Figure 35. Japan SiP Technology Market Revenue and Forecast to 2027 (US$ million)
Figure 36. Australia SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)
Figure 37. India SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
Figure 38. South Korea SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
Figure 39. Rest of APAC SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
Figure 40. Impact of COVID-19 Pandemic in APAC Country MarketsSome of the leading companies are:
- Amkor Technology, Inc.
- ASE Technology Holding Co., Ltd.
- ChipMOS TECHNOLOGIES INC.
- JCET Group Co., Ltd.
- Qualcomm Technologies, Inc.
- Renesas Electronics Corporation
- Samsung
- Taiwan Semiconductor Manufacturing Company, Limited
- Texas Instruments Incorporated
The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.
- Data Collection and Secondary Research:
As a market research and consulting firm operating from a decade, we have published many reports and advised several clients across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.
Several associations trade associates, technical forums, institutes, societies and organizations are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in the last 3 years are scrutinized and analyzed to understand the current market trends.
- Primary Research:
The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.
For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/Sales Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.
A typical research interview fulfils the following functions:
- Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
- Validates and strengthens in-house secondary research findings
- Develops the analysis team’s expertise and market understanding
Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:
- Industry participants: VPs, business development managers, market intelligence managers and national sales managers
- Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.
Below is the breakup of our primary respondents by company, designation, and region:
Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.
- Data Analysis:
Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.
- 3.1 Macro-Economic Factor Analysis:
We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.
- 3.2 Country Level Data:
Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.
- 3.3 Company Profile:
The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.
- 3.4 Developing Base Number:
Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.
- Data Triangulation and Final Review:
The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.
We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.
We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.
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